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51. 发明申请

US20120289124A1 ENDPOINT DETECTION USING SPECTRUM FEATURE TRAJECTORIES 有权
标题翻译：使用光谱特征TRAJECTORIES进行端点检测
公开(公告)号：US20120289124A1
公开(公告)日：2012-11-15
申请号：US13103868
申请日：2011-05-09
申请人： Dominic J. Benvegnu , Boguslaw A. Swedek
发明人： Dominic J. Benvegnu , Boguslaw A. Swedek
IPC分类号： B24B49/12
CPC分类号： B24B49/12 , B24B37/013
摘要： A method of polishing includes polishing a substrate, making a sequence of measurements of light reflected from the substrate while the substrate is being polished, at least some of the measurements of the sequence of measurements differing due to material being removed during polishing, for each measurement in the sequence, determining a first value of a first characteristic and a second value of a different second characteristic of the light to generate a sequence of first values and second values, storing a predetermined path in a coordinate space of the first characteristic and the second characteristic, for each measurement in the sequence, determining a position on the path based on the first value and the second value, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the position on the path.
摘要翻译：抛光方法包括：抛光衬底，在衬底被抛光的同时对从衬底反射的光进行一系列测量，对于每次测量，由于在抛光过程中材料被去除而导致的测量序列的至少一些测量值不同在该顺序中，确定光的第一特性的第一值和不同第二特性的第二值，以产生第一值和第二值的序列，将预定路径存储在第一特性的坐标空间中，并且第二值特征，对于序列中的每个测量，基于第一值和第二值确定路径上的位置，并且基于路径上的位置来确定抛光终点或抛光速率的调整中的至少一个。

52. 发明申请

US20120276814A1 AUTOMATIC SELECTION OF REFERENCE SPECTRA LIBRARY 有权
标题翻译：自动选择参考光谱库
公开(公告)号：US20120276814A1
公开(公告)日：2012-11-01
申请号：US13095802
申请日：2011-04-27
申请人： Jimin Zhang , Harry Q. Lee , Zhihong Wang , Jeffrey Drue David , Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Jimin Zhang , Harry Q. Lee , Zhihong Wang , Jeffrey Drue David , Boguslaw A. Swedek , Dominic J. Benvegnu
IPC分类号： B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B49/05 , B24B49/12 , G01J3/28
摘要： A computer-implemented method of generating reference spectra includes polishing a plurality of set-up substrates, the plurality of set-up substrates comprising at least three set-up substrates, measuring a sequence of spectra from each of the plurality of set-up substrates during polishing with an in-situ optical monitoring system to provide a plurality of sequences of spectra, generating a plurality of sequences of potential reference spectra from the plurality of sequences of spectra, determining which sequence of potential reference spectra of the plurality of sequences provides a best match to remaining sequences of the plurality of sequences, and storing the sequence of potential reference spectra determined to provide the best match as reference spectra, and selecting and storing the sequence of potential reference spectra.
摘要翻译：产生参考光谱的计算机实现的方法包括抛光多个设置基板，所述多个设置基板包括至少三个设置基板，测量来自多个设置基板中的每一个的光谱序列在用原位光学监测系统进行抛光时提供多个光谱序列，从多个光谱序列产生多个潜在参考光谱序列，确定多个序列中的哪个潜在参考光谱序列提供一个最佳匹配多个序列的剩余序列，并存储确定为提供最佳匹配的参考光谱序列作为参考光谱，以及选择和存储潜在参考光谱序列。

53. 发明申请

US20100261413A1 Determining Physical Property of Substrate 有权
标题翻译：确定基材的物理性质
公开(公告)号：US20100261413A1
公开(公告)日：2010-10-14
申请号：US12822096
申请日：2010-06-23
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： B24B49/02 , B24B49/12
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

54. 发明授权

US07774086B2 Substrate thickness measuring during polishing 有权
标题翻译：抛光时的基板厚度测量
公开(公告)号：US07774086B2
公开(公告)日：2010-08-10
申请号：US12185719
申请日：2008-08-04
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , H01L21/00 , B24B49/00
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.
摘要翻译：确定抛光终点的计算机程序产品包括在抛光序列的不同时间内从基板上的不同区域获得光谱，将光谱与库中的索引匹配，并使用该指标来确定每个不同区域的抛光速率指标。可以为一个区域确定调整的抛光速率，这导致当达到抛光结束时间时，基板具有期望的轮廓。

55. 发明申请

US20100124870A1 Semi-Quantitative Thickness Determination 有权
标题翻译：半定量厚度测定
公开(公告)号：US20100124870A1
公开(公告)日：2010-05-20
申请号：US12271674
申请日：2008-11-14
申请人： Dominic J. Benvegnu , Boguslaw A. Swedek , Jeffrey Drue David , Harry Q. Lee
发明人： Dominic J. Benvegnu , Boguslaw A. Swedek , Jeffrey Drue David , Harry Q. Lee
IPC分类号： B24B49/02 , B24B49/06 , B24B49/12 , B24B7/22
CPC分类号： H01L22/12 , B24B37/013 , B24B49/12 , H01L22/26
摘要： While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.
摘要翻译：当抛光衬底时，也照射来自光源的光。测量从基板的表面反射的光的当前光谱。在当前光谱中识别具有第一参数值的选定峰。使用处理器从查找表确定与第一参数相关联的第二参数的值。根据第二参数的值，改变衬底的抛光。可以测量在衬底的抛光之前从衬底反射的光的初始光谱，并且可以确定与初始光谱的选定峰对应的波长。

56. 发明申请

US20100103422A1 GOODNESS OF FIT IN SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING 审中-公开
标题翻译：在加工过程中基材在光谱监测中的适用性
公开(公告)号：US20100103422A1
公开(公告)日：2010-04-29
申请号：US12258966
申请日：2008-10-27
申请人： Jeffrey Drue David , Boguslaw A. Swedek , Dominic J. Benvegnu , Harry Q. Lee
发明人： Jeffrey Drue David , Boguslaw A. Swedek , Dominic J. Benvegnu , Harry Q. Lee
IPC分类号： G01B11/00 , G06F15/00
CPC分类号： G01B11/0683 , B24B37/013 , B24B49/12
摘要： A sequence of current spectra is obtained with an in-situ optical monitoring system, and each current spectrum is compared to a plurality of reference spectra from a plurality of reference spectra libraries. The library that provides a best fit to the sequence of current spectra is determined, and a polishing endpoint is determined based on the sequence of current spectra and the library that provides a best fit to the sequence of current spectra.
摘要翻译：利用原位光学监测系统获得电流光谱序列，并将每个电流光谱与多个参考光谱库的多个参考光谱进行比较。确定提供最适合当前光谱序列的文库，并且基于当前光谱的序列和提供与当前光谱序列最佳拟合的文库来确定抛光终点。

57. 发明申请

US20090017726A1 SPECTRA BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING 有权
标题翻译：用于化学机械抛光的基于光谱的端基
公开(公告)号：US20090017726A1
公开(公告)日：2009-01-15
申请号：US12182076
申请日：2008-07-29
申请人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
发明人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
IPC分类号： B24B49/06 , G01B11/06 , B24B49/12
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
摘要翻译：用于基于频谱的终点的方法和装置。一种终点方法包括选择两个或更多个参考光谱。每个参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。为特定的基于光谱的端点确定逻辑选择参考光谱，以便通过应用特定的基于光谱的端点逻辑来调用端点时实现目标厚度。该方法包括获得两个或更多个当前光谱。每个电流光谱是当感兴趣的膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二衬底上从感兴趣的膜反射的白光的光谱。该方法包括为第二基底确定何时已经实现了抛光步骤的终点。

58. 发明授权

US07409260B2 Substrate thickness measuring during polishing 有权
标题翻译：抛光时的基板厚度测量
公开(公告)号：US07409260B2
公开(公告)日：2008-08-05
申请号：US11748825
申请日：2007-05-15
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , H01L21/00 , B24B49/00
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： A method for determining a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matching the spectra with indexes in a library and using the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.
摘要翻译：一种用于确定抛光终点的方法包括在抛光序列的不同时间期间从基板上的不同区域获得光谱，将光谱与库中的索引进行匹配，并使用索引来确定每个不同区域的抛光速率与索引。可以为一个区域确定调整的抛光速率，这导致当达到抛光结束时间时，基板具有期望的轮廓。

59. 发明申请

US20080146120A1 DETERMINING PHYSICAL PROPERTY OF SUBSTRATE 有权
标题翻译：确定基材的物理性质
公开(公告)号：US20080146120A1
公开(公告)日：2008-06-19
申请号：US11611640
申请日：2006-12-15
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： B24B49/00 , G01B11/24
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

60. 发明授权

US08591698B2 Peak-based endpointing for chemical mechanical polishing 有权
标题翻译：基于峰值的化学机械抛光终点
公开(公告)号：US08591698B2
公开(公告)日：2013-11-26
申请号：US13198602
申请日：2011-08-04
申请人： Dominic J. Benvegnu , Boguslaw A. Swedek , David J. Lischka
发明人： Dominic J. Benvegnu , Boguslaw A. Swedek , David J. Lischka
IPC分类号： B24B49/00
CPC分类号： H01L22/26 , B24B37/013 , B24B49/12 , B24D7/12 , H01L21/31053 , H01L21/3212
摘要： A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.
摘要翻译：抛光系统接收光谱中所选峰的一个或多个目标参数，抛光衬底，在衬底被抛光时测量从衬底反射的光的当前光谱，识别当前光谱中所选择的峰，测量当前频谱中所选峰的一个或多个当前参数将所选峰的当前参数与目标参数进行比较，并且当当前参数和目标参数具有预定关系时，停止抛光衬底。

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