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51. 发明申请

US20130059499A1 Semi-Quantitative Thickness Determination 有权
标题翻译：半定量厚度测定
公开(公告)号：US20130059499A1
公开(公告)日：2013-03-07
申请号：US13666578
申请日：2012-11-01
申请人： Dominic J. Benvegnu , Boguslaw A. Swedek , Jeffrey Drue David , Harry Q. Lee
发明人： Dominic J. Benvegnu , Boguslaw A. Swedek , Jeffrey Drue David , Harry Q. Lee
IPC分类号： B24B37/013 , B24B49/12
CPC分类号： H01L22/12 , B24B37/013 , B24B49/12 , H01L22/26
摘要： While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.
摘要翻译：当抛光衬底时，也照射来自光源的光。测量从基板的表面反射的光的当前光谱。在当前光谱中识别具有第一参数值的选定峰。使用处理器从查找表确定与第一参数相关联的第二参数的值。根据第二参数的值，改变衬底的抛光。可以测量在衬底的抛光之前从衬底反射的光的初始光谱，并且可以确定与初始光谱的选定峰对应的波长。

52. 发明申请

US20110104987A1 ENDPOINT METHOD USING PEAK LOCATION OF SPECTRA CONTOUR PLOTS VERSUS TIME 有权
标题翻译：使用峰值位置的端点方法维持时间的端点方法
公开(公告)号：US20110104987A1
公开(公告)日：2011-05-05
申请号：US12938240
申请日：2010-11-02
申请人： Jeffrey Drue David , Harry Q. Lee , Dominic J. Benvegnu , Boguslaw A. Swedek
发明人： Jeffrey Drue David , Harry Q. Lee , Dominic J. Benvegnu , Boguslaw A. Swedek
IPC分类号： B24B51/00
CPC分类号： G05B19/418 , B24B37/013 , B24B37/042 , B24B37/205 , B24B49/12 , G05B2219/45232
摘要： In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.
摘要翻译：在一个方面，抛光方法包括抛光衬底，以及接收所选择的光谱特征的识别和所选择的光谱特征的特征以在抛光期间进行监测。该方法包括测量在衬底被抛光时从衬底反射的光的光谱序列，其中序列的至少一些光谱由于在抛光期间被去除的材料而不同。抛光方法包括确定光谱序列中的每个光谱的所选光谱特征的特征值，以产生特征值的序列，将功能拟合到值序列，以及确定抛光端点或基于该功能的抛光速率的调整。

53. 发明申请

US20100297916A1 METHODS OF USING OPTICAL METROLOGY FOR FEED BACK AND FEED FORWARD PROCESS CONTROL 有权
标题翻译：使用光学计量学方法进行回馈和进给前进过程控制
公开(公告)号：US20100297916A1
公开(公告)日：2010-11-25
申请号：US12625345
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： B24B49/04 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.
摘要翻译：一种方法包括使用第一组参数来抛光第一台板上的基板，从至少两个区域获得多个测量光谱，将多个测量光谱与参考光谱进行比较，以评估至少两个区域，比较第一区域的厚度和第二区域的厚度，确定第一区域的厚度是否落在第二区域的厚度的预定范围内，并且如果厚度不在第二区域的厚度内预定范围，以下至少一个：a）调整第一组的至少一个参数并使用经调整的参数来研磨第一台上的第二基板，或b）调整第二组的至少一个参数并在一个第二个压盘使用调整参数。

54. 发明申请

US20100130100A1 USING OPTICAL METROLOGY FOR WAFER TO WAFER FEED BACK PROCESS CONTROL 有权
标题翻译：使用光学方程进行波形回馈过程控制
公开(公告)号：US20100130100A1
公开(公告)日：2010-05-27
申请号：US12625480
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： B24B49/02 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of the first set of parameters based on the difference, and polishing the second substrate on the first platen using the adjusted parameter.
摘要翻译：控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数基于所述差异的所述第一组参数，并且使用所述调整参数来研磨所述第一台板上的所述第二基板。

55. 发明申请

US20100129939A1 USING OPTICAL METROLOGY FOR WITHIN WAFER FEED FORWARD PROCESS CONTROL 有权
标题翻译：在波形进给前进过程控制中使用光学方程
公开(公告)号：US20100129939A1
公开(公告)日：2010-05-27
申请号：US12625489
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： H01L21/66 , G06F17/00
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of a second set of parameters based on the difference, and polishing the substrate on a second platen using the adjusted parameter.
摘要翻译：控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数基于所述差异的第二组参数，以及使用所述调整参数在所述第二压板上抛光所述衬底。

56. 发明申请

US20100114532A1 WEIGHTED SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING 审中-公开
标题翻译：加工过程中基体的加权光谱监测
公开(公告)号：US20100114532A1
公开(公告)日：2010-05-06
申请号：US12264094
申请日：2008-11-03
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu
IPC分类号： G01N21/25
CPC分类号： H01L22/12 , H01L22/20
摘要： A substrate having an outermost layer undergoing polishing and at least one underlying layer is irradiated with light. A sequence of current spectra is obtained with an in-situ optical monitoring system, a current spectrum from the sequence of current spectra being a spectrum of the light reflected from the substrate, wherein the current spectrum includes a range of wavelengths and, for all wavelengths in the range of wavelengths, a value corresponding to a wavelength. Further, a value of the current spectrum corresponding to a wavelength is modified with at least one value in a gain factor spectrum, wherein the gain factor spectrum includes a first range of wavelengths and, for all wavelengths in the first range of wavelengths, a value corresponding to a wavelength. The polishing of the outermost layer of the substrate is then changed based upon the modified value of the current spectrum.
摘要翻译：用光照射具有进行抛光的最外层和至少一个下层的基板。利用原位光学监测系统获得电流光谱序列，来自当前光谱序列的当前光谱是从衬底反射的光的光谱，其中当前光谱包括波长范围，并且对于所有波长在波长范围内，对应于波长的值。此外，对应于波长的当前光谱的值用增益因子光谱中的至少一个值进行修正，其中增益因子光谱包括第一波长范围，并且对于第一波长范围内的所有波长，值对应于波长。然后基于当前光谱的修改值改变衬底的最外层的抛光。

57. 发明申请

US20100056023A1 Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing 有权
标题翻译：通过在处理过程中使用基板的光谱监测来调整抛光速率
公开(公告)号：US20100056023A1
公开(公告)日：2010-03-04
申请号：US12553870
申请日：2009-09-03
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
IPC分类号： B24B49/06 , B24B49/12
CPC分类号： B24B37/005 , B24B37/013 , B24B49/12 , H01L21/302
摘要： A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
摘要翻译：计算机实现的方法包括从基板接收反射光的当前光谱序列; 将来自当前光谱序列的每个当前光谱与来自参考光谱库的多个参考光谱进行比较，以生成最佳匹配参考光谱的序列; 确定最佳匹配参考光谱序列的拟合优度; 以及基于拟合优度确定是否调整抛光速率或抛光速率的调整中的至少一个。

58. 发明授权

US07406394B2 Spectra based endpointing for chemical mechanical polishing 有权
标题翻译：基于光谱的化学机械抛光终点
公开(公告)号：US07406394B2
公开(公告)日：2008-07-29
申请号：US11261742
申请日：2005-10-28
申请人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
发明人： Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David
IPC分类号： G01B5/02 , G01B7/02 , G01B11/02 , G01B13/02
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , G05B15/02 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.
摘要翻译：用于基于频谱的终点的方法和装置。一种终点方法包括选择两个或更多个参考光谱。每个参考光谱是在第一衬底上从感兴趣的膜反射的白光的光谱，并且具有大于目标厚度的厚度。为特定的基于光谱的端点确定逻辑选择参考光谱，以便通过应用特定的基于光谱的端点逻辑来调用端点时实现目标厚度。该方法包括获得两个或更多个当前光谱。每个电流光谱是当感兴趣的膜经受抛光步骤并且具有大于目标厚度的电流厚度时，在第二衬底上从感兴趣的膜反射的白光的光谱。该方法包括为第二基底确定何时已经实现了抛光步骤的终点。

59. 发明授权

US08260446B2 Spectrographic monitoring of a substrate during processing using index values 有权
标题翻译：使用指标值对处理过程中的基板进行光谱监测
公开(公告)号：US08260446B2
公开(公告)日：2012-09-04
申请号：US12699014
申请日：2010-02-02
申请人： Jeffrey Drue David , Dominic Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , B24B49/00 , G01B11/28
CPC分类号： G05B15/02 , B24B37/013 , B24B49/12
摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.
摘要翻译：描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

60. 发明授权

US08467896B2 Feedback for polishing rate correction in chemical mechanical polishing 有权
标题翻译：化学机械抛光抛光率校正的反馈
公开(公告)号：US08467896B2
公开(公告)日：2013-06-18
申请号：US13480434
申请日：2012-05-24
申请人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q. Lee
发明人： Jun Qian , Charles C. Garretson , Sivakumar Dhandapani , Jeffrey Drue David , Harry Q. Lee
IPC分类号： G06F19/00 , B24B49/04 , B24B49/12
CPC分类号： B24B49/04 , B24B49/12
摘要： A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
摘要翻译：研磨具有多个区域的基板并测量光谱。对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引预计时间比没有这样的调整。基于对先前基板计算的反馈误差来计算调整。基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

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