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    • 52. 发明授权
    • Nonvolatile semiconductor memory device and method for manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US08710573B2
    • 2014-04-29
    • US12831323
    • 2010-07-07
    • Atsuhiro KinoshitaHiroshi WatanabeFumitaka Arai
    • Atsuhiro KinoshitaHiroshi WatanabeFumitaka Arai
    • H01L29/788
    • H01L27/1203H01L21/84H01L27/115H01L27/11521H01L27/11524
    • It is made possible to provide a memory device that can be made very small in size and have a high capacity while being able to effectively suppress short-channel effects. A nonvolatile semiconductor memory device includes: a first insulating film formed on a semiconductor substrate; a semiconductor layer formed above the semiconductor substrate so that the first insulating film is interposed between the semiconductor layer and the semiconductor substrate; a NAND cell having a plurality of memory cell transistors connected in series, each of the memory cell transistors having a gate insulating film formed on the semiconductor layer, a floating gate formed on the gate insulating film, a second insulating film formed on the floating gate, and a control gate formed on the second insulating film; a source region having an impurity diffusion layer formed in one side of the NAND cell; and a drain region having a metal electrode formed in the other side of the NAND cell.
    • 可以提供一种可以制造尺寸非常小并且具有高容量的存储器件,同时能够有效地抑制短沟道效应。 非易失性半导体存储器件包括:形成在半导体衬底上的第一绝缘膜; 半导体层,其形成在所述半导体衬底上方,使得所述第一绝缘膜插入在所述半导体层和所述半导体衬底之间; 具有串联连接的多个存储单元晶体管的NAND单元,每个存储单元晶体管具有形成在所述半导体层上的栅极绝缘膜,形成在所述栅极绝缘膜上的浮置栅极,形成在所述浮动栅极上的第二绝缘膜 以及形成在所述第二绝缘膜上的控制栅极; 源区,其具有形成在NAND单元的一侧的杂质扩散层; 以及在NAND单元的另一侧形成有金属电极的漏极区域。
    • 55. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110272755A1
    • 2011-11-10
    • US13188803
    • 2011-07-22
    • Masato ENDOFumitaka Arai
    • Masato ENDOFumitaka Arai
    • H01L27/115
    • H01L27/105H01L27/11526H01L27/11529
    • A semiconductor device comprising a first insulating film provided on a semiconductor substrate in a cell transistor region, a first conductive film provided on the first insulating film, an inter-electrode insulating film provided on the first conductive film, a second conductive film provided on the inter-electrode insulating film and having a first metallic silicide film on a top surface thereof, first source/drain regions formed on a surface of the semiconductor substrate, a second insulating film provided on the semiconductor substrate in at least one of a selection gate transistor region and a peripheral transistor region, a third conductive film provided on the second insulating film and having a second metallic silicide film having a thickness smaller than a thickness of the first metallic silicide film on a top surface thereof, and a second source/drain regions formed on the surface of the semiconductor substrate.
    • 一种半导体器件,包括设置在单元晶体管区域中的半导体衬底上的第一绝缘膜,设置在第一绝缘膜上的第一导电膜,设置在第一导电膜上的电极间绝缘膜,设置在第一绝缘膜上的第二导电膜 电极间绝缘膜,在其上表面具有第一金属硅化物膜,形成在所述半导体基板的表面上的第一源极/漏极区域,设置在所述半导体基板上的选择栅极晶体管中的至少一个中的第二绝缘膜 区域和周边晶体管区域,第三导电膜,设置在第二绝缘膜上,并且具有厚度小于其顶表面上的第一金属硅化物膜的厚度的第二金属硅化物膜,以及第二源极/漏极区域 形成在半导体基板的表面上。
    • 57. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    • 半导体存储器件及其制造方法
    • US20110250744A1
    • 2011-10-13
    • US13164931
    • 2011-06-21
    • Atsuhiro SATOHiroyuki NittaFumitaka Arai
    • Atsuhiro SATOHiroyuki NittaFumitaka Arai
    • H01L21/28
    • H01L27/11524H01L21/76816H01L27/11521
    • A semiconductor memory device includes a first block having first memory cells and first select transistors, a second block having second memory cells and second select transistors, and arranged adjacent to the first block in a first direction, the second select transistor being arranged to face the first select transistor and commonly having a diffusion region with the first select transistor, a first interconnection layer provided on the diffusion region between the first and second blocks and extending in a second direction, and a second interconnection layer having a first portion provided in contact with an upper portion of the first interconnection layer and extending to a portion outside the first interconnection layer, and a second portion extending in the second direction and connected to the first portion in a portion outside a portion on the first interconnection layer.
    • 半导体存储器件包括具有第一存储器单元和第一选择晶体管的第一块,具有第二存储单元和第二选择晶体管的第二块,并且沿第一方向布置成与第一块相邻,第二选择晶体管被布置为面对 第一选择晶体管,并且通常具有与第一选择晶体管的扩散区,第一互连层,设置在第一和第二块之间的扩散区上并沿第二方向延伸;第二互连层,具有设置成与第一选择晶体管接触的第一部分 第一互连层的上部并且延伸到第一互连层外部的部分,以及第二部分,其在第二方向上延伸并且在第一互连层上的部分外部的部分连接到第一部分。
    • 58. 发明申请
    • NAND FLASH MEMORY
    • NAND闪存
    • US20110249493A1
    • 2011-10-13
    • US13164486
    • 2011-06-20
    • Atsuhiro SATOFumitaka Arai
    • Atsuhiro SATOFumitaka Arai
    • G11C16/12G11C16/04
    • G11C11/5628G11C16/0483
    • In a state in which a first and second selection gate transistors are turned off and a first voltage is applied to a control gate of a second memory cell transistor which is connected to a source line side of a first memory cell transistor selected from among the memory cell transistors and which is to be cut off, a second voltage which is higher than the first voltage and which causes a plurality of third memory cell transistors remaining unselected in the memory cell transistors to conduct is applied to control gates of the third memory cell transistors, and thereafter a threshold voltage of the first memory cell transistor is changed to a threshold voltage higher than the first threshold voltage corresponding to the erase state by applying a third voltage which is higher than the second voltage to a control gate of the first memory cell transistor.
    • 在第一和第二选择栅极晶体管被截止并且第一电压被施加到第二存储单元晶体管的控制栅极的状态下,第二存储单元晶体管连接到从存储器中选择的第一存储单元晶体管的源极线侧 单元晶体管并且要被切断,高于第一电压的第二电压并且使得在存储单元晶体管导通时保持未选择的多个第三存储单元晶体管被施加到第三存储单元晶体管的控制栅极 之后,通过向第一存储单元的控制栅极施加高于第二电压的第三电压,将第一存储单元晶体管的阈值电压改变为高于与擦除状态相对应的第一阈值电压的阈值电压 晶体管。
    • 59. 发明授权
    • NAND flash memory
    • NAND闪存
    • US07983086B2
    • 2011-07-19
    • US12564598
    • 2009-09-22
    • Atsuhiro SatoFumitaka Arai
    • Atsuhiro SatoFumitaka Arai
    • G11C16/00
    • G11C11/5628G11C16/0483
    • In a state in which a first and second selection gate transistors are turned off and a first voltage is applied to a control gate of a second memory cell transistor which is connected to a source line side of a first memory cell transistor selected from among the memory cell transistors and which is to be cut off, a second voltage which is higher than the first voltage and which causes a plurality of third memory cell transistors remaining unselected in the memory cell transistors to conduct is applied to control gates of the third memory cell transistors, and thereafter a threshold voltage of the first memory cell transistor is changed to a threshold voltage higher than the first threshold voltage corresponding to the erase state by applying a third voltage which is higher than the second voltage to a control gate of the first memory cell transistor.
    • 在第一和第二选择栅极晶体管被截止并且第一电压被施加到第二存储单元晶体管的控制栅极的状态下,第二存储单元晶体管连接到从存储器中选择的第一存储单元晶体管的源极线侧 单元晶体管并且要被切断,高于第一电压的第二电压并且使得在存储单元晶体管导通时保持未选择的多个第三存储单元晶体管被施加到第三存储单元晶体管的控制栅极 之后,通过向第一存储单元的控制栅极施加高于第二电压的第三电压,将第一存储单元晶体管的阈值电压改变为高于与擦除状态相对应的第一阈值电压的阈值电压 晶体管。