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    • 58. 发明授权
    • Spectroscopy module
    • 光谱模块
    • US08035814B2
    • 2011-10-11
    • US12464273
    • 2009-05-12
    • Katsumi ShibayamaTomofumi SuzukiMasaki Hirose
    • Katsumi ShibayamaTomofumi SuzukiMasaki Hirose
    • G01J3/28
    • G01J3/2803G01J3/02G01J3/0202G01J3/0208G01J3/0243G01J3/0259G01J3/0262G01J3/0286G01J3/18
    • In a spectroscopy module 1, a light passing hole 50 through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is bonded to a front plane 2a of a substrate 2 with an optical resin adhesive 63. Thus, it is possible to reduce a stress generated onto the light detecting element 5 due to a thermal expansion difference between the light detecting element 5 and the substrate 2. Additionally, on the light detecting element 5, a first convex portion 101 is formed so as to be located at least between the light detecting portion 5a and the light passing hole 50 when viewed from a direction substantially perpendicular to the front plane 2a. Thus, when the light detecting element 5 is attached to the substrate 2 via the optical resin adhesive 63, the optical resin adhesive 63 is dammed at the first convex portion 101. Thus, the optical resin adhesive 63 is prevented from penetrating into the light passing hole 50.
    • 在光谱模块1中,在光检测元件5中形成有通过向分光部4前进的光L1通过的光通过孔50.因此,能够防止光通过孔50与 光检测元件5的光检测部分5a偏离。 此外,光检测元件5利用光学树脂粘合剂63接合到基板2的前面2a。因此,可以减少由于光的热膨胀差而在光检测元件5上产生的应力 检测元件5和基板2.此外,在光检测元件5上,当从基本上垂直的方向观察时,形成至少位于光检测部分5a和光通过孔50之间的第一凸部101 到前平面2a。 因此,当光检测元件5经由光学树脂粘合剂63安装到基板2上时,光学树脂粘合剂63被阻挡在第一凸部101处。因此,防止光学树脂粘合剂63渗透到光通过 孔50。
    • 60. 发明申请
    • SPECTRAL MODULE
    • 光谱模块
    • US20110116091A1
    • 2011-05-19
    • US12992445
    • 2009-05-07
    • Katsumi Shibayama
    • Katsumi Shibayama
    • G01J3/18
    • G01J3/02G01J3/0202G01J3/0208G01J3/0243G01J3/0256G01J3/0262G01J3/0286G01J3/18G01J3/2803G02B5/1814G02B5/1861G02B7/008
    • In a spectral module 1, a photodetector 5 is mounted to an intermediate substrate 81, whereby an optical resin agent 63 interposed between a front face 2a of a substrate 2 and the intermediate substrate 81 is prevented from intruding into a light transmitting hole 50 of the photodetector 5. This can prevent refraction, scattering, and the like from occurring and make light Li appropriately enter a spectroscopic unit 4. In addition, the intermediate substrate 81 has a volume smaller than that of the substrate 2, whereby the intermediate substrate 81 expands/shrinks in a state more similar to the photodetector 5 than the substrate 2 when the temperature in the surroundings of the spectral module 1 changes. Hence, bump connections of the photodetector 5 can more reliably be prevented from breaking upon changes in the temperature in the surroundings of the spectral module 1 than when the photodetector 5 is mounted to the substrate 2.
    • 在光谱模块1中,将光电检测器5安装在中间基板81上,防止插入在基板2的正面2a和中间基板81之间的光学树脂试剂63侵入到 这可以防止发生折射,散射等,并使光Li适当地进入分光单元4.另外,中间基板81的体积小于基板2的体积,由此中间基板81膨胀 当光谱模块1的周围的温度变化时,以比基板2更为类似于光电检测器5的状态收缩。 因此,与将光检测器5安装在基板2上的情况相比,能够更可靠地防止光电检测器5的波峰连接在光谱模块1的周围温度变化时的断裂。