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    • 52. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT
    • JPS56129367A
    • 1981-10-09
    • JP3289380
    • 1980-03-14
    • MITSUBISHI ELECTRIC CORP
    • YOSHIHARA TSUTOMUTAKANO SATOSHI
    • H01L27/10H01L21/8242H01L27/108
    • PURPOSE:To prevent a mulfunction from being caused by incidence of radioactive rays by a method wherein an electric charge reservoiring region and bit line region having conductivities different from that of a substrate are surrounded on the peripheries by regions with density higher than the substrate and having the same conductivity as that of the substrate. CONSTITUTION:An N -region 6 as the electric charge reservoiring region of a memory cell and an N -region 7 as the bit line are surrounded on the peripheries by P -regions 12, 13 in higher density than a P type semiconductor substrate. Whereby electrons diffused from the substrate 1, out of electrons and holes pair created in the substrate 1 by radioactive rays of alpha-ray and the like, are recombined in the regions 12, 13 and not collected in the regions 6, 7. In addition, since a potential barrier against the electrons is formed on the interface of the substrate 1 and the regions 12, 13, the electrons smaller in energy out of the electrons diffused from the substrate 1 cannot pass through the potential barrier. Accordingly, the electrons are collected in the regions 6, 7 to cause the memory information to be inverted and the mulfunctions are prevented from being caused.
    • 53. 发明专利
    • ELECTRIC CHARGE TRANSFERRTYPE SEMICONDUCTOR DEVICE
    • JPS5593266A
    • 1980-07-15
    • JP148379
    • 1979-01-09
    • MITSUBISHI ELECTRIC CORP
    • FUJISHIMA KAZUYASUYAMADA MICHIHIROTAKANO SATOSHITADA TETSUO
    • H01L29/762H01L21/339H01L29/768
    • PURPOSE:To transfer sufficient electric charge with the assistance of two-phase CP by piling the upper layer of transfer gate electrode over the entire lower layer and forming a large coupling capacitance between the both layers. CONSTITUTION:The transfer gate electrode shall be of two-layers structure, and part 2a of the upper layer is overlapped on the lower layer occupying an area more than twice the size of 2b. The upper layer electrode 2 is earthed through a diffusion layer of large resistance value. For this reason, time constant based on a coupling capacitance and resistance between the upper layer 2 and the lower layer 1, is large. In addition, the upper layer gate electrode 2 suffers voltage fluctuation due to CP applied to the lower gate electrode 1. The subsequent effect is determined by the time constant. Electric charge transfer makes the use of this voltage fluctuation. The electric charge to be transferred is determined by the area of the lower electrode 1, while the upper layer electrode 2 acts on only the movement of electric charge but does not accumulate electric charge. Transfer of the electric charge is performed by adding two-phase clock voltage phi1, phi2 to the lower layer electrode 1. Under this constitution, peripheral circuit is simplified and sufficient transferred electric charge volume is obtained.
    • 54. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH03201462A
    • 1991-09-03
    • JP34023589
    • 1989-12-28
    • MITSUBISHI ELECTRIC CORP
    • TAKANO SATOSHI
    • H01L21/82
    • PURPOSE:To improve an alignment mark in detection accuracy so as to enable a first layer as a laser fuse to be precisely irradiated with laser rays by a method wherein a groove is formed around a second layer on a substrate, and a third layer of high reflectivity serving as an alignment mark is formed on the groove and at least on a part of the second layer. CONSTITUTION:Only the surface of a substrate 8 where a groove 12 is provided is exposed, a resist 17 is formed on the whole face, and the groove 12 is formed on the exposed surface of the substrate 8 around a second layer 11 through etching using a resist 16 on the second layer 11 and a new resist 17 as a mask. Then, the resists 16 and 17 are removed, an insulating layer 13 is formed on the whole face of the substrate 8, a third layer 14 of aluminum is formed on the insulating layer 13 covering the groove 12 and the second layer 11. By this setup, the groove 12 is provided to the surface of the substrate 8 around the second layer 11, whereby the third layer 14 can be made large in level difference at its sloping part and in reflectivity change due to scanning with laser rays.
    • 56. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH0378240A
    • 1991-04-03
    • JP21524589
    • 1989-08-21
    • MITSUBISHI ELECTRIC CORP
    • TAKANO SATOSHI
    • H01L21/66
    • PURPOSE:To correct the rotational deviations of a pad electrode and a probe needle by electrically connecting first, second and third pad electrodes on a chip and setting the circular extension directions of the second and third electrodes to reversely rotating direction to the contact position of the needle. CONSTITUTION:It is assumed that, when probe needles 6, 7, 8 are rotatably deviated to pad electrodes 3, 4a, 5a, the needle is, for example, rotated counterclockwise at the electrode 3 as a center. In this case, the needle 7 is disposed on the electrode 4a, but the needle 8 is removed from the electrode 5a. That is, since the needles 6, 7 are conducted, but the needles 6, 8 are not conducted. On the contrary, if it is rotatably deviated clockwise, the needles 6, 8 are conducted, but the needles 6, 7 are not conducted. The combination of conduction or nonconduction of the needles 6-8 is checked from this to know the direction of the rotational deviation of the needles 6-8. The combination signals are combined, its logic signal is input to a probe card rotating motor to be corrected.
    • 60. 发明专利
    • SEMICONDUCTOR STORAGE DEVICE
    • JPS5798186A
    • 1982-06-18
    • JP17671680
    • 1980-12-11
    • MITSUBISHI ELECTRIC CORP
    • TAKANO SATOSHI
    • G11C11/413G06F12/16G11C5/00G11C29/00G11C29/56
    • PURPOSE:To prevent a soft error generated in a memory unit without increasing the power consumption remarkably, by controlling the supply voltage of the memory unit by a signal from a radiant ray detecting unit. CONSTITUTION:This device is provided with a radiant ray detecting unit 15 for detecting a radiant ray which is made incident to a memory unit 11, so that supply voltage Vcc of the memory unit 11 is controlled by a radiant ray detecting signal TSG from this detecting unit 15. For instance, the radiant ray detecting unit 15 whose response speed is high, for detecting a thermal neutron NTN which is made incident to the memory unit 11 is placed so as to surround a part or the whole of the memory unit 11. In this state, an electric power supply unit 14 is controlled by a trigger signal TSG from this detecting unit 15, and supply voltage Vcc is held temporarily at a higher value than usual, only in the period in which an electron generated as a result of the fact that the thermal neutron NTN has been made incident to a memory chip is decreased to the extent of generating no soft error.