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51. 发明授权

US08399927B2 Semiconductor structure including a high performance fet and a high voltage fet on an SOI substrate 有权
标题翻译：包括在SOI衬底上的高性能fet和高电压fet的半导体结构
公开(公告)号：US08399927B2
公开(公告)日：2013-03-19
申请号：US13367646
申请日：2012-02-07
申请人： Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Zhenrong Jin , Xuefeng Liu , Yun Shi
发明人： Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Zhenrong Jin , Xuefeng Liu , Yun Shi
IPC分类号： H01L27/148
CPC分类号： H01L27/088 , H01L21/823462 , H01L21/823481 , H01L27/1207
摘要： A first field effect transistor includes a gate dielectric and a gate electrode located over a first portion of a top semiconductor layer in a semiconductor-on-insulator (SOI) substrate. A second field effect transistor includes a portion of a buried insulator layer and a source region and a drain region located underneath the buried insulator layer. In one embodiment, the gate electrode of the second field effect transistor is a remaining portion of the top semiconductor layer. In another embodiment, the gate electrode of the second field effect transistor is formed concurrently with the gate electrode of the first field effect transistor by deposition and patterning of a gate electrode layer. The first field effect transistor may be a high performance device and the second field effect transistor may be a high voltage device. A design structure for the semiconductor structure is also provided.
摘要翻译：第一场效应晶体管包括栅极电介质和位于绝缘体上半导体（SOI））衬底中顶部半导体层的第一部分上方的栅电极。第二场效应晶体管包括掩埋绝缘体层的一部分和位于掩埋绝缘体层下方的源区和漏区。在一个实施例中，第二场效应晶体管的栅电极是顶部半导体层的剩余部分。在另一个实施例中，第二场效应晶体管的栅极通过栅极电极层的沉积和图案化与第一场效应晶体管的栅电极同时形成。第一场效应晶体管可以是高性能器件，第二场效应晶体管可以是高电压器件。还提供了用于半导体结构的设计结构。

52. 发明申请

US20120329219A1 THROUGH WAFER VIAS AND METHOD OF MAKING SAME 有权
标题翻译：通过WAVER VIAS及其制作方法
公开(公告)号：US20120329219A1
公开(公告)日：2012-12-27
申请号：US13604731
申请日：2012-09-06
申请人： Hanyi Ding , Alvin Jose Joseph , Anthony Kendall Stamper
发明人： Hanyi Ding , Alvin Jose Joseph , Anthony Kendall Stamper
IPC分类号： H01L21/768 , H01L21/336 , H01L21/02 , H01L21/762
CPC分类号： H01L21/76898 , H01L21/6835 , H01L21/823475 , H01L21/823481 , H01L23/481 , H01L23/66 , H01L24/05 , H01L24/10 , H01L24/12 , H01L24/13 , H01L25/0657 , H01L25/50 , H01L2221/68372 , H01L2223/6616 , H01L2224/0401 , H01L2224/0557 , H01L2224/13 , H01L2224/13025 , H01L2224/13099 , H01L2224/2518 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/0105 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/00 , H01L2224/05552
摘要： A method of forming and structure for through wafer vias and signal transmission lines formed of through wafer vias. The method of forming through wafer vias includes forming an array of through wafer vias comprising at least one electrically conductive through wafer via and at least one electrically non-conductive through wafer via through a semiconductor substrate having a top surface and an opposite bottom surface, each through wafer via of the array of through wafer vias extending from the top surface of the substrate to the bottom surface of the substrate.
摘要翻译：用于通过晶片通孔形成和结构的方法，所述晶片通孔和通过晶片通孔形成的信号传输线。通过晶片通孔形成的方法包括通过半导体衬底形成贯穿晶片通孔的阵列，其包括至少一个导电晶片通孔和至少一个不导电的晶片通孔，该半导体衬底具有顶表面和相对的底表面通过晶片通孔从衬底的顶表面延伸到衬底的底表面的通过晶片通孔的阵列。

53. 发明申请

US20120326798A1 ON-CHIP TRANSMISSION LINE STRUCTURES WITH BALANCED PHASE DELAY 有权
标题翻译：具有平衡相位延迟的片上传输线结构
公开(公告)号：US20120326798A1
公开(公告)日：2012-12-27
申请号：US13168512
申请日：2011-06-24
申请人： Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Xuefeng Liu
发明人： Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Xuefeng Liu
IPC分类号： H01P3/08 , H05K13/00 , H05K9/00 , G06F17/50
CPC分类号： H01L23/5222 , H01L23/5225 , H01L23/66 , H01L2223/6638 , H01L2924/0002 , H01P1/184 , Y10T29/49117 , H01L2924/00
摘要： A transmission wiring structure, associated design structure and associated method for forming the same. A structure is disclosed having: a plurality of wiring levels formed on a semiconductor substrate; a pair of adjacent first and second signal lines located in the wiring levels, wherein the first signal line comprises a first portion formed on a first wiring level and a second portion formed on a second wiring level; a primary dielectric structure having a first dielectric constant located between the first portion and a ground shield; and a secondary dielectric structure having a second dielectric constant different than the first dielectric constant, the secondary dielectric structure located between the second portion and the ground shield, and the second dielectric layer extending co-planar with the second portion and having a length that is substantially the same as the second portion.
摘要翻译：一种传输线路结构，相关设计结构及其相关方法。公开了一种结构，其具有：形成在半导体衬底上的多个布线层; 位于布线层中的一对相邻的第一和第二信号线，其中第一信号线包括形成在第一布线层上的第一部分和形成在第二布线层上的第二部分; 第一介电结构，其具有位于第一部分和接地屏蔽之间的第一介电常数; 以及具有不同于所述第一介电常数的第二介电常数的次级介电结构，所述第二介电结构位于所述第二部分和所述接地屏蔽之间，并且所述第二电介质层与所述第二部分共面延伸并且具有长度为基本上与第二部分相同。

54. 发明申请

US20120264289A1 INTEGRATED CIRCUIT INTERCONNECT STRUCTURE 失效
标题翻译：集成电路互连结构
公开(公告)号：US20120264289A1
公开(公告)日：2012-10-18
申请号：US13531015
申请日：2012-06-22
申请人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
发明人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
IPC分类号： H01L21/768
CPC分类号： H01L23/528 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line.
摘要翻译：一种集成电路（IC）互连结构，其包括位于电介质中并且在一端耦合到高电流器件的第一通孔和位于电介质中的缓冲金属段，并在其相对端耦合到第一通孔。缓冲金属段包括在其上形成ILD干酪糖化图案的多个电绝缘介电层（ILD）焊盘以引导电流。 IC互连结构还包括位于介质上的第二通孔，该电介质形成在缓冲金属段上并且在一端耦合到缓冲金属段，并且金属电源线形成在电介质中，并在其相对端耦合到第二通孔。缓冲金属片段上的ILD焊盘的使用使得能够沿着金属电源线更均匀地分布电流。

55. 发明授权

US08237286B2 Integrated circuit interconnect structure 有权
标题翻译：集成电路互连结构
公开(公告)号：US08237286B2
公开(公告)日：2012-08-07
申请号：US12760594
申请日：2010-04-15
申请人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
发明人： Hanyi Ding , Ronald G. Filippi , Jong-Ru Guo , Ping-Chuan Wang
IPC分类号： H01L23/522
CPC分类号： H01L23/528 , H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line.
摘要翻译：一种集成电路（IC）互连结构，其包括位于电介质中并且在一端耦合到高电流器件的第一通孔和位于电介质中的缓冲金属段，并在其相对端耦合到第一通孔。缓冲金属段包括在其上形成ILD干酪糖化图案的多个电绝缘介电层（ILD）焊盘以引导电流。 IC互连结构还包括位于介质上的第二通孔，该电介质形成在缓冲金属段上并且在一端耦合到缓冲金属段，并且金属电源线形成在电介质中，并在其相对端耦合到第二通孔。缓冲金属片段上的ILD焊盘的使用使得能够沿着金属电源线更均匀地分布电流。

56. 发明授权

US08232115B2 Test structure for determination of TSV depth 有权
标题翻译：用于测定TSV深度的测试结构
公开(公告)号：US08232115B2
公开(公告)日：2012-07-31
申请号：US12566726
申请日：2009-09-25
申请人： Hanyi Ding , Kai D. Feng , Ping-Chuan Wang , Zhijian Yang
发明人： Hanyi Ding , Kai D. Feng , Ping-Chuan Wang , Zhijian Yang
IPC分类号： H01L21/66
CPC分类号： H01L22/34 , H01L21/76898
摘要： A test structure for a through-silicon-via (TSV) in a semiconductor chip includes a first contact, the first contact being electrically connected to a first TSV; and a second contact, wherein the first contact, second contact, and the first TSV form a first channel, and a depth of the first TSV is determined based on a resistance of the first channel. A method of determining a depth of a through-silicon-via (TSV) in a semiconductor chip includes etching a first TSV into the semiconductor chip; forming a first channel, the first channel comprising the first TSV, a first contact electrically connected to the first TSV, and a second contact; connecting a current source to the second contact; determining a resistance across the first channel; and determining a depth of the first TSV based on the resistance of the first channel.
摘要翻译：半导体芯片中的贯穿硅通孔（TSV）的测试结构包括：第一触点，第一触点电连接到第一TSV; 以及第二触点，其中所述第一触点，所述第二触点和所述第一TSV形成第一通道，并且基于所述第一通道的电阻来确定所述第一TSV的深度。确定半导体芯片中的硅通孔（TSV）的深度的方法包括将第一TSV蚀刻到半导体芯片中; 形成第一通道，所述第一通道包括所述第一TSV，电连接到所述第一TSV的第一触点和第二触点; 将电流源连接到第二触点; 确定跨越第一通道的电阻; 以及基于所述第一通道的电阻确定所述第一TSV的深度。

57. 发明授权

US08035198B2 Through wafer via and method of making same 有权
标题翻译：通过晶片通孔及其制作方法
公开(公告)号：US08035198B2
公开(公告)日：2011-10-11
申请号：US12188229
申请日：2008-08-08
申请人： Hanyi Ding , Alvin Jose Joseph , Anthony Kendall Stamper
发明人： Hanyi Ding , Alvin Jose Joseph , Anthony Kendall Stamper
IPC分类号： H01L21/768 , H01L23/538
CPC分类号： H01L21/76898 , H01L21/6835 , H01L21/6836 , H01L23/481 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/03002 , H01L2224/0401 , H01L2224/04026 , H01L2224/0405 , H01L2224/0557 , H01L2224/06181 , H01L2224/11002 , H01L2224/11003 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/81191 , H01L2224/81192 , H01L2225/06513 , H01L2225/06541 , H01L2924/01068 , H01L2924/1305 , H01L2924/13091 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/00
摘要： A through wafer via structure. The structure includes: a semiconductor substrate having a top surface and an opposite bottom surface; and an array of through wafer vias comprising at least one electrically conductive through wafer via and at least one electrically non-conductive through wafer via, each through wafer via of the array of through wafer vias extending from the top surface of the substrate to between greater than halfway to and all the way to the bottom surface of the substrate. Also methods for fabricating the though wafer via structure.
摘要翻译：通过晶片通孔结构。该结构包括：具有顶表面和相对底表面的半导体衬底; 以及贯穿晶片通孔的阵列，其包括至少一个导电的通过晶片通孔和至少一个非导电的通过晶片通孔，每个通过晶片通孔的通过晶片通孔的阵列从基板的顶表面延伸到更大的比一半到一路到底层的底面。也是用于制造晶片通孔结构的方法。

58. 发明授权

US08012814B2 Method of forming a high performance fet and a high voltage fet on a SOI substrate 有权
标题翻译：在SOI衬底上形成高性能fet和高电压fet的方法
公开(公告)号：US08012814B2
公开(公告)日：2011-09-06
申请号：US12188366
申请日：2008-08-08
申请人： Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Zhenrong Jin , Xuefeng Liu , Yun Shi
发明人： Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Zhenrong Jin , Xuefeng Liu , Yun Shi
IPC分类号： H01L21/84
CPC分类号： H01L21/84 , H01L21/823462 , H01L21/823481 , H01L27/1203 , H01L27/1207
摘要： A first portion of a top semiconductor layer of a semiconductor-on-insulator (SOI) substrate is protected, while a second portion of the top semiconductor layer is removed to expose a buried insulator layer. A first field effect transistor including a gate dielectric and a gate electrode located over the first portion of the top semiconductor layer is formed. A portion of the exposed buried insulator layer is employed as a gate dielectric for a second field effect transistor. In one embodiment, the gate electrode of the second field effect transistor is a remaining portion of the top semiconductor layer. In another embodiment, the gate electrode of the second field effect transistor is formed concurrently with the gate electrode of the first field effect transistor by deposition and patterning of a gate electrode layer.
摘要翻译：保护绝缘体上半导体（SOI）衬底的顶部半导体层的第一部分，同时去除顶部半导体层的第二部分以暴露掩埋的绝缘体层。形成包括位于顶部半导体层的第一部分上方的栅极电介质和栅电极的第一场效应晶体管。暴露的掩埋绝缘体层的一部分用作第二场效应晶体管的栅极电介质。在一个实施例中，第二场效应晶体管的栅电极是顶部半导体层的剩余部分。在另一个实施例中，第二场效应晶体管的栅极通过栅极电极层的沉积和图案化与第一场效应晶体管的栅电极同时形成。

59. 发明申请

US20100035370A1 INTEGRATED MILLIMETER WAVE ANTENNA AND TRANSCEIVER ON A SUBSTRATE 有权
标题翻译：集成的毫米波天线和基座上的收发器
公开(公告)号：US20100035370A1
公开(公告)日：2010-02-11
申请号：US12187436
申请日：2008-08-07
申请人： Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Zhenrong Jin , Xuefeng Liu
发明人： Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Zhenrong Jin , Xuefeng Liu
IPC分类号： H01L21/00
CPC分类号： H01Q1/40 , H01Q9/28
摘要： A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is formed on a front side of a semiconductor substrate. At least one through substrate via provides electrical connection between the transceiver and the backside of the semiconductor substrate. The antenna, which is connected to the transceiver, is formed in a dielectric layer on the front side. The reflector plate is connected to the through substrate via, and is formed on the backside. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate trenches may be formed and filled with a dielectric material to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency.
摘要翻译：提供集成收发器，天线和接收器的半导体芯片。收发器形成在半导体衬底的前侧。至少一个通过衬底通孔提供收发器和半导体衬底的背面之间的电连接。连接到收发器的天线形成在前侧的电介质层中。反射板与穿通基板连接，并形成在背面。反射板与天线之间的间隔大约是毫米波的四分之一波长，这提高了天线的辐射效率。通过衬底沟槽的阵列可以形成并填充介电材料，以减小天线和反射板之间的材料的有效介电常数，从而减小毫米波的波长并提高辐射效率。

60. 发明申请

US20100032810A1 THROUGH WAFER VIAS AND METHOD OF MAKING SAME 有权
标题翻译：通过WAVER VIAS及其制作方法
公开(公告)号：US20100032810A1
公开(公告)日：2010-02-11
申请号：US12188236
申请日：2008-08-08
申请人： Hanyi Ding , Alvin Jose Joseph , Anthony Kendall Stamper
发明人： Hanyi Ding , Alvin Jose Joseph , Anthony Kendall Stamper
IPC分类号： H01L23/538 , H01L21/768
CPC分类号： H01L21/76898 , H01L21/6835 , H01L21/823475 , H01L21/823481 , H01L23/481 , H01L23/66 , H01L24/05 , H01L24/10 , H01L24/12 , H01L24/13 , H01L25/0657 , H01L25/50 , H01L2221/68372 , H01L2223/6616 , H01L2224/0401 , H01L2224/0557 , H01L2224/13 , H01L2224/13025 , H01L2224/13099 , H01L2224/2518 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/0105 , H01L2924/01068 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/00 , H01L2224/05552
摘要： A method of forming and structure for through wafer vias and signal transmission lines formed of through wafer vias. The method of forming through wafer vias includes forming an array of through wafer vias comprising at least one electrically conductive through wafer via and at least one electrically non-conductive through wafer via through a semiconductor substrate having a top surface and an opposite bottom surface, each through wafer via of the array of through wafer vias extending from the top surface of the substrate to the bottom surface of the substrate.
摘要翻译：用于通过晶片通孔形成和结构的方法，所述晶片通孔和通过晶片通孔形成的信号传输线。通过晶片通孔形成的方法包括通过半导体衬底形成贯穿晶片通孔的阵列，其包括至少一个导电晶片通孔和至少一个不导电的晶片通孔，该半导体衬底具有顶表面和相对的底表面通过晶片通孔从衬底的顶表面延伸到衬底的底表面的通过晶片通孔的阵列。

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