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51. 发明授权

US06974709B2 Method and device for providing a semiconductor etching end point and for detecting the end point 失效
标题翻译：用于提供半导体蚀刻终点并用于检测终点的方法和装置
公开(公告)号：US06974709B2
公开(公告)日：2005-12-13
申请号：US10407015
申请日：2003-04-03
申请人： Klaus Breitschwerdt , Franz Laermer
发明人： Klaus Breitschwerdt , Franz Laermer
IPC分类号： H01J37/32 , H01L21/00 , G01R31/26 , H01L21/66
CPC分类号： H01L21/67069 , H01J37/32935
摘要： A method is provided for detecting an end point, a material transition or a boundary surface during the etching of a semiconductor element, a zone of the semiconductor element having non-homogeneous load carrier density and/or non-homogeneous load carrier polarity, particularly a p-n junction, which has an electrical voltage applied to it during etching, and an electrical current induced by it in this zone is measured, and reaching of this zone during etching is determined from a change in the electrical current. This method is suitable for the detection of the etching end point in gas phase etching, in particular with the aid of the etching gases ClF3 and/or BrF3, or in the anisotropic plasma etching of silicon substrates. In addition, a method is provided for etching a semiconductor element using a gaseous etching medium, during which the speed of removal of the semiconductor element is set or changed via a setting of the polarity and/or the density of free load carriers in the semiconductor element. In addition, a device for etching a semiconductor element, which device is suitable for carrying out the two methods described above, is provided.
摘要翻译：提供一种用于在半导体元件的蚀刻期间检测端点，材料转变或边界表面的方法，具有非均匀负载载流子密度和/或非均匀负载载流子极性的半导体元件的区域，特别是 pn结，其在蚀刻期间具有施加到其上的电压，并且测量在该区域中由其感生的电流，并且根据电流的变化来确定蚀刻期间该区域的到达。该方法适用于在气相蚀刻中特别是借助于蚀刻气体ClF 3 3和/或BrF 3 3的蚀刻终点的检测，或者在硅衬底的各向异性等离子体蚀刻。此外，提供了一种使用气体蚀刻介质蚀刻半导体元件的方法，在该方法中，通过设置半导体中的自由载流子的极性和/或密度来设定或改变半导体元件的移除速度元件。此外，提供了一种用于蚀刻半导体元件的装置，该装置适合于执行上述两种方法。

52. 发明授权

US06372656B1 Method of producing a radiation sensor 失效
标题翻译：辐射传感器的制造方法
公开(公告)号：US06372656B1
公开(公告)日：2002-04-16
申请号：US09406272
申请日：1999-09-24
申请人： Franz Laermer , Wilhelm Frey
发明人： Franz Laermer , Wilhelm Frey
IPC分类号： H01L21302
CPC分类号： G01J5/12 , H01L31/09
摘要： A method of producing an infrared sensor on a semiconductor substrate involves defining at least one area on the surface of the semiconductor substrate where a recess is to be created in the semiconductor substrate, depositing a membrane on the surface, applying a radiation absorber to the membrane in the defined area, applying thermoelements with a hot contact in thermal contact with the radiation absorber and a cold contact in thermal contact with the semiconductor substrate. In this method, an opening is provided in the membrane in the defined area, and the semiconductor substrate is etched through the opening.
摘要翻译：在半导体衬底上制造红外传感器的方法包括：在半导体衬底的表面上形成至少一个区域，在半导体衬底的表面上形成凹槽，在半导体衬底中形成凹槽，在表面上沉积膜，向膜上施加辐射吸收体在限定的区域中，将具有与辐射吸收体热接触的热接触件的热电偶和与半导体衬底热接触的冷接触件加热。在该方法中，在限定区域中的膜中设置开口，并且通过开口蚀刻半导体衬底。

53. 发明授权

US06268232B1 Method for fabricating a micromechanical component 有权
标题翻译：微机械部件的制造方法
公开(公告)号：US06268232B1
公开(公告)日：2001-07-31
申请号：US09302224
申请日：1999-04-29
申请人： Helmut Skapa , Horst Muenzel , Franz Laermer , Michael Offenberg , Heinz-Georg Vossenberg
发明人： Helmut Skapa , Horst Muenzel , Franz Laermer , Michael Offenberg , Heinz-Georg Vossenberg
IPC分类号： H01L2100
CPC分类号： G01P15/0802 , B81B2201/0235 , B81C1/00571 , B81C2201/0109 , B81C2201/014 , B81C2201/056 , B81C2203/0109 , G01P1/023
摘要： A method for fabricating a micromechanical component, in particular a surface-micromechanical acceleration sensor, involves preparing a substrate and providing an insulation layer on the substrate, in which a patterned circuit trace layer is buried. A conductive layer, including a first region and a second region, is provided on the insulation layer, and a movable element is configured in the first region by forming a first plurality of trenches and by using an etching agent to remove at least one portion of the insulation layer from underneath the conductive layer. A contact element is formed and electrically connected to the circuit trace layer in the second region by configuring a second plurality of trenches, and the resultant movable element is encapsulated in the first region. The second plurality of trenches for forming the contact element in the second region is first formed after the encapsulation of the movable element formed in the first region.
摘要翻译：用于制造微机械部件，特别是表面微机械加速度传感器的方法涉及准备衬底并在衬底上提供绝缘层，其中掩埋有图案化的电路迹线层。包括第一区域和第二区域的导电层设置在绝缘层上，并且可移动元件通过形成第一多个沟槽而被构造在第一区域中，并且通过使用蚀刻剂去除至少一部分绝缘层从导电层下面。通过构造第二多个沟槽，形成接触元件并在第二区域中电连接到电路迹线层，并且所得到的可移动元件被封装在第一区域中。在第二区域中形成接触元件的第二多个沟槽首先在形成在第一区域中的可移动元件的封装之后形成。

54. 发明授权

US08986256B2 Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite 有权
标题翻译：多孔微针阵列和相应的多孔微针阵列和相应的底物复合材料的制造方法
公开(公告)号：US08986256B2
公开(公告)日：2015-03-24
申请号：US12925804
申请日：2010-10-29
申请人： Dick Scholten , Michael Stumber , Franz Laermer , Ando Feyh
发明人： Dick Scholten , Michael Stumber , Franz Laermer , Ando Feyh
IPC分类号： A61M5/00 , A61M37/00 , B81C1/00
CPC分类号： A61M37/0015 , A61M2037/0053 , B81B2201/055 , B81B2203/0361 , B81C1/00111 , B81C2201/0114 , B81C2201/0115 , B81C2203/0118 , B81C2203/054 , Y10T225/10 , Y10T225/12
摘要： A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips.
摘要翻译：多孔微针阵列的制造方法包括：形成多个多孔微针阵列，每个多孔微针阵列在半导体衬底的表面上具有至少一个微针和位于其下方的多孔载体区; 在位于半导体衬底背面的半导体衬底的非多孔残留层与载体区之间形成中间层，所述载流区具有比载体区更大的孔隙率; 通过破坏夹层从载体区分离残留层; 并将微针阵列分离成相应的芯片。

55. 发明申请

US20140291786A1 component having a micromechanical microphone structure 审中-公开
标题翻译：组件具有微机械麦克风结构
公开(公告)号：US20140291786A1
公开(公告)日：2014-10-02
申请号：US14233969
申请日：2012-07-20
申请人： Jochen Zoellin , Franz Laermer , Christoph Schelling , Mike Daley
发明人： Jochen Zoellin , Franz Laermer , Christoph Schelling , Mike Daley
IPC分类号： H04R7/06 , H04R19/00 , H04R19/04
CPC分类号： H04R7/06 , B81B3/0051 , B81B2201/0257 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： Substrate-side overload protection for the diaphragm structure of a microphone component having a micromechanical microphone structure which impairs the damping properties of the microphone structure as little as possible, in which the microphone structure includes a diaphragm structure having at least one acoustically active diaphragm which is formed in a diaphragm layer above a semiconductor substrate. The diaphragm structure spans at least one sound opening in the rear side of the substrate. A stationary, acoustically permeable counter element is formed in the layer structure of the component above the diaphragm layer. According to the invention, at least projections are formed at the outer edge area of the diaphragm structure which protrude beyond the edge area of the sound opening, so that the edge area of the sound opening acts as a substrate-side stop for the diaphragm structure.
摘要翻译：用于具有微机械麦克风结构的麦克风部件的隔膜结构的基板侧过载保护，其尽可能少地损害麦克风结构的阻尼特性，其中麦克风结构包括具有至少一个声学活动隔膜的隔膜结构，形成在半导体衬底上的隔膜层中。隔膜结构跨越基板后侧的至少一个声音开口。在隔膜层上方的部件的层结构中形成固定的，声学可渗透的计数元件。根据本发明，至少在隔膜结构的外边缘区域形成突起，突出超过声音开口的边缘区域，使得声音开口的边缘区域用作隔膜结构的基板侧挡块。

56. 发明授权

US08332092B2 Method for detecting the state of a tire 失效
标题翻译：检测轮胎状态的方法
公开(公告)号：US08332092B2
公开(公告)日：2012-12-11
申请号：US12227368
申请日：2007-04-23
申请人： Franz Laermer , Thorsten Pannek
发明人： Franz Laermer , Thorsten Pannek
IPC分类号： G01M17/02
CPC分类号： B60T8/1725 , B60C23/064 , B60T2210/12 , B60T2210/14
摘要： A method for detecting the state of a vehicle tire and/or a roadway, in which at least one sensor, in particular an acceleration sensor, disposed in the tire interior generates a signal that is assigned to physical variables of the vehicle tire and/or the roadway. A tire state and/or characteristics of the roadway are/is determined on the basis of the signal.
摘要翻译：一种用于检测车辆轮胎和/或道路的状态的方法，其中设置在轮胎内部的至少一个传感器，特别是加速度传感器产生分配给车辆轮胎的物理变量的信号和/或巷道基于信号确定轮胎状态和/或道路的特性。

57. 发明授权

US08154174B2 Bending transducer device for generating electrical energy from deformations and circuit module 有权
标题翻译：用于从变形和电路模块产生电能的弯曲传感器装置
公开(公告)号：US08154174B2
公开(公告)日：2012-04-10
申请号：US12455428
申请日：2009-06-01
申请人： Franz Laermer , Thorsten Pannek , Ralf Reichenbach , Marian Keck
发明人： Franz Laermer , Thorsten Pannek , Ralf Reichenbach , Marian Keck
IPC分类号： H01L41/08
CPC分类号： B60C23/0411 , H01L41/1134 , H02N2/186
摘要： A bending transducer device for generating electrical energy includes at least one elastically deformable support structure, one piezoelectric element, and a bearing device. The piezoelectric element is configured and situated on the support structure in such a way that the piezoelectric element is deformable due to a deformation of the support structure caused by vibration, and the support structure is supported vibration-capably in at least one bearing of the bearing device, the bearing being configured as an articulated receptacle, e.g., a hinge.
摘要翻译：用于产生电能的弯曲换能器装置包括至少一个可弹性变形的支撑结构，一个压电元件和一个轴承装置。压电元件被构造并位于支撑结构上，使得压电元件由于由振动引起的支撑结构的变形而变形，并且支撑结构在轴承的至少一个轴承中可振动地支撑装置，所述轴承被配置为铰接容器，例如铰链。

58. 发明授权

US08040023B2 Bending transducer for generating electrical energy from mechanical deformations 有权
标题翻译：用于从机械变形产生电能的弯曲换能器
公开(公告)号：US08040023B2
公开(公告)日：2011-10-18
申请号：US12538389
申请日：2009-08-10
申请人： Franz Laermer , Thorsten Pannek , Ralf Reichenbach , Marian Keck
发明人： Franz Laermer , Thorsten Pannek , Ralf Reichenbach , Marian Keck
IPC分类号： H01L41/113 , H01L41/053
CPC分类号： H01L41/1134 , B60C23/041 , H01L41/0475
摘要： A bending transducer device for generating electrical energy from deformations, and a circuit module which has such a bending transducer. The bending transducer includes at least one electrically deformable, vibration-capable, electrically conductive support structure, one piezoelectric element and a first contacting element, the conductive support structure having a first restraining area and a second restraining area for restraining the support structure, the piezoelectric element being designed and situated on the support structure in such a way that the piezoelectric element is deformable due to the deformation of the support structure caused by vibrations, and a first electrode for picking up the voltage generated by the deformation of the piezoelectric element is formed and contacted by the support structure, the first contacting element being connected electrically conductively to the support structure outside the first restraining area and the second restraining area.
摘要翻译：一种用于从变形产生电能的弯曲换能器装置，以及具有这种弯曲换能器的电路模块。弯曲换能器包括至少一个可电动变形的，具有振动能力的导电支撑结构，一个压电元件和第一接触元件，所述导电支撑结构具有用于约束支撑结构的第一约束区和第二约束区，元件被设计并且位于支撑结构上，使得压电元件由于由振动引起的支撑结构的变形而变形，并且形成用于拾取由压电元件的变形产生的电压的第一电极并且由所述支撑结构接触，所述第一接触元件电连接到所述第一约束区域和所述第二约束区域外的所述支撑结构。

59. 发明申请

US20110248604A1 METHOD FOR MANUFACTURING AT LEAST ONE MECHANICAL-ELECTRICAL ENERGY CONVERSION SYSTEM, AND MECHANICAL-ELECTRICAL ENERGY CONVERSION SYSTEM 有权
标题翻译：一种机械电力转换系统的制造方法和机电一体化转换系统
公开(公告)号：US20110248604A1
公开(公告)日：2011-10-13
申请号：US13061919
申请日：2009-07-08
申请人： Franz Laermer , Thorsten Pannek , Ralf Reichenbach , Marian Keck
发明人： Franz Laermer , Thorsten Pannek , Ralf Reichenbach , Marian Keck
IPC分类号： H01L41/22 , H01L41/053
CPC分类号： B60C23/0411 , H01L41/25 , H01L41/313 , H02N2/18 , Y10T29/42 , Y10T29/49002 , Y10T29/49128 , Y10T29/49169 , Y10T29/49828 , Y10T29/49904
摘要： In a method for manufacturing at least one mechanical-electrical energy conversion system including multiple individual parts, and a mechanical-electrical energy conversion, multiple different individual parts are positioned in an assembly device and joined in joining areas assigned to the individual parts in the assembly device, the individual parts including at least one piezoelectric element, one support structure and one seismic mass.
摘要翻译：在用于制造至少一个包括多个独立部件的机电能转换系统和机电能转换的方法中，将多个不同的单独部件定位在组装装置中并且连接到分配给组件中的各个部件的接合区域装置，各个部件包括至少一个压电元件，一个支撑结构和一个地震块。

60. 发明申请

US20110137254A1 Manufacturing method for a porous microneedle array and corresponding porous microneedle array and corresponding substrate composite 有权
标题翻译：多孔微针阵列和相应的多孔微针阵列和相应的底物复合材料的制造方法
公开(公告)号：US20110137254A1
公开(公告)日：2011-06-09
申请号：US12925804
申请日：2010-10-29
申请人： Dick Scholten , Michael Stumber , Franz Laermer , Ando Feyh
发明人： Dick Scholten , Michael Stumber , Franz Laermer , Ando Feyh
IPC分类号： A61M5/00 , B26F3/00
CPC分类号： A61M37/0015 , A61M2037/0053 , B81B2201/055 , B81B2203/0361 , B81C1/00111 , B81C2201/0114 , B81C2201/0115 , B81C2203/0118 , B81C2203/054 , Y10T225/10 , Y10T225/12
摘要： A manufacturing method for a porous microneedle array includes: forming a plurality of porous microneedle arrays, each having at least one microneedle and a porous carrier zone lying beneath it on the face of a semiconductor substrate; forming an interlayer between a non-porous residual layer of the semiconductor substrate located on the back side of the semiconductor substrate and the carrier zone, which has greater porosity than the carrier zone; detaching the residual layer from the carrier zone by breaking up the interlayer; and separating the microneedle arrays into corresponding chips.
摘要翻译：多孔微针阵列的制造方法包括：形成多个多孔微针阵列，每个多孔微针阵列在半导体衬底的表面上具有至少一个微针和位于其下方的多孔载体区; 在位于半导体衬底背面的半导体衬底的非多孔残留层与载体区之间形成中间层，所述载流区具有比载体区更大的孔隙率; 通过破坏夹层从载体区分离残留层; 并将微针阵列分离成相应的芯片。

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