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    • 51. 发明申请
    • Biocompatible electroplated interconnection bonding method and electronics package suitable for implantation
    • 生物相容性电镀互连接合方法和电子封装适合植入
    • US20080319493A1
    • 2008-12-25
    • US11821327
    • 2007-06-21
    • Dao Min ZhouJames Singleton LittleRobert J. Greenberg
    • Dao Min ZhouJames Singleton LittleRobert J. Greenberg
    • A61N1/00H05K3/46
    • H05K3/361A61N1/02A61N1/36046C25D3/567C25D3/62C25D5/02C25D5/18C25D5/56H05K3/32H05K2203/0723
    • The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue. The present invention is directed to a device comprising a substrate containing at least one contact, a flexible assembly containing at least one pad, and electroplated bonding between said contact and said pad that bonds said substrate and said flexible assembly together. The present invention is directed to a method of bonding for implantation a substrate to a flexible assembly, said method comprising the steps of: aligning said substrate and said flexible assembly, whereby there is a common alignment for a contact on said substrate and contact pads on said flexible assembly, and electroplating bonding between said contacts and said pads, thereby bonding said flexible assembly to said substrate.
    • 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法,以及所得的电子封装,其适于植入生物组织,例如用于视网膜或皮层电极阵列,以使视力恢复到 某些非目标人士。 电气密封的电子封装通过电镀生物相容性材料(例如铂或金)直接结合到柔性电路或电极上,有效地形成电镀铆钉形连接,其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。 本发明涉及一种装置,其包括含有至少一个接触件的基板,包含至少一个焊盘的柔性组件以及在所述接触件和所述焊盘之间的电镀接合,将所述基板和所述柔性组件接合在一起。 本发明涉及一种用于将衬底植入到柔性组件中的接合方法,所述方法包括以下步骤:对准所述衬底和所述柔性组件,由此存在用于所述衬底上的接触和所述衬底上的接触焊盘的共同对准 所述柔性组件,以及所述触头和所述焊盘之间的电镀接合,从而将所述柔性组件粘合到所述衬底上。
    • 54. 发明申请
    • Process for Cathodic Protection of Electrode Materials
    • 电极材料阴极保护工艺
    • US20080283417A1
    • 2008-11-20
    • US11924349
    • 2007-10-25
    • Dao Min ZhouAmy HinesJames Singleton LittleRobert J. Greenberg
    • Dao Min ZhouAmy HinesJames Singleton LittleRobert J. Greenberg
    • C23F13/00
    • C23F13/00A61N1/05A61N1/08C23F13/02
    • The present invention relates to a process for cathodic protection of electrode or electrode materials wherein negative bias is applied on the electrode. the negative bias is obtained by asymmetric current pulse. The asymmetric current pulse is obtained by performing negative phase with higher amplitude. The asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The asymmetric current pulse is obtained by performing negative phase with higher amplitude and with wider pulse width than that of the anodic phase. The present invention further relates to a process for cathodic protection of electrode or electrode materials, wherein negative bias is applied on the electrode, wherein the negative bias is obtained by asymmetric current pulse, wherein the asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The wider pulse width is obtained by pulse trains.
    • 本发明涉及对电极或电极材料进行阴极保护的方法,其中负电极施加在电极上。 负偏压通过不对称电流脉冲获得。 通过执行具有较高振幅的负相来获得非对称电流脉冲。 通过执行具有比阳极相宽的脉冲宽度的负相来获得非对称电流脉冲。 通过执行具有更高幅度和宽于脉冲宽度的阳极相的负相位获得非对称电流脉冲。 本发明还涉及一种用于对电极或电极材料进行阴极保护的方法,其中在电极上施加负偏压,其中通过不对称电流脉冲获得负偏压,其中非对称电流脉冲通过执行具有更宽的负相 脉冲宽度大于阳极相。 通过脉冲串获得更宽的脉冲宽度。