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51. 发明授权

EP1469906B1 MEDICAL LEAD AND LEAD CONNECTOR SYSTEM 有权
标题翻译：医疗管理线的连接系统
公开(公告)号：EP1469906B1
公开(公告)日：2010-01-20
申请号：EP02806465.7
申请日：2002-12-18
申请人： Medtronic, Inc.
发明人： STREIN, Paul, M. , HOLLEMAN, Timothy, W. , RIES, Andrew, J. , SCHRODER, Harry , HONECK, Jordon, D. , BJORKLUND, Vicki, L. , SOMMER, John, L.
IPC分类号： A61N1/05
CPC分类号： A61N1/3752 , A61N1/056 , A61N1/0573 , A61N2001/0578 , A61N2001/0585 , H01R13/5224 , H01R24/58 , H01R31/06 , H01R2107/00 , H01R2201/12

52. 发明公开

EP1885447A1 TELEMETRY ANTENNA FOR AN IMPLANTABLE MEDICAL DEVICE 审中-公开
标题翻译：遥感天线植入医疗
公开(公告)号：EP1885447A1
公开(公告)日：2008-02-13
申请号：EP06739406.4
申请日：2006-03-23
申请人： MEDTRONIC, INC. , Grose, Gary M.
发明人： TWETAN, Len, D. , PRZBYSZEWSKI, Piotr , DUBLIN, Garry, L. , HAUBRICH, Gregory, J. , HOUGHAM, Andrina, J. , RIES, Andrew, J. , ENGMARK, David, B.
IPC分类号： A61N1/372 , A61B5/00 , H01Q1/36 , A61N1/375
CPC分类号： A61N1/37229 , A61B5/0031 , H01Q1/27 , H01Q9/30 , H01Q9/40 , H01Q9/42
摘要： A telemetry antenna for an implantable medical device includes one or more portions having a non-linear configuration. In some embodiments, the non-linear configuration provides an antenna having a greater antenna length than the linear lengthwise dimension of the antenna structure. In some embodiments, the non-linear configuration is a serpentine pattern.

53. 发明授权

EP1295367B1 SYSTEM AND METHOD FOR TWO-SHOT MOLDING OF THERMOPLASTIC MATERIALS 有权
标题翻译：设备从热塑性材料和有关的两阶段施放
公开(公告)号：EP1295367B1
公开(公告)日：2005-05-11
申请号：EP01946544.2
申请日：2001-06-20
申请人： Medtronic, Inc.
发明人： ZART, Bryan, J. , BURWICK, Brian R. , RIES, Andrew, J. , NICHOLSON, John, E. , LAHTI, Jay
IPC分类号： H01R43/18 , H01R43/24 , A61N1/375
CPC分类号： B29C45/1671 , A61N1/3752 , B29C45/14639 , B29L2031/753 , H01R13/504 , H01R43/18
摘要： An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptables or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.

54. 发明公开

EP1478435A1 IMPLANTABLE MEDICAL DEVICE INCLUDING A SURFACE-MOUNT TERMINAL ARRAY 有权
标题翻译： WITH A面植入装配连接安排医疗器械
公开(公告)号：EP1478435A1
公开(公告)日：2004-11-24
申请号：EP03734969.3
申请日：2003-01-21
申请人： Medtronic,Inc.
发明人： RUBEN, David, A. , RIES, Andrew, J. , MILLA, Juan, G. , ROLES, Randy, S. , BRUNEAU, Terry, W. , WARREN, Steve, C. , PARKIN, David, W. , DAY, John, K. , ANDERSON, John, V., II , HEMANN, Robert, V., Jr.
IPC分类号： A61N1/375
CPC分类号： A61N1/3754
摘要： An implantable medical device comprises an enclosure, a first plurality of electrical contacts disposed within the enclosure, at least a first electrical component secured within the enclosure, a second plurality of electrical contacts on the first electrical component, and a terminal array for providing electrical coupling between the first and second plurality of electrical contacts. The terminal array comprises a housing having a plurality of apertures therethrough, the housing having a first side and a second opposite side. Each of a plurality of conductive terminals is positioned within one of the plurality of apertures and has a first contact region proximate the first side of the housing and a second contact region proximate the second side of the housing. The first contact region is electrically coupled to one of the first plurality of electrical contacts, and the second contact region is electrically coupled to one of the second plurality of contacts.

55. 发明授权

EP1011805B1 MEDICAL LEAD CONNECTOR SYSTEM 失效
标题翻译： CONNECTION SYSTEM FOR起搏电极
公开(公告)号：EP1011805B1
公开(公告)日：2004-06-09
申请号：EP98911677.7
申请日：1998-03-16
申请人： Medtronic Inc.
发明人： BISCHOFF, Thomas, C. , BONNER, Matthew, D. , LASKE, Timothy, G. , RIES, Andrew, J. , SOMMER, John, L.
IPC分类号： A61N1/375 , H01R13/52
CPC分类号： H01R13/5224 , A61N1/3752
摘要： An implantable medical device system including an implantable electronic device having multiple electrical connectors and an associated electrical lead also having a corresponding set of electrical connectors which engage with the connectors on the device. The lead has a connector assembly mounted to its proximal end, including the lead's electrical connectors and a mechanical connector. The device has a connector block with a bore extending therethrough sized to receive the connector assembly of the lead. A pulling tool is provided for pulling the lead connector assembly proximally in the bore of said connector block from a first position in which the lead's connector assembly is not fully inserted in the connector block to a second position in which said connector assembly is fully inserted in the connector block, the pulling tool being provided with a mechanical connector which engages with mechanical connector on the lead's connector assembly.

56. 发明授权

EP1017449B1 APPARATUS FOR INTERCONNECTING IMPLANTABLE ELECTRICAL LEADS AND MEDICAL DEVICES 失效
标题翻译：装置于连接植入电线和医疗设备
公开(公告)号：EP1017449B1
公开(公告)日：2003-11-19
申请号：EP98925131.9
申请日：1998-06-01
申请人： Medtronic Inc.
发明人： KAST, John, E. , RIES, Andrew, J. , BISCHOFF, Thomas, C. , LASKE, Timothy, G. , CLAYTON, Jeffrey, J.
IPC分类号： A61N1/375 , H01R13/629
CPC分类号： A61N1/3752 , H01R31/06 , H01R2201/12 , Y10S439/909
摘要： A system for connecting electrical leads having connector assemblies carrying electrical connectors to an implantable electrical device having a device housing containing electrical circuitry, including a first connector module fixedly mounted to the device housing, with a first set of electrical connectors coupled to the circuitry within the device housing and a second connector module, with a second set of electrical connectors engageable with the first set of connectors and a second set of connectors electrically coupled to the second set of connectors and engageable with the connectors on the electrical leads and a mechanism for retaining the second module on an outer surface of the device housing adjacent the first module while the second set of connectors engages the first set of connectors. The first and second sets of connectors preferably engage one another as a result of movement of the second module in a first direction into engagement with the second connector module and the retaining mechanism preferably functions to engage and retain the second connector module on the outer surface of the device housing during movement of the second module in the first direction.

57. 发明公开

EP1295367A2 SYSTEM AND METHOD FOR TWO-SHOT MOLDING OF THERMOPLASTIC MATERIALS 有权
标题翻译：设备从热塑性材料和有关的两阶段施放
公开(公告)号：EP1295367A2
公开(公告)日：2003-03-26
申请号：EP01946544.2
申请日：2001-06-20
申请人： Medtronic, Inc.
发明人： ZART, Bryan, J. , BURWICK, Brian R. , RIES, Andrew, J. , NICHOLSON, John, E. , LAHTI, Jay
IPC分类号： H01R43/18 , H01R43/24 , A61N1/375
CPC分类号： B29C45/1671 , A61N1/3752 , B29C45/14639 , B29L2031/753 , H01R13/504 , H01R43/18
摘要： An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptables or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.

58. 发明公开

EP1011805A1 MEDICAL LEAD CONNECTOR SYSTEM 失效
标题翻译：医用导联连接器系统
公开(公告)号：EP1011805A1
公开(公告)日：2000-06-28
申请号：EP98911677.7
申请日：1998-03-16
申请人： Medtronic Inc.
发明人： BISCHOFF, Thomas, C. , BONNER, Matthew, D. , LASKE, Timothy, G. , RIES, Andrew, J. , SOMMER, John, L.
IPC分类号： A61N1/375 , H01R13/52
CPC分类号： H01R13/5224 , A61N1/3752
摘要： An implantable medical device system including an implantable electronic device having multiple electrical connectors and an associated electrical lead also having a corresponding set of electrical connectors which engage with the connectors on the device. The lead has a connector assembly mounted to its proximal end, including the lead's electrical connectors and a mechanical connector. The device has a connector block with a bore extending therethrough sized to receive the connector assembly of the lead. A pulling tool is provided for pulling the lead connector assembly proximally in the bore of said connector block from a first position in which the lead's connector assembly is not fully inserted in the connector block to a second position in which said connector assembly is fully inserted in the connector block, the pulling tool being provided with a mechanical connector which engages with mechanical connector on the lead's connector assembly.
摘要翻译：一种可植入医疗设备系统，包括具有多个电连接器和相关联的电引线的可植入电子设备，所述电连接器还具有与设备上的连接器接合的对应的一组电连接器。引线具有安装到其近端的连接器组件，包括引线的电连接器和机械连接器。该装置具有连接器块，该连接器块具有延伸穿过其中的孔，其尺寸被设定为容纳引线的连接器组件。提供拉动工具用于将所述连接器组件的孔中的所述引导连接器组件近侧地从其中所述引线的连接器组件未完全插入所述连接器组件中的第一位置拉动到所述连接器组件完全插入其中的第二位置连接器组件，拉动工具设置有与引线的连接器组件上的机械连接器接合的机械连接器。

59. 发明授权

EP1957151B1 METHOD OF FORMING A CONNECTOR ASSEMBLY TO BE USED WITH AN IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：一种用于形成插塞装置FOR USE WITH可植入医疗装置
公开(公告)号：EP1957151B1
公开(公告)日：2010-12-22
申请号：EP06839652.2
申请日：2006-11-01
申请人： Medtronic, Inc.
发明人： RIES, Andrew, J. , LAHTI, Jay , PATRAS, George , LONGTIN, John, T. , ZART, Bryan, J.
IPC分类号： A61N1/375
CPC分类号： H01R13/504 , A61N1/3752 , H01R4/02 , H01R4/029 , H01R4/30 , H01R13/03 , H01R43/16 , H01R43/24 , Y10T29/49146

60. 发明授权

EP1651306B1 SMALL FORMAT CONNECTOR CLIP OF AN IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：小的空间PLUG支架的可植入医疗装置
公开(公告)号：EP1651306B1
公开(公告)日：2009-04-15
申请号：EP04756290.5
申请日：2004-06-28
申请人： MEDTRONIC, INC.
发明人： RIES, Andrew, J. , LAHTI, Jay
IPC分类号： A61N1/00
CPC分类号： A61N1/3752
摘要： A connector assembly for detachably connecting an electrical lead to an implantable medical device for emitting electrical pulses is provided. One or more deflectable connector clips are positioned inside or partially inside a compact housing that is designed to deflect the connector clips in a partially loaded state so that insertion of the terminal pin of an electrical lead causes a minor deflection of the spring clip, but results in high retention force. The positioning of the connector clip in the housing in a partially loaded state results in a relatively flat force deflection curve. The one or more connector clips are preferably electrically conducting metal and may be formed into a U-shape. The connector clips are generally positioned to provide multiple contact points with an inserted terminal pin of a lead.

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