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    • 58. 发明专利
    • ADHESIVE FOR FORMING LAMINATE AND ITS USE
    • JP2000230163A
    • 2000-08-22
    • JP3370599
    • 1999-02-12
    • MITSUI CHEMICALS INC
    • MORI RYOJIOTA SEIJITODO AKIRAOGISAWA MASAAKISUGIMOTO RYUICHI
    • B32B7/12B32B27/32C09J151/06
    • PROBLEM TO BE SOLVED: To prepare an adhesive which retains a practical adhesion strength at the ordinary temperature, after treated at a high temperature, and simultaneously has such excellent heat-resistant adhesivity under high temperature as capable of preventing the interlayer peeling of a laminate, when a severe treatment such as a high temperature charging treatment or a high temperature retort treatment is carried out. SOLUTION: This adhesive for forming laminates comprises a vinylic compound-modified olefinic polymer which is obtained by continuously graft- polymerizing a vinylic monomer to an olefinic polymer having a specific intrinsic viscosity and a specified Mw/Mn by a bulk polymerization method, a bulk suspension polymerization method or a solution polymerization method in a plug flow type reactor. The laminate is obtained by laminating an adhesive layer comprising the adhesive to a resin layer comprising a polyamide, a polycarbonate or a polyester. The laminate has two or more layers having a structure wherein the resin layer and the adhesive layer are adjacently laminated. A packaging material for retort pouches and hot film packages comprises the above laminate.