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    • 56. 发明申请
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US20060049459A1
    • 2006-03-09
    • US11250464
    • 2005-10-17
    • Satoshi AidaShigeo KouzukiMasaru IzumisawaHironori Yoshioka
    • Satoshi AidaShigeo KouzukiMasaru IzumisawaHironori Yoshioka
    • H01L29/76
    • H01L29/7811H01L29/402H01L29/456H01L29/66712H01L29/7802H01L29/7813
    • A semiconductor device includes: a semiconductor substrate of a first conductivity type; a drift layer of a first conductivity type formed on a first main surface of the semiconductor substrate, a surface of the drift layer having a first area and a second area which is positioned on an outer periphery of the first area; a cell portion which is formed in the first area of the drift layer and includes a first base layer of a second conductivity type selectively formed in a surface layer of the first area, a source layer of a first conductivity type selectively formed in a surface layer of the first base layer, a first metallic compound which is formed on the surface layer of the first base layer and a surface layer of the source layer in common, and a control electrode which is formed in the first base layer and the source layer via a first insulating film and has a second metallic compound formed on a top surface thereof; a terminating portion which is formed in the second area of the drift layer, alleviates an electric field to maintain a breakdown voltage by extending a depletion layer, and includes a second base layer of a second conductivity type selectively formed in a surface layer in the second area of the drift layer, an impurity diffused layer of a second conductivity type formed in a surface layer of the second base layer, and a third metallic compound which is provided to a surface layer of the impurity diffused layer, an end surface thereof on the terminating portion side being positioned on the cell portion side away from an end surface of the impurity diffused layer on the terminating portion side; a first main electrode formed so as to be in contact with the first metallic compound and the third metallic compound in common; and a second main electrode formed on a second main surface opposite to the first main surface of the semiconductor substrate.
    • 半导体器件包括:第一导电类型的半导体衬底; 形成在所述半导体衬底的第一主表面上的第一导电类型的漂移层,所述漂移层的表面具有位于所述第一区域的外周上的第一区域和第二区域; 形成在所述漂移层的所述第一区域中并且包括选择性地形成在所述第一区域的表面层中的第二导电类型的第一基底层的单元部分,选择性地形成在表面层中的第一导电类型的源极层 的第一基底层,形成在第一基底层的表面层和共同的源极层的表面层的第一金属化合物以及形成在第一基底层和源极层中的控制电极 第一绝缘膜,并且在其顶表面上形成有第二金属化合物; 形成在漂移层的第二区域中的端接部分通过延伸耗尽层来减轻电场以维持击穿电压,并且包括选择性地形成在第二导电类型的表面层中的第二导电类型的第二基极层 漂移层的面积,形成在第二基底层的表面层中的第二导电类型的杂质扩散层,以及设置在杂质扩散层的表面层上的第三金属化合物, 终端部分侧位于所述单元部分侧,远离所述端接部分侧的所述杂质扩散层的端表面; 形成为与第一金属化合物和第三金属化合物相接触的第一主电极; 以及形成在与所述半导体衬底的所述第一主表面相对的第二主表面上的第二主电极。
    • 58. 发明授权
    • Insulated gate semiconductor device
    • 绝缘栅半导体器件
    • US06930352B2
    • 2005-08-16
    • US10463613
    • 2003-06-18
    • Wataru SaitoIchiro OmuraSatoshi Aida
    • Wataru SaitoIchiro OmuraSatoshi Aida
    • H01L29/06H01L29/08H01L29/10H01L29/739H01L29/78H01L29/76
    • H01L29/7802H01L29/0634H01L29/0847H01L29/0878H01L29/1095H01L29/7397H01L29/7813
    • An insulated gate semiconductor device includes a control electrode having a trench type structure formed on the surface of a first semiconductor layer of a first conductivity type via a gate insulation film and disposed in a lattice shape, the control electrode having a plurality of first control electrode sections and a plurality of second control electrode sections which intersect with the plurality of first control electrode sections, respectively, and a plurality of fifth semiconductor layers of a second conductivity type which are provided on an interface of the first semiconductor layer in contact with the plurality of second control electrode sections, and connected to at least one of a plurality of second semiconductor layers of the second conductivity type, the fifth semiconductor layers having impurity concentration lower than that of the plurality of second semiconductor layers.
    • 一种绝缘栅半导体器件,包括:控制电极,具有通过栅极绝缘膜形成在第一导电类型的第一半导体层的表面上并且格栅形状的沟槽型结构,所述控制电极具有多个第一控制电极 分别与多个第一控制电极部分相交的多个第二控制电极部分和多个第二导电类型的第五半导体层,其设置在第一半导体层的与多个第一控制电极部分接触的界面上 的第二控制电极部分,并且连接到第二导电类型的多个第二半导体层中的至少一个,所述第五半导体层的杂质浓度低于多个第二半导体层的杂质浓度。