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    • 54. 发明授权
    • Method for producing metallic bit lines for memory cell arrays, method for producing memory cell arrays and memory cell array
    • 用于制造用于存储单元阵列的金属位线的方法,用于制造存储单元阵列的方法和存储单元阵列
    • US06686242B2
    • 2004-02-03
    • US09917867
    • 2001-07-26
    • Josef WillerRonald Kakoschke
    • Josef WillerRonald Kakoschke
    • H01L21336
    • H01L27/11568H01L27/105H01L27/115H01L27/11573
    • A method for producing bit lines for a memory cell array comprises as a first step the step of providing a layer structure which comprises a substrate having transistor wells implanted in a surface thereof, a sequence of storage medium layers provided on the surface of said substrate, and a gate region layer provided on said sequence of storage medium layers. Bit line recesses, which extend down to the sequence of storage medium layers, are produced in said gate region layer. Subsequently, insulating spacer layers are produced on lateral surfaces of said bit line recesses, whereupon a source/drain implantation is executed in the area of said bit line recesses, after a complete or partial removal of the sequence of storage medium layers. Following this, the substrate is exposed completely in the area of the bit line recesses, if this has not yet been done prior to the implantation. Subsequently, metallizations for producing metallic bit lines are produced on the exposed substrate, said metallizations being insulated from the gate region layer by the insulating spacer layers.
    • 一种用于产生存储单元阵列的位线的方法包括作为第一步骤的步骤,提供包括在其表面上注入晶体管阱的衬底的层结构,设置在所述衬底的表面上的一系列存储介质层, 以及设置在所述存储介质层序列上的栅极区域层。 在所述栅极区域层中产生向下延伸到存储介质层序列的位线凹槽。 随后,在所述位线凹槽的侧表面上产生绝缘间隔层,于是在完成或部分去除存储介质层序列之后,在所述位线凹槽的区域中执行源极/漏极注入。 接下来,如果在植入之前还没有完成,则衬底完全暴露在位线凹槽的区域中。 随后,在暴露的基板上制造用于制造金属位线的金属化,所述金属化通过绝缘间隔层与栅极​​区域层绝缘。
    • 55. 发明授权
    • Memory cell with trench transistor
    • 具有沟槽晶体管的存储单元
    • US06661053B2
    • 2003-12-09
    • US10022654
    • 2001-12-18
    • Josef WillerFrank LauDezsö Takacs
    • Josef WillerFrank LauDezsö Takacs
    • H01L2976
    • H01L29/792H01L27/115H01L29/78
    • A memory cell includes a storage transistor having the following structure and being dimensioned to shorten program and erase times. A semiconductor body includes a top surface and a trench formed therein having walls joined by a curved bottom. A source zone in the semiconductor body is doped from the top surface. A drain zone in the semiconductor body is doped from the top surface. Junctions of the source and drain zones are beneath each. A gate electrode on the top surface of the semiconductor body is disposed between the source zone and the drain zone in the trench. A dielectric layer isolates the gate electrode from the semiconductor body and acts as a storage medium. Each of the junctions intersects a respective one of the walls at a respective depth from the bottom. A respective spacing across the trench is defined at each depth.
    • 存储单元包括具有以下结构的存储晶体管,其尺寸被设计为缩短编程和擦除时间。 半导体本体包括顶表面和形成在其中的具有由弯曲底部连接的壁的沟槽。 半导体本体中的源区从顶表面掺杂。 半导体本体中的漏极区域从上表面掺杂。 源极和漏极区的接合点在每个下方。 半导体本体的顶表面上的栅电极设置在沟槽中的源区和漏区之间。 电介质层将栅电极与半导体本体隔离并用作存储介质。 每个连接点在与底部相应的深度处与相应的一个壁相交。 在每个深度处限定跨沟槽的相应间隔。
    • 56. 发明授权
    • Integrated circuit configuration and method for manufacturing it
    • 集成电路配置及其制造方法
    • US06576948B2
    • 2003-06-10
    • US09873231
    • 2001-06-04
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • Franz HofmannWolfgang KrautschneiderTill SchlösserJosef Willer
    • H01L27108
    • H01L27/108
    • An integrated circuit contains a planar first transistor and a diode. The diode is connected between a first source/drain region of the first transistor and a gate electrode of the first transistor such that a charge is impeded from discharging from the gate electrode to the first source/drain region. A diode layer that is part of the diode is disposed on a portion of the first source/drain region. A conductive structure that is an additional part of the diode is disposed above a portion of the gate electrode and is disposed on the diode layer. The diode can be configured as a tunnel diode. The diode layer can be produced by thermal oxidation. Only one mask is required for producing the diode. A capacitor can be disposed above the diode. The first capacitor electrode of the capacitor is connected to the conductive structure.
    • 集成电路包含平面第一晶体管和二极管。 二极管连接在第一晶体管的第一源极/漏极区域和第一晶体管的栅电极之间,使得电荷被阻止从栅电极放电到第一源极/漏极区域。 作为二极管的一部分的二极管层设置在第一源极/漏极区域的一部分上。 作为二极管的附加部分的导电结构设置在栅电极的一部分上方并且设置在二极管层上。 二极管可以配置为隧道二极管。 二极管层可以通过热氧化生产。 制造二极管只需要一个掩模。 电容器可以设置在二极管的上方。 电容器的第一电容器电极连接到导电结构。