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51. 发明申请

US20070000646A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 审中-公开
标题翻译：热管散热装置
公开(公告)号：US20070000646A1
公开(公告)日：2007-01-04
申请号：US11164592
申请日：2005-11-30
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Dong-Bo Zheng
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins arranged on the base and at least one heat pipe thermally positioned on the base. The heat pipe includes a U-shaped first portion, a second portion and a connecting portion interconnecting the first and second portions. The first portion of the heat pipe thermally engages the base. The second portion of the heat pipe is located above the base, and thermally engages with the plurality of fins.
摘要翻译：散热装置用于与发热电子装置接触以从电子装置移除热量。散热装置包括基座，布置在基座上的多个翅片和至少一个热定位在基座上的热管。热管包括U形第一部分，第二部分和互连第一和第二部分的连接部分。热管的第一部分热接合基座。热管的第二部分位于基座的上方，并与多个翅片热接合。

52. 发明申请

US20060158850A1 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US20060158850A1
公开(公告)日：2006-07-20
申请号：US11244688
申请日：2005-10-06
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28F2215/00 , H01L23/4006 , H01L23/467 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
摘要翻译：散热装置包括导热基座，底座上的散热器和与散热器和基座热接触的两个热管。散热器由金属挤压制成，并且在散热器周围包括导热圆柱体，以及从圆筒延伸并被圆筒包围的多个翅片。气缸包括四个互连的侧面。同一侧的翅片彼此平行。两个热管热量围绕散热器的气缸并且完全接触散热器。

53. 发明申请

US20060018096A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20060018096A1
公开(公告)日：2006-01-26
申请号：US11135575
申请日：2005-05-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
发明人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
IPC分类号： H05K7/20
CPC分类号： H01L23/562 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
摘要翻译：散热装置包括散热器和附接到散热器的保护装置。散热器包括多个单独的翅片组装。保护装置由塑料制成。保护装置包括搁置在翅片上的板条和在板条下方的多个肋条。肋条插在翅片之间。

54. 发明授权

US08347951B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08347951B2
公开(公告)日：2013-01-08
申请号：US12239830
申请日：2008-09-29
申请人： Shi-Wen Zhou , Chun-Chi Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current.
摘要翻译：散热装置包括填充有可相变工作流体的容器，密封地固定在罐的顶部并与罐连通的壳体，位于壳体顶部上方的风扇和包括容纳在壳体中的驱动构件的叶轮壳体，容纳在轮毂中的环形磁体和将驱动构件和环形磁体同轴连接在一起的轴。风扇包括固定在其内侧的多个绕组。当工作流体被加热和蒸发以移动通过驱动构件时，驱动构件由蒸发的工作流体驱动以旋转，由此环形磁体在绕组内旋转以使绕组产生电流。

55. 发明授权

US07870889B2 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07870889B2
公开(公告)日：2011-01-18
申请号：US11752902
申请日：2007-05-23
申请人： Shi-Wen Zhou , Guo Chen , Peng Liu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Guo Chen , Peng Liu , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： F28D15/0233 , F28D1/0472 , F28F1/20 , H01L23/367 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a radiator comprising a collar, a core received in the collar and a helical heat pipe embedded in a circumferential face of the core. The collar has a receiving hole and a plurality of fins extending radially and outwardly from an outer face of the collar. The core together with the heat pipe is received in the receiving hole of the radiator. The core has a flat bottom face and a top face opposite to the bottom face. The heat pipe is located between the radiator and the core and thermally contacts the collar of the radiator and the core. The heat pipe extends from the bottom face of the core to the top face of the core, and has a flattened bottom face coplanar with the bottom face of the core for contacting with an electronic device.
摘要翻译：散热装置包括散热器，其包括套环，容纳在轴环中的芯和嵌入在芯的圆周面中的螺旋形热管。套环具有接收孔和从轴环的外表面径向向外延伸的多个翅片。核心与热管一起被接收在散热器的接收孔中。芯具有平坦的底面和与底面相对的顶面。热管位于散热器和芯之间，并与散热器和芯体的轴颈热接触。热管从芯的底面延伸到芯的顶面，并且具有与芯的底面共面的扁平底面，用于与电子装置接触。

56. 发明授权

US07606030B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07606030B2
公开(公告)日：2009-10-20
申请号：US11955308
申请日：2007-12-12
申请人： Shi-Wen Zhou , Chun-Chi Chen , Guo Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen , Guo Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/427 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component.
摘要翻译：一种散热装置，包括一个散热器，一个散热器，包括一个基板和从该基板顶表面向上延伸的多个外部散热片，一个将散热片和吊具热连接在一起的热管，每个包括在其顶部具有头部的固定装置，围绕固定装置的弹簧和连接在固定装置上的垫圈。固定装置延伸穿过散热器的基板和吊具，垫片分别在头部和基板之间被压缩，散热片的底板的边缘与计算机的外壳相连接，并与壳体以形成封闭发热电子部件的气密封装。

57. 发明授权

US07443677B1 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07443677B1
公开(公告)日：2008-10-28
申请号：US11776862
申请日：2007-07-12
申请人： Shi-Wen Zhou , Chun-Chi Chen , Guo Chen
发明人： Shi-Wen Zhou , Chun-Chi Chen , Guo Chen
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat pipes surround an entire periphery of the first heat sink and a part of the second heat sink. Each heat pipe comprises an evaporating portion (42), a first condensing portion (46) and a second condensing portion (44). The first and second condensing portions extend from two opposite ends of the evaporating portion respectively. The evaporating portion is positioned adjacent to the electronic device and the two condensing portions extend inwardly and bend in opposite directions to each other. The first condensing portion extends through the first heat sink and the second condensing portion extends through the second heat sink.
摘要翻译：散热装置包括用于与电子装置热接触的第一散热器（10），安装在第一散热器上的第二散热器（20），与第一和第二散热片两者连接的热管（40）。热管围绕第一散热器的整个周边和第二散热器的一部分。每个热管包括蒸发部分（42），第一冷凝部分（46）和第二冷凝部分（44）。第一和第二冷凝部分别从蒸发部分的相对两端延伸。蒸发部分位于电子装置附近，两个冷凝部分向内延伸并且彼此相反的方向弯曲。第一冷凝部分延伸穿过第一散热器，第二冷凝部分延伸穿过第二散热器。

58. 发明授权

US07414848B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07414848B2
公开(公告)日：2008-08-19
申请号：US11626188
申请日：2007-01-23
申请人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28F1/12 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat conducting portions and located between the heat conducting portions, and a plurality of second fins extending outwardly from second faces of the heat conducting portions. Two heat pipes connect the base and the two heat sinks. Each heat pipe includes a first section thermally engaged with the base, and two second sections extending from the base and thermally engaged with the heat conducting portion of a corresponding heat sink. The second sections are located outside a hub and below fan blades of an impeller of a fan mounted on the heat sinks.
摘要翻译：散热装置包括一个底座和两个通过铝挤压形成的散热片，并位于基座上。每个散热器包括导热部分。两个散热器包括从导热部分的第一面向内延伸并位于导热部分之间的多个第一散热片和从导热部分的第二面向外延伸的多个第二散热片。两根热管连接底座和两个散热片。每个热管包括与基座热接合的第一部分和从基部延伸并与相应散热器的导热部分热接合的两个第二部分。第二部分位于轮毂外部，并位于安装在散热器上的风扇的叶轮的风扇叶片下方。

59. 发明申请

US20080174964A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20080174964A1
公开(公告)日：2008-07-24
申请号：US11626188
申请日：2007-01-23
申请人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Peng Liu , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28F1/12 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat conducting portions and located between the heat conducting portions, and a plurality of second fins extending outwardly from second faces of the heat conducting portions. Two heat pipes connect the base and the two heat sinks. Each heat pipe includes a first section thermally engaged with the base, and two second sections extending from the base and thermally engaged with the heat conducting portion of a corresponding heat sink. The second sections are located outside a hub and below fan blades of an impeller of a fan mounted on the heat sinks.
摘要翻译：散热装置包括一个底座和两个通过铝挤压形成的散热片，并位于基座上。每个散热器包括导热部分。两个散热器包括从导热部分的第一面向内延伸并位于导热部分之间的多个第一散热片和从导热部分的第二面向外延伸的多个第二散热片。两根热管连接底座和两个散热片。每个热管包括与基座热接合的第一部分和从基部延伸并与相应散热器的导热部分热接合的两个第二部分。第二部分位于轮毂外部，并位于安装在散热器上的风扇的叶轮的风扇叶片下方。

60. 发明授权

US07397663B2 Clip for heat dissipation device 失效
标题翻译：夹具用于散热装置
公开(公告)号：US07397663B2
公开(公告)日：2008-07-08
申请号：US11309345
申请日：2006-07-28
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen , Zhan Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.
摘要翻译：夹具包括主体，致动构件，第一钩板和第二钩板。主体包括支撑部分和从支撑部分的相对侧延伸的一对间隔开的臂。致动构件包括支撑在支撑部上的凸轮。第一钩板可拆卸地联接到主体的臂的远端。第二钩板延伸穿过支撑部分并且枢转地联接到致动构件的凸轮。致动构件可相对于第二钩板在锁定位置和解锁位置之间转动。

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