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    • 53. 发明授权
    • Method of manufacturing a thin film transistor device
    • 制造薄膜晶体管器件的方法
    • US06806125B2
    • 2004-10-19
    • US09993492
    • 2001-11-27
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L2100
    • H01L21/02672G09G2300/0408H01L21/02532H01L21/2022H01L27/1251H01L27/1277H01L27/1281H01L29/66757
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得泄漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。
    • 55. 发明授权
    • Thin film transistor
    • 薄膜晶体管
    • US5563426A
    • 1996-10-08
    • US341106
    • 1994-11-18
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L21/20H01L21/336H01L21/77H01L21/84H01L29/76H01L27/108H01L29/04
    • H01L29/66757H01L21/2022H01L27/1277G09G2300/0408
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜上或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下进行退火, 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得泄漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。
    • 56. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US5403772A
    • 1995-04-04
    • US160908
    • 1993-12-03
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • Hongyong ZhangHideki UochiToru TakayamaTakeshi FukunagaYasuhiko Takemura
    • H01L21/20H01L21/336H01L21/77H01L21/84
    • H01L29/66757H01L21/2022H01L27/1277G09G2300/0408
    • A method for manufacturing a semiconductor device such as a thin film transistor using a crystal silicon film is provided. The crystal silicon film is obtained by selectively forming films, particles or clusters containing nickel, iron, cobalt, ruthenium, rhodium, paradium, osmium, iridium, platinum, scandium, titanium, vanadium, chrome, manganese, copper, zinc, gold, silver or silicide thereof in a form of island, line, stripe, dot or film on or under an amorphous silicon film and using them as a starting point, by advancing its crystallization by annealing at a temperature lower than a normal crystallization temperature of an amorphous silicon. A transistor whose leak current is low and a transistor in which a mobility is high are obtained in the same time in structuring a dynamic circuit having a thin film transistor by selectively forming a cover film on a semiconductor layer which is to become an active layer of the transistor and by thermally crystallizing it thereafter.
    • 提供了使用晶体硅膜制造诸如薄膜晶体管的半导体器件的方法。 通过选择性地形成包含镍,铁,钴,钌,铑,钯,锇,铱,铂,钪,钛,钒,铬,锰,铜,锌,金,银的薄膜,颗粒或簇而获得晶体硅膜 或其硅化物以岛状,线状,条状,点状或薄膜形式存在于非晶硅膜的上方或下方,并以它们为起始点,通过在比非晶硅的正常结晶温度低的温度下退火进行其结晶化 。 通过在要成为有源层的半导体层上选择性地形成覆盖膜,通过在构成具有薄膜晶体管的动态电路的同时获得泄漏电流低的晶体管和迁移率高的晶体管 晶体管,然后通过其热结晶。
    • 58. 发明授权
    • Liquid crystal display device having particular conductive layer
    • 具有特定导电层的液晶显示装置
    • US08665411B2
    • 2014-03-04
    • US13484800
    • 2012-05-31
    • Hongyong Zhang
    • Hongyong Zhang
    • G02F1/1339G02F1/1345
    • G02F1/136286G02F1/1339G02F1/13454
    • Techniques are provided for unifying steps of sealing material so that the yield and the reliability of a liquid-crystal display device become high. A starting film of scanning lines is patterned so that prismatic dummy wirings 301 for the first layer which are not electrically connected are formed in regions R1 and R2, and wirings 302 extending from the pixel section are formed in a region R3, and wirings 303 having connection end portions 303a are formed in a region R4. After an interlayer insulation film is formed, the starting film of the signal lines is patterned so that the dummy wirings 304 for the second layer are formed to embed the gaps between the wirings 301 to 303, and also the wirings 305 and the wirings 303 which extend from the pixel portion are connected to each other. This permits unification of the cross-sectional structure of the sealing material formation region.
    • 提供了用于统一密封材料的步骤的技术,使得液晶显示装置的成品率和可靠性变高。 扫描线的起始膜被图案化,使得在区域R1和R2中形成不电连接的第一层的棱形虚拟布线301,并且从像素部分延伸的布线302形成在区域R3中,并且布线303具有 连接端部303a形成在区域R4中。 在形成层间绝缘膜之后,将信号线的起始膜图案化,以形成用于第二层的虚拟布线304,以将布线301至303之间的间隙,以及布线305和布线303 从像素部分延伸的相互连接。 这允许密封材料形成区域的横截面结构的统一。