会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 51. 发明授权
    • Battery system having temperature equalizing walls in ducts
    • 电池系统在管道中具有温度均匀的壁
    • US08435664B2
    • 2013-05-07
    • US12772412
    • 2010-05-03
    • Masao SaitoKazunobu YokotaniShinsuke Nakamura
    • Masao SaitoKazunobu YokotaniShinsuke Nakamura
    • H01M10/50
    • H01M2/1077F28F9/0265F28F13/06H01M10/613H01M10/617H01M10/625H01M10/647H01M10/6554H01M10/6557H01M10/6563
    • A battery system including battery blocks (3) having a plurality of battery cells (1) stacked with cooling gaps (4) established between the battery cells to pass cooling gas; ventilating ducts (5), which are supply ducts (6) and exhaust ducts (7), disposed on both sides of the battery blocks to forcibly ventilate the cooling gaps; and ventilating apparatus (9) to force cooling gas to flow through the ventilating ducts. Cooling gas forcibly introduced by the ventilating apparatus flows from the supply ducts through the cooling gaps and into the exhaust ducts to cool the battery cells. In addition, the battery system has temperature equalizing walls (8) disposed in the supply ducts. The temperature equalizing walls are long and narrow with length in the direction of flow greater than the width, and each temperature equalizing wall gradually narrows towards the upstream end.
    • 一种电池系统,包括具有堆叠在所述电池单元之间的冷却间隙(4)的多个电池单元(1)的电池块(3),以通过冷却气体; 设置在电池块两侧的作为供给管道(6)和排气管道(7)的通风管道(5),以强制使冷却间隙通风; 和通风装置(9),以迫使冷却气体流过通风管道。 由通风装置强制引入的冷却气体从供给管通过冷却间隙流入排气管,以冷却电池单体。 此外,电池系统具有设置在供应管道中的温度均衡壁(8)。 温度均衡壁长度大,流动方向的长度大于宽度,每个温度平衡壁向上游端逐渐变窄。
    • 52. 发明授权
    • Method and device for connecting a wiring board
    • 连接接线板的方法和装置
    • US08108991B2
    • 2012-02-07
    • US12734285
    • 2008-09-04
    • Masao Saito
    • Masao Saito
    • H05K3/36
    • H05K3/361H05K3/323H05K2203/0173H05K2203/0195H05K2203/0278Y10T29/49126Y10T29/4913Y10T29/49144Y10T29/5317
    • Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply pressure to flexible printed circuit boards 4 and 5 relative to a motherboard substrate 1 having an electronic component 6 mounted thereon and heat an anisotropic conductive film, thereby connecting the motherboard substrate 1 with the ACF to the flexible printed circuit boards 4 and 5 that are connecting members. At this time, in a state in which a receiving plate 13 made of an elastic material, such as silicone rubber, and provided at a mounting position of the electronic component 6 of the motherboard substrate 1 with a concave portion 13a corresponding in shape to the electronic component 6 supports thereon the rear surface of the motherboard substrate 1, the thermal compression bonding is performed.
    • 与ACF的连接相对于具有安装在其后表面上的电子部件的布线板实现,具有高连接可靠性和均匀的热压接合。 使用热压接头12相对于具有安装在其上的电子部件6的母板基板1对柔性印刷电路板4和5施加压力,并加热各向异性导电膜,从而将母板基板1与ACF连接到 作为连接构件的柔性印刷电路板4和5。 此时,在由主体基板1的电子部件6的安装位置设置有由弹性材料制成的接收板13,例如硅橡胶的状态下,在主板基板1的电子部件6的安装位置, 电子部件6在其上支撑母板基板1的背面,进行热压接。
    • 53. 发明授权
    • Latent hardener, process for producing the same, and adhesive containing latent hardener
    • 潜在硬化剂,其制造方法和含有潜在硬化剂的粘合剂
    • US08044117B2
    • 2011-10-25
    • US12703104
    • 2010-02-09
    • Takayuki MatsushimaMasao Saito
    • Takayuki MatsushimaMasao Saito
    • C08K9/06C08K5/24B32B9/00B29C65/00
    • C09J163/00C08G59/18C08G59/188C08G59/682C08G59/70C08J3/241Y10T156/10Y10T428/2998
    • A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.
    • 本发明的潜在性固化剂(30)包括芯部件(31)和覆盖在芯部件(31)的表面上的胶囊(37)。 芯构件(31)包括保留在二次颗粒(32)的间隙(38)中的二次颗粒(32)和固化剂(35)。 固化剂(35)在环境温度下为液体。 当胶囊(37)被破坏使得固化剂(35)被发射到粘合剂中时,固化剂(35)与粘合剂中的其它成分混合。 在环境温度下为液体的金属醇化物或在环境温度下为液体的金属螯合物用作固化剂(35),同时将硅烷偶联剂加入到粘合剂中。 在固化剂(35)和硅烷偶联剂之间发生反应以产生阳离子。 通过这些阳离子,环氧树脂在聚合中经历阳离子。 由于阳离子产生反应在比常规粘合剂的情况下低的温度下进行,所以在常规粘合剂的情况下,固化进行得更快且温度更低。
    • 58. 发明申请
    • LATENT HARDENER, PROCESS FOR PRODUCING THE SAME, AND ADHESIVE CONTAINING LATENT HARDENER
    • 最佳硬化剂,其生产方法和含有最终硬化剂的胶粘剂
    • US20100143604A1
    • 2010-06-10
    • US12703104
    • 2010-02-09
    • Takayuki MatsushimaMasao Saito
    • Takayuki MatsushimaMasao Saito
    • B05D1/18
    • C09J163/00C08G59/18C08G59/188C08G59/682C08G59/70C08J3/241Y10T156/10Y10T428/2998
    • A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.
    • 本发明的潜在性固化剂(30)包括芯部件(31)和覆盖在芯部件(31)的表面上的胶囊(37)。 芯构件(31)包括保留在二次颗粒(32)的间隙(38)中的二次颗粒(32)和固化剂(35)。 固化剂(35)在环境温度下为液体。 当胶囊(37)被破坏使得固化剂(35)被发射到粘合剂中时,固化剂(35)与粘合剂中的其它成分混合。 在环境温度下为液体的金属醇化物或在环境温度下为液体的金属螯合物用作固化剂(35),同时将硅烷偶联剂加入到粘合剂中。 在固化剂(35)和硅烷偶联剂之间发生反应以产生阳离子。 通过这些阳离子,环氧树脂在聚合中经历阳离子。 由于阳离子产生反应在比常规粘合剂的情况下低的温度下进行,所以在常规粘合剂的情况下,固化进行得更快且温度更低。
    • 59. 发明申请
    • PROCESS FOR PRODUCING ADAMANTANE
    • 生产ADAMANTANE的方法
    • US20090177019A1
    • 2009-07-09
    • US12299785
    • 2007-05-09
    • Masao SaitoAkio KojimaToshiaki KusabaJun Mase
    • Masao SaitoAkio KojimaToshiaki KusabaJun Mase
    • C07C13/28
    • B01J29/126B01J29/088B01J2229/186C07C5/29C07C2529/08C07C2529/12C07C2603/74C07C13/615
    • Provided is a method for production of adamantane which enables producing a high-purity adamantane at low cost and with high efficiency by using effectively trimethylenenorbornane contained in a heavy raffinate heavy and having conventionally been no use other than fuels and the like, and which enables alleviating poisoning of a catalyst used in isomerization and corrosion of devices, whereby an industrially advantageous adamantane can be produced. In addition, the process for producing adamantane including an isomerization process of isomerizing trimethylenenorbornane contained in a raffinate obtained from a platfinate is characterized by including a water-washing removal process of removing sulfolane in a trimethylenenorbornane concentrate to be supplied in the isomerization process by water-washing.
    • 本发明提供一种金刚烷的制造方法,其能够低成本且高效率地制造高纯度金刚烷,其特征在于,使用重质提余液重金属中含有的三甲基降冰片烷,并且以往除了燃料等以外没有其他用途,能够缓和 用于装置的异构化和腐蚀的催化剂的中毒,由此可以生产工业上有利的金刚烷。 另外,含有由平板化合物得到的残液中异构化亚烷基降冰片烷异构化方法的金刚烷的制造方法的特征在于,在异氰酸酯化方法中,通过水洗方法,在三亚甲基降冰片烷烷浓缩物中除去环丁砜, 洗涤。