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    • 53. 发明申请
    • Highly integrated semiconductor device and method of fabricating the same
    • 高度集成的半导体器件及其制造方法
    • US20070111487A1
    • 2007-05-17
    • US11600719
    • 2006-11-17
    • Sung-Min KimEun-Jung Yun
    • Sung-Min KimEun-Jung Yun
    • H01L21/20
    • H01L27/24
    • A method of fabricating a semiconductor device includes sequentially forming a first pattern and a second pattern on a substrate, the second pattern being a non-single-crystalline semiconductor stacked on the first pattern, wherein a portion of the substrate is exposed adjacent to the first and second patterns, forming a non-single-crystalline semiconductor layer on the substrate, the semiconductor layer contacting the second pattern and the exposed portion of the substrate, and, using the substrate as a seed layer, changing the crystalline state of the semiconductor layer to be single-crystalline and changing the crystalline state of the second pattern to be single-crystalline.
    • 一种制造半导体器件的方法包括在衬底上顺序地形成第一图案和第二图案,第二图案是堆叠在第一图案上的非单晶半导体,其中衬底的一部分暴露在与第一图案相邻的第一图案 和第二图案,在衬底上形成非单晶半导体层,与第二图案接触的半导体层和衬底的暴露部分,并且使用衬底作为种子层,改变半导体层的结晶状态 为单晶,并将第二图案的结晶状态改变为单晶。
    • 58. 发明授权
    • Semiconductor trench isolation structure
    • 半导体沟槽隔离结构
    • US06914316B2
    • 2005-07-05
    • US10617742
    • 2003-07-14
    • Eun-Jung YunSung-Eui Kim
    • Eun-Jung YunSung-Eui Kim
    • H01L21/76H01L21/762H01L21/8242H01L29/00
    • H01L21/76229
    • A trench structure of a semiconductor device includes first and second regions of a substrate having first and second trenches, respectively, the first trench having an aspect ratio larger than that of the second trench, a first insulation material on a bottom and sidewalls of the first trench forming a first sub-trench in the first trench, a second insulation material completely filling the first sub-trench, a third insulation material formed on a bottom and sidewalls of the second trench forming a second sub-trench in the second trench, a fourth insulation material formed on a bottom and sidewalls of the second sub-trench, and a fifth insulation material completely filling a third sub-trench formed in the second sub-trench by the fourth insulation material.
    • 半导体器件的沟槽结构包括分别具有第一和第二沟槽的衬底的第一和第二区域,第一沟槽的纵横比分别大于第二沟槽的纵横比,第一绝缘材料位于第一和第二沟槽的底部和侧壁上 在所述第一沟槽中形成第一子沟槽的沟槽,完全填充所述第一子沟槽的第二绝缘材料,形成在所述第二沟槽的底部和侧壁上的第三绝缘材料,所述第二沟槽在所述第二沟槽中形成第二子沟槽, 第四绝缘材料形成在第二子沟槽的底部和侧壁上,第五绝缘材料通过第四绝缘材料完全填充形成在第二子沟槽中的第三子沟槽。