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    • 51. 发明授权
    • Method and apparatus for reviewing defect
    • 检查缺陷的方法和装置
    • US08045146B2
    • 2011-10-25
    • US12141955
    • 2008-06-19
    • Keiya SaitoYasuhiro YoshitakeShunichi MatsumotoHidetoshi Nishiyama
    • Keiya SaitoYasuhiro YoshitakeShunichi MatsumotoHidetoshi Nishiyama
    • G01N21/00G01J4/00
    • G01N21/8806G01N21/9501G01N2021/8822G01N2021/8861G02B21/0032G02B21/0072
    • The present invention provides an apparatus and a method for reviewing a defect with high throughput by detecting the defect to be reviewed with high sensitivity, comprising: an optical microscope; a correction means; and a scanning electron microscope which reviews the existing defect on the sample; wherein the optical microscope has: an optical height detection system which optically detects a vertical position of an upper surface of the sample placed on the stage; an illumination optical system which illuminates the defect with light; an image detection optical system which converges and detects reflected light or scattered light generated from the defect illuminated by the illumination optical system to obtain an image signal; and a focus adjusting means which adjusts a focus position of the optical microscope based on the vertical position of the upper surface of the sample, which is detected by the optical height detection system.
    • 本发明提供一种通过以高灵敏度检测待检查的缺陷来检查具有高通量的缺陷的装置和方法,包括:光学显微镜; 修正手段; 和扫描电子显微镜,用于回顾样品上现有的缺陷; 其中所述光学显微镜具有:光学高度检测系统,其光学地检测放置在所述台上的样品的上表面的垂直位置; 用光照亮缺陷的照明光学系统; 会聚和检测由照明光学系统照射的缺陷产生的反射光或散射光以获得图像信号的图像检测光学系统; 以及焦点调节装置,其基于由光学高度检测系统检测到的样本的上表面的垂直位置来调整光学显微镜的对焦位置。
    • 52. 发明申请
    • Adjustable Beam Size Illumination Optical Apparatus and Beam Size Adjusting Method
    • 可调节光束尺寸照明光学装置和光束尺寸调整方法
    • US20110228537A1
    • 2011-09-22
    • US13049089
    • 2011-03-16
    • Keiko YOSHIMIZUHiroshi AoyamaShigenobu MaruyamaYasuhiro Yoshitake
    • Keiko YOSHIMIZUHiroshi AoyamaShigenobu MaruyamaYasuhiro Yoshitake
    • F21V5/04
    • G02B27/0955
    • An adjustable beam size illumination optical apparatus includes a beam size adjusting optical system which includes groups of cylindrical array lenses disposed correspondingly to the long and short axis directions respectively and having variable intervals among the lenses, and a group of cylindrical telescope lenses disposed correspondingly to one of the long and short axis directions and having variable intervals among the lenses, and adjusts parallel light from a light source in size in accordance with the two axis directions orthogonal to each other. The lens interval of one of the cylindrical array lens groups and the cylindrical telescope lens group is changed to adjust a beam size on a projection surface in accordance with the long axis direction or the short axis direction. Thus, it is possible to adjust the beam size in accordance with the long axis direction and the short axis direction individually, and it is possible to make irradiation with the beam with uniform intensity.
    • 可调光束尺寸照明光学装置包括光束尺寸调整光学系统,该光束尺寸调整光学系统包括分别对应于长轴和短轴方向设置的圆柱形阵列透镜组,并且在透镜之间具有可变的间隔,以及一组圆柱形望远镜,其对应于一个 并且在透镜中具有可变的间隔,并且根据彼此正交的两个轴方向来调整来自光源的尺寸的平行光。 根据长轴方向或短轴方向,改变圆柱形阵列透镜组和圆柱形望远镜透镜组中的一个的透镜间隔,以调整投影表面上的光束尺寸。 因此,可以分别根据长轴方向和短轴方向调整光束尺寸,并且可以以均匀的强度对光束进行照射。
    • 54. 发明授权
    • Method and apparatus for inspecting a semiconductor device
    • 用于检查半导体器件的方法和装置
    • US07643140B2
    • 2010-01-05
    • US12046521
    • 2008-03-12
    • Taketo UenoYasuhiro Yoshitake
    • Taketo UenoYasuhiro Yoshitake
    • G01N21/00G01N21/88G06K9/00G06K9/32
    • G01N21/95607
    • A semiconductor defect inspection apparatus using a method of comparing an inspected image with a reference image includes the following: (1) a light source and an illuminating optical system, (2) plural defect optical imaging systems and photo detectors for scattered light detection, (3) a substrate holder and a stage for a scan, (4) means for obtaining the misalignment information on an adjacent die image using the inspection image of a defect optical imaging system with the highest spatial resolution, and means for transmitting the misalignment information to all the defect inspection image processing units, (5) means for correcting misalignment information so that a design and adjustment condition of each optical imaging system may be suited, and means for calculating a difference image between dies based on the corrected misalignment information, and (6) a defect detection and image processing unit for performing defect determination and detection processing based on the difference image between the dies.
    • 使用将检查图像与参考图像进行比较的方法的半导体缺陷检查装置包括:(1)光源和照明光学系统,(2)多个缺陷光学成像系统和用于散射光检测的光电检测器( 3)衬底保持器和用于扫描的台,(4)使用具有最高空间分辨率的缺陷光学成像系统的检查图像获得相邻裸片图像上的未对准信息的装置,以及用于将未对准信息发送到 所有缺陷检查图像处理单元,(5)用于校正未对准信息的装置,使得每个光学成像系统的设计和调整条件可能适合;以及用于基于校正的未对准信息计算管芯之间的差分图像的装置,以及( 6)一种用于基于该差异执行缺陷确定和检测处理的缺陷检测和图像处理单元 模具之间的图像。
    • 55. 发明授权
    • Dimension measuring SEM system, method of evaluating shape of circuit pattern and a system for carrying out the method
    • 尺寸测量SEM系统,电路图案形状评估方法和执行该方法的系统
    • US07449689B2
    • 2008-11-11
    • US11260082
    • 2005-10-28
    • Wataru NagatomoRyoichi MatsuokaTakumichi SutaniAkiyuki SugiyamaYasuhiro YoshitakeHideaki Sasazawa
    • Wataru NagatomoRyoichi MatsuokaTakumichi SutaniAkiyuki SugiyamaYasuhiro YoshitakeHideaki Sasazawa
    • G03F1/00G21K7/00
    • H01J37/28G03F1/36G03F1/68G03F7/70625H01J37/222H01J2237/24578H01J2237/24592H01J2237/2817
    • The present invention relates to a dimension measuring SEM system and a circuit pattern evaluating system capable of achieving accurate, minute OPC evaluation, the importance of which increase with the progressive miniaturization of design pattern of a circuit pattern for a semiconductor device, and a circuit pattern evaluating method. Design data and measured data on an image of a resist pattern formed by photolithography are superposed for the minute evaluation of differences between a design pattern defined by the design data and the image of the resist pattern, and one- or two-dimensional geometrical features representing differences between the design pattern and the resist pattern are calculated. In some cases, the shape of the resist pattern differs greatly from the design pattern due to OPE effect (optical proximity effect). To superpose the design data and the measured data on the resist pattern stably and accurately, an exposure simulator calculates a simulated pattern on the basis of photomask data on a photomask for an exposure process and exposure conditions and superposes the simulated pattern and the image of the resist pattern.
    • 本发明涉及一种尺寸测量SEM系统和电路图​​案评估系统,其能够实现精确的分钟OPC评估,其随着半导体器件的电路图案的设计图案的逐渐小型化以及电路图案的增加而增加的重要性 评估方法。 将通过光刻形成的抗蚀剂图案的图像上的设计数据和测量数据叠加以便对由设计数据定义的设计图案与抗蚀剂图案的图像之间的差异进行微小评估,以及表示一维或二维几何特征 计算设计图案和抗蚀剂图案之间的差异。 在某些情况下,由于OPE效应(光学邻近效应),抗蚀剂图案的形状与设计图案有很大的不同。 为了稳定准确地将设计数据和测量数据叠加在抗蚀剂图案上,曝光模拟器基于用于曝光处理和曝光条件的光掩模上的光掩模数据计算模拟图案,并将模拟图案和图像 抗蚀图案
    • 56. 发明申请
    • Defect inspection system
    • 缺陷检查系统
    • US20070053581A1
    • 2007-03-08
    • US11501815
    • 2006-08-10
    • Taketo UenoYasuhiro Yoshitake
    • Taketo UenoYasuhiro Yoshitake
    • G06K9/00
    • G01N21/9501G01N21/956G03F1/84G03F7/7065H01L21/67288
    • The present invention relates to a defect inspection system which can perform inspection condition setting easily in a relatively short period of time, can examine the inspection condition setting even when there is no sample, and further can provide an inspection condition and a defect signal intensity to a person, who sets the inspection condition, to assist the inspection condition setting. In the defect inspection system, a defective image, which is an inspection image, and a reference image corresponding thereto and a mismatched portion of the defective image and the reference image are digitalized as a defect signal intensity and accumulated in association with the inspection condition, and the inspection conditions are changed to repeat evaluations while repeating accumulating works until the evaluation of all the inspection conditions in a set range is completed. After all the evaluations are completed, if there are a plurality of defects to be inspected, the work is repeated by times corresponding to the number of kinds of the defects and a recipe file including the accumulated conditions having the high defect signal intensity and an inspection condition item distribution as a inspection condition recipe is automatically outputted and is provided to the person who sets the inspection condition. And, appearance inspection for detecting a pattern defect or a foreign material defect on a substrate is performed.
    • 本发明涉及一种能够在较短时间内容易进行检查条件设定的缺陷检查系统,即使没有样本也能够检查检查条件设定,并且还可以提供检查条件和缺陷信号强度 设定检查条件的人员,以协助检查条件设定。 在缺陷检查系统中,作为检查图像的缺陷图像和与其对应的参考图像和缺陷图像和参考图像的不匹配部分被数字化为缺陷信号强度并且与检查条件相关联地累积, 并且在重复累积工作的同时改变检查条件以重复评估,直到完成对设定范围内的所有检查条件的评估。 在完成所有评估之后,如果存在多个待检查的缺陷,则对与缺陷的种类数量相对应的次数和包括具有高缺陷信号强度和检查的累积条件的配方文件重复工作 条件项目分配作为检查条件配方自动输出,并提供给设置检查条件的人员。 并且,进行用于检测基板上的图案缺陷或异物缺陷的外观检查。
    • 58. 发明授权
    • Semiconductor device inspection and analysis method and its apparatus and a method for manufacturing a semiconductor device
    • 半导体装置检查分析方法及其装置及半导体装置的制造方法
    • US06281024B1
    • 2001-08-28
    • US09322149
    • 1999-05-28
    • Yasuhiro YoshitakeKenji WatanabeYoshimasa FukushimaMinori Noguchi
    • Yasuhiro YoshitakeKenji WatanabeYoshimasa FukushimaMinori Noguchi
    • H01L2100
    • H01L21/67253
    • A method and system for inspecting and/or analyzing semiconductor devices in which particles in a semiconductor wafer which is processed in a semiconductor device manufacturing line are detected. A particle is selected from among the detected particles and the selected particle is etched to expose a cross section of the selected particle. The selected particle whose cross section is exposed has the element thereof analyzed, and after analyzation, the semiconductor wafer is continued to be processed in the semiconductor device manufacturing line. For etching, pattern data having an edge which intersects the selected particle is created and the semiconductor wafer which is coated with a photosensitive material is exposed by a light pattern according to the pattern data so that an edge intersects the selected particle. Thereafter, the etching is carried out to expose the cross section of the selected particle and analyzation is effected.
    • 检测和/或分析其中检测半导体器件制造线中处理的半导体晶片中的粒子的半导体器件的方法和系统。 从检测到的颗粒中选择颗粒,并蚀刻所选择的颗粒以暴露所选择的颗粒的横截面。 所选择的粒子的横截面被暴露,其元素被分析,并且在分析之后,半导体晶片在半导体器件制造线中继续被处理。 为了蚀刻,产生具有与所选粒子相交的边缘的图案数据,并且通过根据图案数据的光图案使被感光材料涂覆的半导体晶片曝光,使得边缘与所选择的粒子相交。 此后,进行蚀刻以暴露所选粒子的横截面并进行分析。