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51. 发明授权

US06150730A Chip-scale semiconductor package 有权
标题翻译：芯片级半导体封装
公开(公告)号：US06150730A
公开(公告)日：2000-11-21
申请号：US349231
申请日：1999-07-08
申请人： Chih-Ming Chung , Kuo-Pin Yang , Jen-Kuang Fang , Su Tao
发明人： Chih-Ming Chung , Kuo-Pin Yang , Jen-Kuang Fang , Su Tao
IPC分类号： H01L23/495 , H01L23/498 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/4951 , H01L23/49816 , H01L23/49827 , H01L24/50 , H01L2924/14
摘要： A chip-scale semiconductor package mainly includes a semiconductor chip, a substrate and a package body. Said chip is attached onto said substrate by an adhesive layer. Said chip has a plurality of bonding pads formed thereon. Said adhesive layer has an aperture corresponding to the bonding pads of said chip such that the bonding pads can be exposed within an aperture. Said substrate has several through-holes respectively corresponding to the bonding pads of said chip and parts of the area around the edge of said chip for dispensing of encapsulant after the soldering of leads of said substrate to the bonding pads of said chip. The encapsulant dispensed into the through-holes can flow from the surface of said chip to the edge thereof. Said package body has one portion provided within the through-hole of said substrate and another portion provided around the edge of said chip whereby encapsulation process is accomplished without having to turn the whole semiconductor package device.
摘要翻译：芯片级半导体封装主要包括半导体芯片，基板和封装体。所述芯片通过粘合剂层附着在所述基板上。所述芯片具有形成在其上的多个接合焊盘。所述粘合剂层具有对应于所述芯片的焊盘的孔，使得焊盘可以暴露在孔内。所述衬底具有分别对应于所述芯片的焊盘和所述芯片的边缘周围区域的部分的多个通孔，用于在将所述衬底的引线焊接到所述芯片的焊盘之后分配密封剂。分配到通孔中的密封剂可以从所述芯片的表面流动到其边缘。所述封装体具有设置在所述基板的通孔内的一部分和设置在所述芯片的边缘周围的另一部分，从而实现封装处理而不必转动整个半导体封装器件。

52. 发明授权

US6048184A Back-pressure sealing system for revolving compressor 失效
标题翻译：旋转压缩机背压密封系统
公开(公告)号：US6048184A
公开(公告)日：2000-04-11
申请号：US979274
申请日：1997-11-26
申请人： Yu-Choung Chang , Tse-Liang Hsiao , Su Tao , Kun-I Liang , Chun-Chung Yang , Ann Huang , Ching-Feng Lai
发明人： Yu-Choung Chang , Tse-Liang Hsiao , Su Tao , Kun-I Liang , Chun-Chung Yang , Ann Huang , Ching-Feng Lai
IPC分类号： F04C27/00 , F01C1/02
CPC分类号： F04C27/005
摘要： A back-pressure sealing system for a revolving compressor, comprising: a stator with an outlet on the upper side and a neck, surrounding the outlet; a separating part above the stator, separating a low-pressure zone around the stator from a high-pressure zone above the outlet and having a central opening around the neck; a connecting system between the upper and lower sides of the separating part; a first sealing device for sealing the neck of the stator against the central opening of the separating part; and a second sealing device for sealing the connecting system; wherein the back-pressure from the high-pressure zone is used to tighten the first and second sealing devices for a good sealing effect and thus good effectiveness of the compressor.
摘要翻译：一种用于旋转压缩机的背压密封系统，包括：定子，其具有在上侧的出口和颈部，围绕出口; 在定子上方的分离部分，将位于定子周围的低压区与出口上方的高压区分离，并且具有围绕颈部的中心开口; 分离部分的上侧和下侧之间的连接系统; 第一密封装置，用于将定子的颈部密封抵靠分离部分的中心开口; 以及用于密封连接系统的第二密封装置; 其中来自高压区的背压用于紧固第一和第二密封装置，以获得良好的密封效果，从而使压缩机具有良好的效果。

53. 发明授权

US5921762A Oldham ring system for rotary fluid apparatus 失效
标题翻译：用于旋转流体装置的十字环系统
公开(公告)号：US5921762A
公开(公告)日：1999-07-13
申请号：US668150
申请日：1996-06-21
申请人： Yu-Choung Chang , Chih-Cheng Yang , Tse-Liang Hsiao , Ching-Feng Lai , Kun-I Liang , Su Tao
发明人： Yu-Choung Chang , Chih-Cheng Yang , Tse-Liang Hsiao , Ching-Feng Lai , Kun-I Liang , Su Tao
IPC分类号： F01C17/06 , F01C1/04
CPC分类号： F01C17/066
摘要： An Oldham ring system for a rotary fluid compressor, comprising: a motor shaft; an eccentric shaft; a revolving part with two first gliding elements on its lower side; a stator; an Oldham ring, its upper side being provided with two second gliding elements fitting the two first gliding elements, and its lower side being provided with two third gliding elements for a perpendicular gliding movement; and a frame, on its perimeter being provided with two holders and with two fourth gliding elements in between that glide against said third gliding elements; wherein the characteristic is that the Oldham ring is, on the two opposite sides located next to the holders of the frame, provided with two straight shortcuts to reduce the width of the Oldham ring next to the holders; and wherein the first and second gliding elements as well as the third and fourth gliding elements each are provided with a groove in the gliding direction to provide for a flow path for lubricating oil.
摘要翻译：一种用于旋转流体压缩机的奥德姆环系，包括：电动机轴; 偏心轴; 在其下侧具有两个第一滑动元件的旋转部分; 定子一个十字形环，其上侧设有安装两个第一滑动元件的两个第二滑动元件，并且其下侧设置有用于垂直滑动运动的两个第三滑动元件; 并且框架在其周边上设置有两个保持器，并且两个第四滑动元件在其间滑动抵靠所述第三滑动元件; 其特征在于，所述十字戒指在位于所述框架的所述支架的旁边的两个相对侧上设置有两个直线快捷键，以减小所述支架旁边的所述十字形环的宽度; 并且其中所述第一和第二滑动元件以及所述第三和第四滑动元件各自设置有滑动方向的凹槽以提供用于润滑油的流动路径。

54. 发明授权

US07253529B2 Multi-chip package structure 有权
标题翻译：多芯片封装结构
公开(公告)号：US07253529B2
公开(公告)日：2007-08-07
申请号：US11026797
申请日：2004-12-31
申请人： Su Tao , Yu-Fang Tsai
发明人： Su Tao , Yu-Fang Tsai
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/03 , H01L23/3128 , H01L23/3135 , H01L23/4334 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73215 , H01L2225/06506 , H01L2225/0651 , H01L2225/06572 , H01L2225/1023 , H01L2225/1052 , H01L2924/00014 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a multi-chip package structure, comprising a first substrate, a first chip, a sub-package and a first molding compound. The first chip is attached to the first substrate. The first molding compound encapsulates the first chip, the sub-package and the top surface of the first substrate. The bottom surface of the sub-package is attached to the first chip. The sub-package comprises a second substrate, a second chip and a second molding compound. The second substrate has a top surface and a bottom surface, and is electrically connected to the first chip. The second chip is attached to the top surface of the second substrate to which the second chip is electrically connected. The second molding compound encapsulates the second chip and part of the top surface of the second substrate. Whereby, the relative large area caused by the parallel arrangement of a plurality of conventional package structures can be reduced, and there is no need to redesign signal-transmitting path.
摘要翻译：本发明涉及一种多芯片封装结构，包括第一基板，第一芯片，子封装和第一模塑料。第一芯片附接到第一基板。第一模塑料封装第一芯片，子封装和第一衬底的顶表面。子封装的底表面附接到第一芯片。该子组件包括第二衬底，第二芯片和第二模塑料。第二基板具有顶表面和底表面，并且电连接到第一芯片。第二芯片附接到第二芯片电连接到的第二基板的顶表面。第二模塑料包封第二芯片和第二基板顶表面的一部分。由此，可以减少由多个常规封装结构的平行布置引起的相对大的面积，并且不需要重新设计信号传输路径。

55. 发明授权

US07151308B2 Semiconductor chip package 有权
标题翻译：半导体芯片封装
公开(公告)号：US07151308B2
公开(公告)日：2006-12-19
申请号：US10791896
申请日：2004-03-04
申请人： Su Tao , Shih Chang Lee
发明人： Su Tao , Shih Chang Lee
IPC分类号： H01L23/58
CPC分类号： H01L23/36 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/07811 , H01L2924/15311 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor chip package includes an interconnection substrate, a central substrate, a peripheral substrate and a semiconductor chip sandwiched between the interconnection substrate and the central substrate. The interconnection substrate has a recessed cavity for receiving the semiconductor chip. The peripheral substrate is separated from the central substrate thereby decreasing the stresses caused by CTE mismatch of the semiconductor chip package. Furthermore, both the central substrate and the peripheral substrate are mechanically and electrically connected to the interconnection substrate such that the semiconductor chip is electrically connected to the peripheral substrate through the central substrate and the interconnection substrate.
摘要翻译：半导体芯片封装包括互连衬底，中心衬底，外围衬底和夹在互连衬底和中心衬底之间的半导体芯片。互连基板具有用于接收半导体芯片的凹腔。外围基板与中心基板分离，从而减小由半导体芯片封装的CTE失配引起的应力。此外，中心基板和周边基板都与机械地和电连接到互连基板，使得半导体芯片通过中心基板和互连基板电连接到外围基板。

56. 发明授权

US07002805B2 Thermal enhance MCM package and manufacturing method thereof 有权
标题翻译：热增强MCM封装及其制造方法
公开(公告)号：US07002805B2
公开(公告)日：2006-02-21
申请号：US10747037
申请日：2003-12-30
申请人： Shih-Chang Lee , Su Tao , Chian-Chi Lin
发明人： Shih-Chang Lee , Su Tao , Chian-Chi Lin
IPC分类号： H05K7/20
CPC分类号： H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/1023 , H01L2225/107 , H01L2225/1082 , H01L2225/1094 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/15331 , H01L2924/16152 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity. The cavity not only accommodates the first package, the first carrier, the second package, the second carrier and the intermediate substrate but also provides alignment mechanism by the supporting portion and the alignment portion to prevent the dislocation after all the components of the thermal enhance MCM package are connected with each other. Furthermore, the first carrier has a first side and the second carrier has a second side. The first side and the second side both have grounding portions, for example recessed portions and metal layers, for providing a ground shielding of the first package and the second package against the outside. In addition, the grounding portions also provide thermal paths to increase the ability of the heat dissipation. Besides, a method for manufacturing the thermal enhance MCM package is provided.
摘要翻译：热增强多芯片模块（MCM）封装主要包括第一封装，第一载体，第二封装，第二载体，中间基板和帽状散热器。中间基板具有开口。第一载体和第二载体分别电连接到第一封装和第二封装。第二包装被容纳在开口中并且经由第一载体，第二载体和中间载体电连接到第一封装。帽状散热器具有支撑部分和对准部分，其中支撑部分连接到对准部分以限定空腔。空腔不仅容纳第一封装，第一载体，第二封装，第二载体和中间基板，而且还通过支撑部分和对准部分提供对准机构，以防止在热增强MCM的所有部件的所有部件之后的位错包装相互连接。此外，第一载体具有第一侧，第二载体具有第二侧。第一侧和第二侧都具有接地部分，例如凹部和金属层，用于提供第一包装和第二包装的接地屏蔽抵抗外部。此外，接地部分还提供热路径以增加散热能力。此外，还提供了一种用于制造热增强MCM封装的方法。

57. 发明申请

US20060001136A1 Quad flat non-leaded package 有权
公开(公告)号：US20060001136A1
公开(公告)日：2006-01-05
申请号：US11170309
申请日：2005-06-29
申请人： Su Tao , Chi-Wen Chang
发明人： Su Tao , Chi-Wen Chang
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2924/00014 , H01L2924/01079 , H01L2924/00 , H01L2924/00015 , H01L2224/05599
摘要： The present invention relates to a quad flat non-leaded package comprising: a lead frame, a semiconductor chip, a plurality of connecting wires and a molding compound. The lead frame has a plurality of leads, a die pad, a plurality of supporting bars and an external ring. The external ring is disposed around the die pad and is in contact with the semiconductor chip so as to increase the supporting to the semiconductor chip. The area of the semiconductor chip is larger than that of the die pad, and the semiconductor chip is attached to the die pad through its active surface. The molding compound encapsulates the lead frame, semiconductor chip and connecting wires, wherein part of the leads of the lead frame is exposed to the outside of the molding compound so as to be electrically connected to an external device.

58. 发明授权

US06967153B2 Bump fabrication process 有权
标题翻译：凸起制造工艺
公开(公告)号：US06967153B2
公开(公告)日：2005-11-22
申请号：US10248688
申请日：2003-02-10
申请人： Ho-Ming Tong , Chun-Chi Lee , Jen-Kuang Fang , Min-Lung Huang , Jau-Shoung Chen , Ching-Huei Su , Chao-Fu Weng , Yung-Chi Lee , Yu-Chen Chou , Tsung-Hua Wu , Su Tao
发明人： Ho-Ming Tong , Chun-Chi Lee , Jen-Kuang Fang , Min-Lung Huang , Jau-Shoung Chen , Ching-Huei Su , Chao-Fu Weng , Yung-Chi Lee , Yu-Chen Chou , Tsung-Hua Wu , Su Tao
IPC分类号： H01L21/60 , H05K3/34 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/1147 , H01L2224/11472 , H01L2224/11474 , H01L2224/13099 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3484 , H05K2201/09863 , H05K2203/043 , H05K2203/0568 , H05K2203/0594
摘要： A bump fabrication process for forming a bump over a wafer having a plurality of bonding pads thereon is provided. A patterned solder mask layer having a plurality of openings that exposes the respective bonding pads is formed over a wafer. The area of the opening in a the cross-sectional area through a the bottom-section as well as through a the top-section of the opening is smaller than the area of the opening in a the cross-sectional area through a the mid-section of the opening. Solder material is deposited into the opening and then a reflow process is conducted fusing the solder material together to form a spherical bump inside the opening. Finally, the solder mask layer is removed. In addition, a pre-formed bump may form on the bonding pad of the wafer prior to forming the patterned solder mask layer over the wafer having at least with an opening that exposes the pre-formed bump. Solder material is deposited into the openings and then a reflow process is conducted fusing the solder material and the pre-formed bump together to form a spherical bump. The pre-formed bump and the solder material may be fabricated using different constituents.
摘要翻译：提供了一种用于在其上具有多个接合焊盘的晶片上形成凸块的凸块制造工艺。具有暴露各个接合焊盘的多个开口的图案化焊接掩模层形成在晶片上。通过底部的横截面积中的开口面积以及通过开口的顶部的开口面积比通过中间部分的横截面积的开口面积小，部分开幕。将焊料沉积到开口中，然后进行回流工艺，将焊料材料熔合在一起，以在开口内形成球形凸块。最后，去除焊接掩模层。此外，在晶片上形成图案化的焊料掩模层之前，至少具有暴露预形成的凸块的开口之前，可以在晶片的焊盘上形成预形成的凸块。将焊料沉积到开口中，然后进行回流工艺，将焊料材料和预形成的凸块熔合在一起形成球形凸块。可以使用不同的成分制造预形成的凸块和焊料材料。

59. 发明申请

US20050233571A1 Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps 审中-公开
标题翻译：倒装芯片封装，具有凸块的半导体封装和用于制造具有凸块的半导体封装的方法
公开(公告)号：US20050233571A1
公开(公告)日：2005-10-20
申请号：US10921967
申请日：2004-08-20
申请人： Su Tao , Min-Lung Huang , Ho-Ming Tong
发明人： Su Tao , Min-Lung Huang , Ho-Ming Tong
IPC分类号： H01L21/44 , H01L21/48 , H01L21/56 , H01L23/48 , H01L23/485 , H01L23/498
CPC分类号： H01L21/563 , H01L23/49816 , H01L23/49838 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/13099 , H01L2224/14051 , H01L2224/73203 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/30107
摘要： A semiconductor chip with bumps formed therein comprises an active surface, a plurality of bonding pads, a passivation layer, a plurality of first UBMs (under bump metallurgy), a second UBM, a plurality of first bumps, and a plurality of second bumps. The bonding pads are disposed on the active surface of the semiconductor chip. The passivation layer covers the active surface of the semiconductor chip with the pads exposed out of the passivation layer. The first UMBs are individually disposed on the bonding pads. The second UMB is disposed on at least two of the bonding pads. The first bumps are disposed on the first UMBs. The second bumps are disposed on the second UBM.
摘要翻译：其中形成有凸起的半导体芯片包括有源表面，多个接合焊盘，钝化层，多个第一UBM（凸块下冶金），第二UBM，多个第一凸块和多个第二凸块。接合焊盘设置在半导体芯片的有源表面上。钝化层覆盖半导体芯片的有源表面，其中焊盘暴露在钝化层之外。第一UMB分别设置在接合焊盘上。第二UMB设置在至少两个接合焊盘上。第一个颠簸位于第一个UMB上。第二凸块设置在第二UBM上。

60. 发明申请

US20050161812A1 WAFER-LEVEL PACKAGE STRUCTURE 审中-公开
标题翻译：水平包装结构
公开(公告)号：US20050161812A1
公开(公告)日：2005-07-28
申请号：US10907744
申请日：2005-04-14
申请人： Ho-Ming Tong , Chun-Chi Lee , Jen-Kuang Fang , Min-Lung Huang , Jau-Shou Chen , Ching-Huei Su , Chao-Fu Weng , Yung-Chi Lee , Yu-Chen Chou , Tsung-Hua Wu , Su Tao
发明人： Ho-Ming Tong , Chun-Chi Lee , Jen-Kuang Fang , Min-Lung Huang , Jau-Shou Chen , Ching-Huei Su , Chao-Fu Weng , Yung-Chi Lee , Yu-Chen Chou , Tsung-Hua Wu , Su Tao
IPC分类号： H01L23/31 , H01L23/485 , H01L23/48
CPC分类号： H01L24/10 , H01L23/3107 , H01L24/13 , H01L24/48 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05027 , H01L2224/0508 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/13 , H01L2224/131 , H01L2224/48237 , H01L2224/48257 , H01L2224/48464 , H01L2924/00013 , H01L2924/00014 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wafer-level package structure, applicable to a flip-chip type arrangement on a carrier having a plurality of contact points is described. This wafer-level package structure comprises a chip having a protective layer and a plurality of bonding pads and a conductive layer. The conductive layer is arranged on the bonding pads of the chip as contact points. The wafer-level package structure can further include a heat sink to enhance the heat dissipation ability of the package structure.
摘要翻译：描述了可应用于具有多个接触点的载体上的倒装芯片型布置的晶片级封装结构。该晶片级封装结构包括具有保护层和多个焊盘和导电层的芯片。导电层设置在芯片的焊盘上作为接触点。晶片级封装结构还可以包括散热器，以增强封装结构的散热能力。

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