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51. 发明专利

JP2013196916A Anode and battery using the same 审中-公开
标题翻译：使用相同的阳极和电池
公开(公告)号：JP2013196916A
公开(公告)日：2013-09-30
申请号：JP2012063008
申请日：2012-03-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AOYAGI TAKUYA , NAITO TAKASHI , FUJIEDA TADASHI , SAWAI YUICHI , TAKAHASHI SHIN , NOYA AKIHIKO , FUKUCHI KUNIO
IPC分类号： H01M4/134 , H01M4/06 , H01M4/38
CPC分类号： Y02E60/122
摘要： PROBLEM TO BE SOLVED: To suppress passivation of an anode metal surface and decomposition of an electrolyte.SOLUTION: An anode containing a metal capable of occluding and releasing metal ions is characterized in that an oxide phase containing amorphous V is formed on a surface of the metal.
摘要翻译：要解决的问题：抑制阳极金属表面的钝化和电解质的分解。解决方案：含有能够吸留和释放金属离子的金属的阳极的特征在于，在表面上形成含有非晶体V的氧化物相金属。

52. 发明专利

JP2013194285A Metal matrix composite material and method for manufacturing the same 有权
标题翻译：金属基复合材料及其制造方法
公开(公告)号：JP2013194285A
公开(公告)日：2013-09-30
申请号：JP2012063009
申请日：2012-03-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： FUJIEDA TADASHI , NAITO TAKASHI , AOYAGI TAKUYA , SAWAI YUICHI
IPC分类号： C23D5/00 , C03C8/02 , C03C8/08 , C03C8/16 , C23D5/02
CPC分类号： H01L31/032 , C23D5/00 , H01L31/18 , H02S40/20
摘要： PROBLEM TO BE SOLVED: To provide a metal matrix composite material with high corrosion resistance even when its coating weight is low.SOLUTION: In a metal matrix composite material including a substrate made of metal or alloy, the substrate being coated with melting transition metal oxide glass, a polarity of the transition metal oxide glass is n. Furthermore, a method for manufacturing the metal matrix composite material includes the steps of: applying paste containing the transition metal oxide glass, an organic binder, and an organic solvent onto a surface of the substrate 101 made of metal or alloy; and forming a glass film 102 on the substrate by heating and holding the substrate at a temperature of a softening point or higher of the transition metal oxide glass after the application step, wherein the polarity of the transition metal oxide glass is n.
摘要翻译：要解决的问题：即使在其涂层重量低的情况下也提供具有高耐腐蚀性的金属基复合材料。解决方案：在金属基复合材料中，包括由金属或合金制成的基底，基底上涂有熔融过渡金属氧化物玻璃，过渡金属氧化物玻璃的极性为n。此外，金属基复合材料的制造方法包括以下步骤：将含有过渡金属氧化物玻璃，有机粘合剂和有机溶剂的糊料涂布到由金属或合金制成的基板101的表面上; 并且在施加步骤之后通过加热和保持基板在过渡金属氧化物玻璃的软化点或更高的温度下在基板上形成玻璃膜102，其中过渡金属氧化物玻璃的极性为n。

53. 发明专利

JP2013151396A Joined body and semiconductor module 有权
标题翻译：接合体和半导体模块
公开(公告)号：JP2013151396A
公开(公告)日：2013-08-08
申请号：JP2012013663
申请日：2012-01-26
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SAWAI YUICHI , NAITO TAKASHI , AOYAGI TAKUYA , FUJIEDA TADASHI , MORI MUTSUHIRO
IPC分类号： C04B37/00 , B23K35/26 , C22C13/00 , H01L21/52 , H05K1/02 , H05K3/34
CPC分类号： H01L23/3736 , B23K35/26 , C04B37/025 , C04B37/026 , C04B2235/96 , C04B2235/9607 , C04B2237/10 , C04B2237/12 , C04B2237/125 , C04B2237/366 , C04B2237/368 , C04B2237/408 , C22C5/06 , C22C13/00 , H01L21/52 , H01L23/3731 , H01L23/3735 , H01L24/32 , H01L24/34 , H01L24/36 , H01L24/40 , H01L33/62 , H01L33/641 , H01L2224/32245 , H01L2224/40095 , H01L2224/40225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48464 , H01L2224/73221 , H01L2224/73265 , H01L2924/00014 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/1432 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , Y10T428/12014 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To improve adhesion and thermal conductivity of a joined body in which any of a metal, a ceramic or a semiconductor is bonded.SOLUTION: In a joined body which is obtained by bonding a first member and a second member that are any of a metal, a ceramic or a semiconductor, the second member is bonded via an adhesive member that is provided on a surface of the first member; and the adhesive member contains VO-containing glass and metal particles. In a semiconductor module which is provided with a base metal, a ceramic substrate, a metal wiring and a semiconductor chip, the ceramic substrate is bonded via a first adhesive member that is provided on a surface of the base metal; the metal wiring is bonded via a second adhesive member that is provided on a surface of the ceramic substrate; the semiconductor chip is bonded via a third adhesive member that is provided on a surface of the metal wiring; and the first adhesive member, the second adhesive member and the third adhesive member contain VO-containing glass and metal particles.
摘要翻译：要解决的问题：提高粘合金属，陶瓷或半导体中的任何一种的接合体的粘附性和导热性。在通过将第一构件和第二构件接合而获得的接合体中，金属，陶瓷或半导体中的任一个，第二构件经由设置在第一构件的表面上的粘合构件接合; 并且粘合剂构件含有含VO的玻璃和金属颗粒。在设置有基底金属，陶瓷基板，金属布线和半导体芯片的半导体模块中，陶瓷基板经由设置在基体金属的表面上的第一粘合部件接合，金属布线通过设置在陶瓷基板的表面上的第二粘合构件粘合; 所述半导体芯片经由设置在所述金属布线的表面上的第三粘合构件接合; 并且第一粘合剂构件，第二粘合构件和第三粘合构件含有含VO的玻璃和金属颗粒。

54. 发明专利

JP2013132757A Composite member 有权
标题翻译：复合材料
公开(公告)号：JP2013132757A
公开(公告)日：2013-07-08
申请号：JP2011282622
申请日：2011-12-26
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAITO TAKASHI , FUJIEDA TADASHI , AOYAGI TAKUYA , SAWAI YUICHI , MURAKAMI HAJIME , OGINO MASAHIKO , MIYAUCHI AKIHIRO , YOSHIDA HIROSHI
IPC分类号： B32B17/10 , C03C3/21 , H01L31/042
CPC分类号： B05D3/06 , B05D1/12 , C03C3/21 , C03C8/08 , C03C8/10 , C03C8/16 , C03C8/24 , H01L31/048 , H01L31/0481 , H05K1/0306 , H05K1/181 , Y02E10/50 , Y10T428/24975 , Y10T428/265
摘要： PROBLEM TO BE SOLVED: To improve gas barrier property of a laminate which is constituted of a base material including a resin or rubber and oxide glass.SOLUTION: This composite member comprises forming densely the oxide glass 2 in a layer state on the base material 1 including the resin or rubber. The oxide glass is bonded to the base material by irradiating the oxide glass with electromagnetic wave, and softening and fluidizing the oxide glass.
摘要翻译：要解决的问题：提高由包括树脂或橡胶和氧化物玻璃的基材构成的层压体的阻气性。解决方案：该复合构件包括在基体材料1上以层状密实地形成氧化物玻璃2 包括树脂或橡胶。通过用电磁波照射氧化物玻璃将氧化物玻璃粘合到基材上，并使氧化物玻璃软化和流化。

55. 发明专利

JP2013103840A Conductive glass paste, and electric/electronic component using the same 审中-公开
标题翻译：导电玻璃胶，以及电子/电子元件
公开(公告)号：JP2013103840A
公开(公告)日：2013-05-30
申请号：JP2011246123
申请日：2011-11-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAITO TAKASHI , AOYAGI TAKUYA , FUJIEDA TADASHI , SAWAI YUICHI
IPC分类号： C03C8/18 , H01L21/288 , H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a conductive glass paste having high adhesiveness to a substrate, capable of forming an electrode/wiring having low electrical resistivity in the 10Ωcm order by firing at a low temperature of ≤300°C, and to provide an electric/electronic component in which an electrode/wiring is formed by using the conductive glass paste.SOLUTION: This conductive glass paste, which is a conductive glass paste containing lead-free glass particles, Ag particles and an organic solvent, further includes AgO particles, wherein the lead-free glass particles contain at least VO, AgO and TeO, when the components thereof are expressed in terms of oxides, and the softening point thereof is ≤300°C. The conductive glass paste preferably has a compounding ratio of 10-70 pts.mass AgO particles and 10-50 pts.mass lead-free glass particles with respect to 100 pts.mass Ag particles.
摘要翻译：要解决的问题：为了提供一种对基板具有高粘附性的导电玻璃浆料，能够在10 -6“Ωcm中形成具有低电阻率的电极/布线通过在≤300℃的低温下烧成，并提供通过使用导电性玻璃浆料形成电极/布线的电气/电子部件。
解决方案：作为含有无铅玻璃颗粒，Ag颗粒和有机溶剂的导电玻璃糊的导电玻璃糊还包括Ag 2 O颗粒，其中无铅玻璃颗粒至少包含V 5 ，Ag 2 SB> O和TeO 2 时，其组分用氧化物表示，软化点为≤300℃。导电性玻璃浆料的配合比例优选相对于100重量份为10-70质量％Ag 2 O粒子，10-50质量度无铅玻璃粒子。质量Ag颗粒。版权所有（C）2013，JPO＆INPIT

56. 发明专利

JP2012134409A Thermoelectric conversion material 有权
标题翻译：热电转换材料
公开(公告)号：JP2012134409A
公开(公告)日：2012-07-12
申请号：JP2010286922
申请日：2010-12-24
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： FUJIEDA TADASHI , NAITO TAKASHI , AOYAGI TAKUYA
IPC分类号： H01L35/22 , H01L35/34
CPC分类号： H01L35/18 , C03B32/02 , C03C3/21 , C03C4/14 , C03C10/00 , H01L35/00 , H01L35/22 , Y10S257/93
摘要： PROBLEM TO BE SOLVED: To provide a thermoelectric conversion material where only a desired crystal is selectively deposited.SOLUTION: A MVOcrystal is selectively deposited in V-based glass, where M is either of metallic elements Fe, Sb, Bi, W, Mo, Mn, Ni, Cu, Ag, alkaline metals, and alkaline earth metals, and 0
摘要翻译：要解决的问题：提供仅选择性沉积所需晶体的热电转换材料。
解决方案：选择性地，AM x O 2 沉积在V型玻璃中，其中M是金属元素Fe，Sb，Bi，W，Mo，Mn，Ni，Cu，Ag，碱金属和碱土金属，0

57. 发明专利

JP2011241133A Crystallized glass and method for producing the same 审中-公开
标题翻译：结晶玻璃及其制造方法
公开(公告)号：JP2011241133A
公开(公告)日：2011-12-01
申请号：JP2010116853
申请日：2010-05-21
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： FUJIEDA TADASHI , NAITO TAKASHI , AOYAGI TAKUYA , MIYATA MOTOYUKI , YAMADA SHINJI
IPC分类号： C03B32/02 , C03C10/02 , C03C10/04 , H01M4/48 , H01M4/52
CPC分类号： Y02E60/12
摘要： PROBLEM TO BE SOLVED: To provide crystallized glass in which only desired crystal is selectively deposited in the glass, and a method for producing the same.SOLUTION: The desired crystal composed of a transition metal element, such as iron and copper, or lithium is selectively deposited in the glass by irradiating a microwave to the glass that contains the transition metal element or lithium. At least a part of the crystallized glass is amorphous, and contains vanadium or either of lithium ion, sodium ion and magnesium ion.
摘要翻译：待解决的问题：提供在玻璃中仅选择性地沉积所需晶体的结晶玻璃及其制造方法。解决方案：通过向包含过渡金属元素或锂的玻璃照射微波，在玻璃中选择性地沉积由过渡金属元素如铁和铜或锂组成的所需晶体。至少一部分结晶玻璃是无定形的，并含有钒或锂离子，钠离子和镁离子中的任一种。版权所有（C）2012，JPO＆INPIT

58. 发明专利

JP2005041966A Composite material composition with high dielectric constant and low dielectric dissipation factor, curable film, cured product and method for producing the cured product 有权
标题翻译：具有高介电常数和低介电耗散因子，可固化膜，固化产品和生产固化产品的方法的复合材料组合物
公开(公告)号：JP2005041966A
公开(公告)日：2005-02-17
申请号：JP2003202162
申请日：2003-07-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SATSUU YUUICHI , AMO SATORU , TAKAHASHI AKIO , WATABE NORIYUKI , UNNO MORIMICHI , FUJIEDA TADASHI , AKABOSHI HARUO , NAGAI AKIRA
IPC分类号： C08J5/18 , C08F291/00 , C08K3/00 , C08K5/01 , C08L101/00 , H01B3/00 , H01B3/44 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To provide a composite material composition of high dielectric constant and low dielectric dissipation factor, good in processability having a dielectric constant of ≥15 and a dielectric dissipation factor of ≤0.05 in the frequency range from 100 MHz to 80 GHz, to provide a curable film, to provide a cured product, and to provide a method for producing the cured product.
SOLUTION: The composite material composition of high dielectric constant and low dielectric dissipation factor comprises a crosslinkable component having a plurality of styrene groups with a weight-average molecular weight of ≤1,000 represented by the general formula[1][ wherein, R is a (substituted) hydrocarbon skeleton; R
1 is H, methyl or ethyl; m is an integer of 1-4; and n is an integer of ≥2 ] and an a resin containing at least one polymer with a weight-average molecular weight of ≥5,000, wherein the resin is dispersed with inorganic fillers essentially comprising metallic powder with the mean particle size for the respective filler components being ≤5μm.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供高介电常数和低介电损耗因子的复合材料组合物，在100MHz至10MHz的频率范围内具有介电常数≥15且介电损耗因子≤0.05的加工性良好 80GHz，以提供可固化膜，以提供固化产物，并提供固化产物的制备方法。解决方案：高介电常数和低介电损耗因子的复合材料组合物包含具有由通式[1]表示的重均分子量≤1,000的多个苯乙烯基团的可交联组分[其中，R 是（取代的）烃骨架; R 1是H，甲基或乙基; m为1-4的整数; n为≥2的整数]，以及含有至少一种重均分子量≥5,000的聚合物的树脂，其中树脂以基本上包含金属粉末的无机填料分散，其平均粒径为相应填料组件≤5μm。版权所有（C）2005，JPO＆NCIPI

59. 发明专利

JP2003243878A ELECTROMAGNETIC WAVE ABSORPTION MATERIAL AND VARIOUS ITEMS USING THE SAME 审中-公开
公开(公告)号：JP2003243878A
公开(公告)日：2003-08-29
申请号：JP2002038237
申请日：2002-02-15
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： FUJIEDA TADASHI , HIDAKA KISHIFU , IKEDA SHINZO , HAYASHIBARA MITSUO , TAGUCHI NORIYUKI
IPC分类号： H05K1/02 , H05K3/28 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide an electromagnetic wave absorption material having superior electromagnetic wave absorption characteristics which can be easily manufactured and used in regions from submillimeter to millimeter waves, and to provide various uses applying the same. SOLUTION: The electromagnetic wave absorption material comprises a multilayer hollow spherule of carbon, shungite carbon, and at least one kind of shungite crystal which are dispersed into a material of high electric resistivity. At least part of a substrate, an electronic device and wiring circuit is covered with the electromagnetic wave absorption material. Further, the electromagnetic wave absorption material is applied to an optical transmission or reception module, a high-frequency transmission apparatus and a non-stop automatic toll collection system. COPYRIGHT: (C)2003,JPO

60. 发明专利

JP2002334612A HIGH DIELECTRIC CONSTANT COMPLEX MATERIAL AND MULTI- LAYER WIRING BOARD USING SAME 审中-公开
公开(公告)号：JP2002334612A
公开(公告)日：2002-11-22
申请号：JP2002030227
申请日：2002-02-07
申请人： HITACHI LTD
发明人： SATSUU YUUICHI , TAKAHASHI AKIO , FUJIEDA TADASHI , AKABOSHI HARUO , UENO TAKUMI
IPC分类号： H05K3/46 , H01B3/00 , H01B3/30 , H01L23/12 , H01L23/14 , H01L23/498 , H01L23/64 , H01L23/66 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a high dielectric constant complex material with inorganic fillers having metal powder as an essential ingredient dispersed in organic resin with dielectric constant of not less than 25 and dielectric dissipation factor of not more than 0.1 at a frequency range of 100 MHz to 80 GHz, and a multi- layer wiring board as well as a module board using same. SOLUTION: The high dielectric constant complex material is particles sized under a micron dispersed with inorganic fillers with metal as an essential ingredient put under insulation treatment such as conversion treatment and then, after surface treatment for improvement of compatibility with organic resin, complexed with organic resin.

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