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51. 发明申请

US20050284658A1 Components with posts and pads 有权
标题翻译：具有柱和垫的组件
公开(公告)号：US20050284658A1
公开(公告)日：2005-12-29
申请号：US11166982
申请日：2005-06-24
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae Park , Belgacem Haba
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L25/065 , H05K1/11 , H05K3/06 , H05K3/40
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译：封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48））暴露在介电层的外表面处，焊盘通过迹线连接到柱。电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。还公开了制造连接部件的方法。

52. 发明申请

US20050189622A1 Packaged acoustic and electromagnetic transducer chips 审中-公开
公开(公告)号：US20050189622A1
公开(公告)日：2005-09-01
申请号：US11068830
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

53. 发明申请

US20050181544A1 Microelectronic packages and methods therefor 有权
标题翻译：微电子封装及其方法
公开(公告)号：US20050181544A1
公开(公告)日：2005-08-18
申请号：US11014439
申请日：2004-12-16
申请人： Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
发明人： Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
IPC分类号： H01L21/44
CPC分类号： H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.
摘要翻译：微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱，其中至少一些导电柱与微电子元件电互连，以及多个支撑元件微电子元件上的柔性衬底。导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。

54. 发明授权

US10564038B2 Spectral characteristic acquiring apparatus, image forming apparatus, image forming system, image forming apparatus management system, and image forming apparatus management method 有权
公开(公告)号：US10564038B2
公开(公告)日：2020-02-18
申请号：US16253875
申请日：2019-01-22
申请人： Yusuke Taneda , Kohei Shimbo , Yoichi Kubota
发明人： Yusuke Taneda , Kohei Shimbo , Yoichi Kubota
IPC分类号： G01J3/46 , G01J3/52 , H04N1/00 , H04N1/60 , G01J3/28
摘要： A spectral characteristic acquiring apparatus includes a color data acquiring unit including a plurality of spectral sensors configured to receive reflected light from an object that has been irradiated with light to acquire color data of the object, a spectral characteristic calculating unit configured to estimate spectral characteristics of the object based on the acquired color data of the object using a preset transformation matrix, a first conveying unit configured to convey the object in a predetermined conveying direction, and a second conveying unit configured to convey the color data acquiring unit in a direction intersecting the predetermined conveying direction. The plurality of spectral sensors are arrayed in the predetermined conveying direction.

55. 发明授权

US09197761B2 Spectral characteristic acquisition apparatus, image evaluation apparatus, and image forming apparatus 有权
标题翻译：光谱特征采集装置，图像评价装置和图像形成装置
公开(公告)号：US09197761B2
公开(公告)日：2015-11-24
申请号：US14454847
申请日：2014-08-08
申请人： Naohiro Kamijo , Kohei Shimbo , Yoichi Kubota
发明人： Naohiro Kamijo , Kohei Shimbo , Yoichi Kubota
IPC分类号： H04N1/46 , H04N1/00 , H04N1/50 , H04N1/60 , G01J3/28 , G01J3/18
CPC分类号： H04N1/00015 , H04N1/00005 , H04N1/00023 , H04N1/0005 , H04N1/00063 , H04N1/00087 , H04N1/50
摘要： A spectral characteristic acquisition apparatus includes a light emitting part configured to emit light onto an object, a light dividing part configured to divide the light reflected from the object into multiple light beams by multiple aperture parts of the light dividing part, a dispersing part configured to form multiple diffraction images corresponding to the aperture parts by spectrally dispersing the light beams, a light receiving part including an array of spectral sensors that receive the diffraction images at substantially the same position on their respective light receiving surfaces and convert the received diffraction images into electrical signals, and an operation part configured to compute a spectral characteristic of the object based on the electrical signals.
摘要翻译：光谱特征获取装置包括被配置为将光发射到物体上的发光部分，被配置为将从物体反射的光分成由多个光束分成多个光束的光分离部分的光分离部分，分散部分被配置为通过光谱分散光束形成对应于孔径部分的多个衍射图像，光接收部分，其包括光谱传感器阵列，其接收衍射图像在它们各自的光接收表面上基本相同的位置，并将接收的衍射图像转换成电信号和被配置为基于电信号计算对象的光谱特性的操作部分。

56. 发明授权

US08879057B2 Spectral characteristic acquiring apparatus, spectral characteristic acquiring method and image evaluating apparatus 有权
标题翻译：光谱特征获取装置，光谱特征获取方法和图像评估装置
公开(公告)号：US08879057B2
公开(公告)日：2014-11-04
申请号：US13559982
申请日：2012-07-27
申请人： Kohei Shimbo , Naohiro Kamijo , Yoichi Kubota , Manabu Seo
发明人： Kohei Shimbo , Naohiro Kamijo , Yoichi Kubota , Manabu Seo
IPC分类号： G01J3/00 , G01J3/40 , G01J3/28 , G01J3/52 , G01J3/04 , G01J3/50 , H04N1/60 , B41F33/00 , G01N21/86
CPC分类号： G01J3/524 , B41F33/00 , B41F33/0045 , G01J3/04 , G01J3/28 , G01J3/502 , G01N21/86 , H04N1/6033 , H04N1/6044
摘要： A spectral characteristic acquiring apparatus is provided which includes: an area dividing part; a spectrum separating part; a light receiving part; and a calculating part, wherein the calculating part includes a transformation matrix storing part that stores a transformation matrix used for calculating the spectral characteristic corresponding to electrical signals of a first diffraction pattern group including two or more adjacent diffraction patterns, and a spectral characteristic calculating part that calculates, based on the electrical signals of the first diffraction pattern group and the corresponding transformation matrix, the spectral characteristic at the locations of the image carrying medium corresponding to the apertures of the first diffraction pattern group.
摘要翻译：提供了一种光谱特征获取装置，包括：区域分割部分; 光谱分离部分; 光接收部; 以及计算部分，其中所述计算部分包括变换矩阵存储部分，所述变换矩阵存储部分存储用于计算与包括两个或更多个相邻衍射图案的第一衍射图形组的电信号相对应的光谱特性的变换矩阵，以及光谱特性计算部分其基于第一衍射图案组的电信号和相应的变换矩阵计算与第一衍射图案组的孔对应的图像承载介质的位置处的光谱特性。

57. 发明授权

US08755046B2 Spectrometer, and image evaluating unit and image forming device incorporating the same 有权
标题翻译：光谱仪和图像评估单元以及包括其的图像形成装置
公开(公告)号：US08755046B2
公开(公告)日：2014-06-17
申请号：US13788058
申请日：2013-03-07
申请人： Kohei Shimbo , Naohiro Kamijo , Yoichi Kubota , Manabu Seo
发明人： Kohei Shimbo , Naohiro Kamijo , Yoichi Kubota , Manabu Seo
IPC分类号： G01J3/28
CPC分类号： G01J3/2823 , G01J3/0256 , G01J3/04 , G01J3/1804 , G01J3/2803 , G01N21/8914 , G01N2021/8908 , G01N2021/8917
摘要： A spectrometer includes a light source to project a light beam to a target object, a spectral element to disperse the light beam reflected by the target object and including a diffraction element to diffract the light beam, and a light receiving element to receive, at pixels, light beams with different spectral characteristics from each other dispersed by the spectral element, wherein the diffraction element and the light receiving element are integrally formed.
摘要翻译：光谱仪包括将光束投影到目标物体的光源，用于分散由目标物体反射的光束并包括衍射元件以衍射光束的光谱元件，以及光接收元件，以在像素处接收具有彼此分散的不同光谱特性的光束被光谱元件分散，其中衍射元件和光接收元件一体形成。

58. 发明授权

US08604348B2 Method of making a connection component with posts and pads 有权
标题翻译：使用柱和垫制作连接部件的方法
公开(公告)号：US08604348B2
公开(公告)日：2013-12-10
申请号：US13155825
申请日：2011-06-08
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
IPC分类号： H05K1/00 , H05K1/16
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译：封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48））暴露在介电层的外表面处，焊盘通过迹线连接到柱。电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。还公开了制造连接部件的方法。

59. 发明授权

US08593628B2 Spectral characteristics estimation device, image forming apparatus having the same, and spectral characteristics estimation method 有权
标题翻译：光谱特性估计装置，具有该光谱特性估计装置的图像形成装置和光谱特性估计方法
公开(公告)号：US08593628B2
公开(公告)日：2013-11-26
申请号：US13165205
申请日：2011-06-21
申请人： Kohei Shimbo , Naohiro Kamijo , Manabu Seo , Yoichi Kubota
发明人： Kohei Shimbo , Naohiro Kamijo , Manabu Seo , Yoichi Kubota
IPC分类号： G01J3/00 , G01R13/00
CPC分类号： H04N1/6027 , G01J3/462 , G01J3/501 , G01J3/502 , G01J3/51
摘要： Spectral characteristics of an object is estimated using an extended sensor response, which includes a product of at least two light intensity signals whose wavelength ranges are partially overlapped with each other.
摘要翻译：使用扩展的传感器响应来估计对象的光谱特性，该响应包括至少两个波长范围彼此重叠的光强度信号的乘积。

60. 发明授权

US08472019B2 Spectroscopic characteristics acquisition unit, image evaluation unit, and image forming apparatus 有权
标题翻译：光谱特征采集单元，图像评估单元和图像形成装置
公开(公告)号：US08472019B2
公开(公告)日：2013-06-25
申请号：US13037941
申请日：2011-03-01
申请人： Manabu Seo , Naohiro Kamijo , Kohei Shimbo , Yoichi Kubota
发明人： Manabu Seo , Naohiro Kamijo , Kohei Shimbo , Yoichi Kubota
IPC分类号： G01J3/28
CPC分类号： G01J3/02 , G01J3/0205 , G01J3/0229 , G01J3/2803 , G01J3/502
摘要： A spectroscopic characteristics acquisition unit includes a light emitting unit to illuminate a measurement target; a lens array including lenses to receive reflected light reflected from the measurement target; a light blocking member having a pinhole array including openings; a focusing unit to focus light coming from the pinhole array; a diffraction unit to diffract the light to different directions depending on wavelength of light received by the focusing unit; and a light receiving unit to receive the reflected light diffracted by the diffraction unit. The light receiving unit includes a spectroscopic sensor array having spectroscopy sensors including pixels. Each of the lenses constituting the lens array corresponds to one of the openings of the pinhole array. The numerical aperture NA of the lens in the arrangement direction in the lens array satisfies the formula NA>sin(θmax) with respect to the maximum angle of view θmax of the focusing unit.
摘要翻译：光谱特性获取单元包括照亮测量对象的发光单元; 透镜阵列，包括用于接收从测量对象反射的反射光的透镜; 具有包括开口的针孔阵列的遮光构件; 聚焦单元，用于聚焦来自针孔阵列的光; 衍射单元，用于根据由聚焦单元接收的光的波长将光衍射到不同的方向; 以及光接收单元，用于接收由衍射单元衍射的反射光。光接收单元包括具有包括像素的光谱传感器的光谱传感器阵列。构成透镜阵列的每个透镜对应于针孔阵列的一个开口。透镜阵列中透镜在排列方向上的数值孔径NA相对于聚焦单元的最大视角角度满足公式NA> sin（tamax）。

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