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    • 55. 发明申请
    • SUBSTRATE PROCESSING METHOD
    • 基板处理方法
    • US20120201646A1
    • 2012-08-09
    • US13449409
    • 2012-04-18
    • Hiromitsu SakaueTakashi Horiuchi
    • Hiromitsu SakaueTakashi Horiuchi
    • H01L21/677
    • H01L21/67748H01L21/67742H01L21/67778H01L21/67781Y10S414/137
    • A substrate processing method includes transferring unprocessed substrates to a first substrate holder by way of lowering a first substrate accommodation unit and loading the unprocessed substrates into a processing chamber in sequence while sequentially rotating a substrate mounting table at a preset angle in one direction, performing a preset process on substrates in a batch-type, and unloading processed substrates from the processing chamber by the first substrate holder after a completion of the preset process, transferring the processed substrates into the first substrate accommodation unit from the first substrate holder by way of raising the first substrate accommodation unit, transferring unprocessed substrates to a second substrate holder by way of lowering a second substrate accommodation unit and loading the unprocessed substrate into the processing chamber in sequence while sequentially rotating the substrate mounting table at the preset angle in the another direction.
    • 基板处理方法包括:通过降低第一基板容纳单元并将未处理的基板依次装载到处理室中来将未处理的基板传送到第一基板保持器,同时沿着一个方向以预设角度顺序旋转基板安装台,执行 在预定处理完成之后,通过第一基板保持器从处理室中卸载经处理的基板,从第一基板保持器将加工的基板转移到第一基板收纳单元中,通过提升 第一基板容纳单元,通过降低第二基板容纳单元将未处理的基板传送到第二基板保持器,并且将未处理的基板顺序地装载到处理室中,同时沿着另一个方向以预定角度顺序旋转基板安装台。
    • 59. 发明授权
    • Thermal printer that effectively controls heat buildup
    • 热敏打印机可有效控制热量积聚
    • US07271819B2
    • 2007-09-18
    • US11092604
    • 2005-03-29
    • Megumi MatsutaniTakashi Horiuchi
    • Megumi MatsutaniTakashi Horiuchi
    • B41J2/00
    • B41J2/38
    • A thermal head has heating elements and is movable relative to a printing medium. A pulse application portion applies a drive voltage pulse selectively to the heating elements. A voltage measurement portion measures a head voltage applied to the thermal head. A total-dot counting portion adds a number of dots which are printed from a reference time point, thereby obtaining a total dot count. An adjustment portion adjusts the total dot count based on a predetermined adjustment dot count corresponding to an ambient temperature. A heat-buildup-coefficient storing portion stores a heat buildup coefficient corresponding both to the ambient temperature and to an excess dot count. A pulse-width setting portion sets the width of the drive voltage pulse based on the head voltage and the heat buildup coefficient. A pulse-width correction portion corrects the width of the drive voltage pulse based on the head voltage measured by the voltage measurement portion.
    • 热敏头具有加热元件并且可相对于打印介质移动。 脉冲施加部分选择性地将加热元件施加驱动电压脉冲。 电压测量部分测量施加到热敏头的头电压。 总点计数部添加从参考时间点打印的多个点,从而获得总点数。 调整部根据与环境温度对应的规定的调整点数来调整总点数。 积热系数存储部分存储对应于环境温度和多余点数的热积聚系数。 脉冲宽度设定部根据磁头电压和发热系数来设定驱动电压脉冲的宽度。 脉冲宽度校正部分根据由电压测量部分测量的磁头电压校正驱动电压脉冲的宽度。