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51. 发明申请

US20080068584A1 Distance measuring apparatus 有权
标题翻译：距离测量仪
公开(公告)号：US20080068584A1
公开(公告)日：2008-03-20
申请号：US11898421
申请日：2007-09-12
申请人： Toshihiro Mori , Masanori Hino
发明人： Toshihiro Mori , Masanori Hino
IPC分类号： G01C3/08
CPC分类号： G01S17/10 , G01S7/4865 , G01S7/4873
摘要： There is provided a distance measuring apparatus, which can attain a distance compensation of a high precision and can be stably operated by using a cheap circuit, without any arrival at a supersaturated state for a great reflected light intensity, while a gain of an amplifying circuit is made higher, in order to accurately detect even a weak reflected light. The apparatus comprises: a light source for outputting a pulsed measurement light towards a measurement target object; a light receiver for detecting the reflected light from the measurement target object; and a calculator for calculating the distance from the measurement target object on the basis of the delay time between the output timing of the measurement light and the detected timing of the reflected light by the light receiver, and a light receiver 5 is composed of a photodiode PD for photo-electrically converting the reflected light, a diode D that is connected in series to the photodiode PD and clamps the light current generated in the photodiode PD, and an amplifying circuit 50 for amplifying the output of the photodiode PD, and it contains an integration processor for integrating the output of the amplifying circuit 50 and a distance compensator for compensating the distance in accordance with the output of the integration processor.
摘要翻译：提供了一种距离测量装置，其可以获得高精度的距离补偿，并且可以通过使用便宜的电路稳定地操作，而在没有达到过饱和状态以获得大的反射光强度的同时，放大电路的增益更高，以便准确地检测弱反射光。该装置包括：用于向测量对象物体输出脉冲测量光的光源; 用于检测来自测量对象物体的反射光的光接收器; 以及计算器，其基于测量光的输出定时与检测到的受光器的反射光的定时之间的延迟时间来计算与测量目标对象的距离，并且光接收器5由光电二极管用于光电转换反射光的PD，与光电二极管PD串联连接并钳位在光电二极管PD中产生的光电流的二极管D和用于放大光电二极管PD的输出的放大电路50，并且其包含用于对放大电路50的输出进行积分的积分处理器和用于根据积分处理器的输出来补偿距离的距离补偿器。

52. 发明申请

US20070088474A1 Parking assist method and a parking assist apparatus 有权
标题翻译：停车辅助方法和停车辅助装置
公开(公告)号：US20070088474A1
公开(公告)日：2007-04-19
申请号：US11582352
申请日：2006-10-18
申请人： Hiroaki Sugiura , Hideto Miyazaki , Toshihiro Mori
发明人： Hiroaki Sugiura , Hideto Miyazaki , Toshihiro Mori
IPC分类号： G06F7/00
CPC分类号： B62D15/027 , B60R1/00 , B60R2300/302 , B60R2300/305 , B60R2300/806 , B60T2201/10 , B62D15/0275
摘要： A parking assist apparatus includes a CPU for obtaining image data from a camera mounted on a vehicle, an image memory for storing the obtained image data as recorded image data, and an image processor for recognizing an object based on the image data. The image processor determines when to display a parking assist image to reveal an area hidden as a blind spot of the camera when the recognized object is in the blind spot of the camera and displays the parking assist image combining both current image data and the recorded image data for the area currently hidden as the blind spot of the camera, together with an indicator indicating the current position of the vehicle superimposed on the display.
摘要翻译：停车辅助装置包括用于从安装在车辆上的照相机获得图像数据的CPU，用于将获取的图像数据存储为记录图像数据的图像存储器，以及用于基于图像数据识别对象的图像处理器。图像处理器确定何时显示驻车辅助图像以在被识别的对象处于照相机的盲区中时露出作为照相机的盲点隐藏的区域，并显示组合当前图像数据和记录图像的驻车辅助图像当前被隐藏为相机盲点的区域的数据，以及指示车辆叠加在显示器上的当前位置的指示器。

53. 发明申请

US20070057816A1 Parking assist method and parking assist apparatus 审中-公开
标题翻译：停车辅助方法和停车辅助装置
公开(公告)号：US20070057816A1
公开(公告)日：2007-03-15
申请号：US11515733
申请日：2006-09-06
申请人： Seiji Sakakibara , Tomoki Kubota , Toshihiro Mori , Hiroaki Sugiura
发明人： Seiji Sakakibara , Tomoki Kubota , Toshihiro Mori , Hiroaki Sugiura
IPC分类号： G08G1/14
CPC分类号： B62D15/0275 , B60W30/06 , B60W50/14 , B60W2420/403 , B62D15/027
摘要： A navigation apparatus includes a controller, an image data input unit adapted to acquire image data from a camera installed in a vehicle, and an image memory for storing the image data. The navigation apparatus also includes an image processing unit converting data extracted from the acquired image data to data simulating a virtual viewpoint. The image processing unit stores the converted data in the image memory in associated with position data indicating the position at which the image was taken by the camera. Using a plurality of sets of converted data, the image processing unit generates bird's eye view data representing a bird's-eye image of an area nearby the current vehicle position. When the controller determines that parking operation is stopped, the image processing unit displays the bird's eye view image together with a mark indicating the current vehicle position.
摘要翻译：导航装置包括控制器，适于从安装在车辆中的相机获取图像数据的图像数据输入单元和用于存储图像数据的图像存储器。导航装置还包括将从获取的图像数据提取的数据转换成模拟虚拟视点的数据的图像处理单元。图像处理单元将转换的数据存储在图像存储器中，该位置数据指示照相机拍摄图像的位置。使用多组转换数据，图像处理单元生成表示当前车辆位置附近区域的鸟瞰图像的鸟瞰图数据。当控制器确定停车操作停止时，图像处理单元与指示当前车辆位置的标记一起显示鸟瞰图图像。

54. 发明申请

US20070009893A1 Method for isolating and purifying a nucleic acid 有权
标题翻译：分离和纯化核酸的方法
公开(公告)号：US20070009893A1
公开(公告)日：2007-01-11
申请号：US10568101
申请日：2004-09-08
申请人： Toshihiro Mori , Yoshihiko Maniko , Rie Hando , Yumiko Takeshita , Hiroko Inomata
发明人： Toshihiro Mori , Yoshihiko Maniko , Rie Hando , Yumiko Takeshita , Hiroko Inomata
IPC分类号： C12Q1/68 , C07H21/04
CPC分类号： C12N15/1006 , C12N15/1017
摘要： The present invention is a method for isolating and purifying a nucleic acid, where generation of foams is able to be suppressed whereby the isolation and purification of a nucleic acid are easily and efficiently carried out, the method for isolating and purifying a nucleic acid comprising the step of: (1) contacting a sample solution containing nucleic acid to a solid phase to adsorb the nucleic acid onto the solid phase; (2) contacting a washing solution to the solid phase to wash the solid phase in such a state that the nucleic acid is adsorbed; and (3) contacting an elution solution to the solid phase to desorb the nucleic acid, wherein the sample solution containing nucleic acid contains an antifoaming agent.
摘要翻译：本发明是分离和纯化核酸的方法，其中能够抑制泡沫的产生，从而容易且有效地进行核酸的分离和纯化，分离和纯化包含步骤：（1）将含有核酸的样品溶液与固相接触以将核酸吸附到固相上; （2）将洗涤溶液与固相接触以在核酸被吸附的状态下洗涤固相; 和（3）使洗脱溶液与固相接触以解吸核酸，其中含有核酸的样品溶液含有消泡剂。

55. 发明授权

US07152957B2 Recording device board having a plurality of bumps for connecting an electrode pad and an electrode lead, liquid ejection head, and manufacturing method for the same 有权
标题翻译：具有用于连接电极焊盘和电极引线的多个凸起的记录装置板，液体喷射头及其制造方法
公开(公告)号：US07152957B2
公开(公告)日：2006-12-26
申请号：US10731118
申请日：2003-12-10
申请人： Toshihiro Mori
发明人： Toshihiro Mori
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/14024 , B41J2/14072 , B41J2/17513 , B41J2/1752 , B41J2/1753 , B41J2/17553
摘要： The invention is intended to suppress failures of connected portions between electrode pads and bumps. A liquid ejection head comprises a recording device board including an energy generating device disposed thereon to generate energy for ejecting a liquid through an ejection orifice, and an electrode pad which is disposed in a recess formed in the recording device board and is electrically communicated with the energy generating device. The liquid ejection head further comprises an electrode lead for supplying power to the electrode pad externally of the recording device board, a bump for connecting the electrode pad and the electrode lead to establish electrical communication therebetween, and a sealing resin material filled in the recess to surround an electrically connected portion between the electrode pad and the bump without covering the bump.
摘要翻译：本发明旨在抑制电极焊盘和凸块之间的连接部分的故障。液体喷射头包括记录装置板，其包括设置在其上以产生用于通过喷射口喷射液体的能量的能量产生装置，以及电极焊盘，其设置在形成在记录装置板中的凹部中并与能量发生装置。液体喷射头还包括用于向记录装置板外部的电极焊盘供电的电极引线，用于连接电极焊盘和电极引线之间的电极引线的凸块，以及填充在凹部中的密封树脂材料围绕电极焊盘和凸块之间的电连接部分而不覆盖凸块。

56. 发明申请

US20060239869A1 Apparatus for processing perfluorocarbon 失效
标题翻译：全氟化碳加工设备
公开(公告)号：US20060239869A1
公开(公告)日：2006-10-26
申请号：US11473072
申请日：2006-06-23
申请人： Kazuyoshi Irie , Toshihiro Mori , Hisao Yokoyama , Takayuki Tomiyama , Toshihide Takano , Shin Tamata , Shuichi Kanno
发明人： Kazuyoshi Irie , Toshihiro Mori , Hisao Yokoyama , Takayuki Tomiyama , Toshihide Takano , Shin Tamata , Shuichi Kanno
IPC分类号： B01J8/04 , B01J10/00
CPC分类号： B01J4/002 , B01D53/8659 , B01D53/8662 , B01J8/0221 , B01J8/025 , B01J8/0278 , B01J8/0285 , B01J19/26 , B01J2208/00061 , B01J2208/00203 , B01J2208/00362 , B01J2208/00407 , B01J2208/00415 , B01J2208/00495 , B01J2208/0053 , B01J2208/00814 , B01J2208/0084 , B01J2208/00884 , B01J2219/00006 , Y02C20/30
摘要： An exhaust gas containing a perfluoride component (PFC) and SiIF4 is conducted into a silicon remover and brought into contact with water. A reaction water supplied from a water supplying piping and air supplied from an air supplying piping are mixed with the exhaust gas exhausted from the silicon remover. The exhaust gas containing water, air, and CF4 is heated at 700° C. by a heater. The exhaust gas containing PFC is conducted to a catalyst layer filled with an alumina group catalyst. The PFC is decomposed to HF and CO2 at a high temperature exhausted from the catalyst layer is cooled in a cooling apparatus. Subsequently, the exhaust gas is conducted to an acidic gas removing apparatus to remove HF. In this way, the silicon component is removed from the exhaust gas before introducing the exhaust gas into the catalyst layer. Therefore, the surface of the catalyst can be utilized effectively, and the decomposition reaction of the perfluoride compound can be improved.
摘要翻译：将含有全氟化物成分（PFC）和SiIF 4 N的废气导入硅去除剂中并与水接触。从供水管道供应的反应水和从供气管道供应的空气与从硅去除器排出的废气混合。含有水，空气和CF 4 N的废气通过加热器在700℃下加热。含有PFC的废气被传导到填充有氧化铝基催化剂的催化剂层。在从催化剂层排出的高温下，将PFC分解成HF，在冷却装置中冷却CO 2。随后，将废气导入酸性气体去除装置中去除HF。以这种方式，在将废气引入催化剂层之前，从排气中除去硅组分。因此，可有效利用催化剂的表面，可以提高全氟化合物的分解反应。

57. 发明申请

US20060139410A1 Liquid discharge recording head and ink jet recording apparatus 失效
公开(公告)号：US20060139410A1
公开(公告)日：2006-06-29
申请号：US11358203
申请日：2006-02-22
申请人： Shogo Kawamura , Toshihiro Mori , Hisashi Fukai , Naoki Nakajo
发明人： Shogo Kawamura , Toshihiro Mori , Hisashi Fukai , Naoki Nakajo
IPC分类号： B41J2/05
CPC分类号： H05K3/361 , B41J2/14024 , B41J2/14072 , H05K3/328 , H05K2201/0367 , H05K2201/0397 , H05K2201/10977
摘要： A liquid discharge recording head includes a recording element with a discharge port for discharging liquid and an electrically connecting portion arranged adjacent to the discharge port and receiving an electric signal for controlling the discharge of the discharge port. The liquid discharge recording head further includes a flexible wiring substrate for covering at least a portion of the recording element. The flexible wiring substrate includes each of a device hole for exposing the discharge port and a bonding hole arranged facing the electrically connecting portion independently. The liquid discharge recording head further includes a sealing agent for covering at least a portion of the electrically connecting portion and filled to at least a portion of the bonding hole. Thus, a liquid discharge recording head that enhances recording performance and that has superior productivity while maintaining reliability of the recording performance is provided.

58. 发明授权

US06841419B2 Method of fabricating a COF utilizing a tapered IC chip and chip mounting hole 失效
标题翻译：使用锥形IC芯片和芯片安装孔制造COF的方法
公开(公告)号：US06841419B2
公开(公告)日：2005-01-11
申请号：US10240673
申请日：2001-03-30
申请人： Masanori Akita , Toshihiro Mori , Koji Ito
发明人： Masanori Akita , Toshihiro Mori , Koji Ito
IPC分类号： G06K19/077 , H01L29/06 , H01L21/48
CPC分类号： G06K19/07745 , H01L29/0657 , H01L2924/10158 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/15157 , H01L2924/15165 , H01L2924/1579
摘要： A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.
摘要翻译：一种制造COF封装的方法包括以下步骤：提供具有用于接收芯片的孔的树脂膜基板，提供具有电极的IC芯片，将IC芯片插入孔中，以将它的电极固定在基板上方并且在衬底表面上形成用于与电极连接的电路图案。孔和IC芯片是锥形的，IC芯片用密封剂或粘合剂固定在孔中。

59. 发明授权

US06629755B2 Ink jet recording head, ink jet recording apparatus, and method for manufacturing ink jet recording head 有权
标题翻译：喷墨记录头，喷墨记录装置和喷墨记录头的制造方法
公开(公告)号：US06629755B2
公开(公告)日：2003-10-07
申请号：US10138585
申请日：2002-05-06
申请人： Riichi Saito , Toshihiro Mori , Naruyuki Nojo , Shogo Kawamura
发明人： Riichi Saito , Toshihiro Mori , Naruyuki Nojo , Shogo Kawamura
IPC分类号： B41J205
CPC分类号： B41J2/1603 , B41J2/14072 , B41J2/1623 , B41J2/1629 , B41J2/1631
摘要： To suitably electrically interconnect a recording element substrate, on which power supply paths are formed in a high density, and an electric wiring substrate, on which wiring lines for supplying power to these paths are formed, bumps are formed and arranged on the recording element substrate at a predetermined pitch therebetween so as to protrude by a predetermined distance t1 from this substrate. On the electric wiring substrate, on the other hand, connecting terminals are formed and arranged with the same pitch as that of the bumps. Between each two of the bumps is formed an insulating film which protrudes in the protrusion direction of the bumps by a predetermined distance t2, where t1
摘要翻译：为了适当地电连接以高密度形成电源路径的记录元件基板和形成有用于向这些路径供电的布线的电布线基板，形成并布置在记录元件基板上以它们之间的预定间距从该衬底突出预定距离t1。另一方面，在电布线基板上，以与凸点相同的间距形成并配置连接端子。在两个凸块之间形成绝缘膜，该绝缘膜在凸块的突出方向上突出预定距离t2，其中t1

60. 发明授权

US06410415B1 Flip chip mounting technique 失效
标题翻译：倒装芯片安装技术
公开(公告)号：US06410415B1
公开(公告)日：2002-06-25
申请号：US09724019
申请日：2000-11-28
申请人： Richard H. Estes , James E. Clayton , Koji Ito , Masanori Akita , Toshihiro Mori , Minoru Wada
发明人： Richard H. Estes , James E. Clayton , Koji Ito , Masanori Akita , Toshihiro Mori , Minoru Wada
IPC分类号： H01L2144
CPC分类号： H01L24/13 , H01L21/563 , H01L23/4985 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/13144 , H01L2224/1319 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2224/83856 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/01094 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/00 , H01L2224/05599
摘要： The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. A layer of electrically insulating adhesive paste is formed on a substrate having bond pads, covering the bond pads with the adhesive. The bond pads of the flip chip are aligned with the bond pads of the substrate, and then the at least partially hardened flip chip polymer bumps are pushed through the substrate adhesive with pressure sufficient for the flip chip polymer bumps to directly contact and deform the substrate bond pads.
摘要翻译：本发明提供了使倒装芯片以最大限度地提高接合操作的可靠性的方式与基板结合的工艺。导电聚合物凸块形成在倒装芯片的接合焊盘上，并且倒装芯片聚合物凸块至少部分硬化。导电性聚合物凸块形成在基板的接合焊盘上，然后将一层电绝缘粘合剂浆料涂覆在基板上，用粘合剂覆盖基板聚合物凸块。然后将倒装芯片的接合焊盘与衬底的接合焊盘对准，然后将至少部分硬化的倒装芯片聚合物凸块推入衬底粘合剂并且至少部分地推入衬底聚合物凸块中。在另一种方法中，导电聚合物凸块形成在倒装芯片的接合焊盘上，并且倒装芯片聚合物凸块至少部分硬化。在具有接合焊盘的基板上形成电绝缘粘合剂糊层，用粘合剂覆盖接合焊盘。倒装芯片的接合焊盘与衬底的接合焊盘对准，然后将至少部分硬化的倒装芯片聚合物凸块按压足以使倒装芯片聚合物凸块直接接触和变形衬底的衬底粘合剂接合垫

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