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    • 52. 发明授权
    • Connector which can be increased in holding strength with respect to a substrate
    • 可以相对于基板保持强度增加的连接器
    • US07309254B2
    • 2007-12-18
    • US11541004
    • 2006-09-29
    • Mamoru SuzukiMasaki YamashitaKazukuni HisatomiKazuhito Hisamatsu
    • Mamoru SuzukiMasaki YamashitaKazukuni HisatomiKazuhito Hisamatsu
    • H01R13/66
    • H01R12/7052H01R12/707H01R12/725
    • In a connector to be mounted to a substrate, a strengthening member is coupled to a housing holding a contact The strengthening member is adapted to fix the housing to the substrate and includes a side plate portion extending in a direction away from the substrate in a state where the connector is mounted to the substrate, a top plate portion adjacent to the side plate portion and faced to the substrate, and first and second mounting portions to be attached to the substrate, The first mounting portion extends from an end of the side plate portion adjacent to the substrate in a widthwise direction of the housing perpendicular to a fitting direction in which a mating connector is fitted to the connector. The second mounting portion extends from the top plate portion at a side opposite to a fitting side to be fitted to the mating connector.
    • 在要安装到基板的连接器中,加强构件联接到保持接触件的壳体。加强构件适于将壳体固定到基板,并且包括在一个状态下沿远离基板的方向延伸的侧板部分 其中所述连接器安装到所述基板,邻近所述侧板部分并面向所述基板的顶板部分以及要附接到所述基板的第一和第二安装部分。所述第一安装部分从所述侧板的一端延伸 垂直于配合连接器装配到连接器的装配方向的与壳体的宽度方向相邻的部分。 第二安装部分在与装配侧相对的一侧从顶板部分延伸以配合到配合连接器。
    • 59. 发明授权
    • Apparatus used in surface treatment and a method of surface treatment
using said apparatus
    • 用于表面处理的装置和使用所述装置的表面处理方法
    • US4361605A
    • 1982-11-30
    • US262429
    • 1981-05-11
    • Yoshinobu TakahashiYasuo TokushimaKentarou OgataMamoru SuzukiZyouzi Ito
    • Yoshinobu TakahashiYasuo TokushimaKentarou OgataMamoru SuzukiZyouzi Ito
    • C23C22/73B65C3/10C23C22/00C23C22/76C23F1/08C25D17/00C25D21/18C23F7/08
    • B65C3/10C23C22/00Y02P70/30
    • An apparatus used in surface treatment and a method of surface treatment using said apparatus are provided in the present invention.Said apparatus comprises a dipping tank forming one or more hoppers in its bottom, a drain path connected to said hoppers, a solid-liquid separator settled in said drain path, a recirculating path for supernatant from said separator, and a spraying tool connected to said recirculating path and arranged in the rear part of the dipping tank; and said method of surface treatment using said apparatus comprises dipping an article-to-be-treated in a treating liquid in a dipping tank forming one or more hoppers in its bottom, purging sludge formed and settling during said dipping through a drain path connected to said hoppers, separating said sludge by a solid-liquid separator settled in said drain path, recirculating supernatant through a recirculating path from said separator to a spraying tool connected to said recirculating path and arranged in the rear part of dipping tank, and spraying said supernatant from said spraying tool to the treated surface of an article after dipping.
    • 在本发明中提供了用于表面处理的装置和使用所述装置的表面处理方法。 所述设备包括在其底部形成一个或多个料斗的浸渍槽,连接到所述料斗的排放通道,沉降在所述排水路径中的固液分离器,用于来自所述分离器的上清液的再循环路径,以及连接到所述 循环路径,并布置在浸渍槽的后部; 并且所述使用所述装置的所述表面处理方法包括将处理液中的待处理液浸入形成在其底部的一个或多个料斗的浸渍槽中,在所述浸渍期间清洗形成的淤泥和沉淀,通过连接到 所述料斗将沉淀在所述排水路径中的固 - 液分离器分离所述污泥,将上清液循环通过从所述分离器到连接到所述再循环路径并连接到所述再循环路径的喷涂工具的再循环路径,并布置在浸渍槽的后部,并喷洒所述上清液 在浸渍之后从所述喷涂工具到处理过的表面。