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51. 发明授权

US07252097B2 System and method for integrating in-situ metrology within a wafer process 有权
标题翻译：在晶圆工艺中整合原位计量的系统和方法
公开(公告)号：US07252097B2
公开(公告)日：2007-08-07
申请号：US10606022
申请日：2003-06-24
申请人： John M. Boyd , John M. de Larios , Michael Ravkin , Fred C. Redeker
发明人： John M. Boyd , John M. de Larios , Michael Ravkin , Fred C. Redeker
IPC分类号： B08B3/00 , B08B7/04
CPC分类号： H01L21/67028 , G03F7/70341 , H01L21/67034 , H01L21/67051 , Y10S134/902
摘要： A system and method for processing a wafer includes applying a process to the wafer. The process being supported by a surface tension gradient device. A result of the process is monitored. The monitored result is output.
摘要翻译：用于处理晶片的系统和方法包括将工艺应用于晶片。该过程由表面张力梯度装置支撑。监视该过程的结果。输出监视结果。

52. 发明授权

US07383601B2 Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same 失效
标题翻译：使用兼容化学物质的底物刷洗涤和邻近清洁干燥顺序，以及用于实施相同化学品的方法，装置和系统
公开(公告)号：US07383601B2
公开(公告)日：2008-06-10
申请号：US11413916
申请日：2006-04-27
申请人： Michael Ravkin , John M. de Larios
发明人： Michael Ravkin , John M. de Larios
IPC分类号： B08B1/04 , B08B3/00
CPC分类号： B08B1/04 , B08B3/04 , H01L21/67046 , Y10S134/902
摘要： In one embodiment, a substrate preparation system is provided. The system includes a brush, a front head, and a back head. The brush is configured to brush scrub a back surface of a substrate using a brush scrubbing chemistry. The front head is defined in close proximity to a front surface of the substrate while the back head is defined in close proximity to the back surface of the substrate. The back head is positioned substantially opposite to the front head. The front head and the back head are applied as a pair to the substrate when the brush is apart from the substrate.
摘要翻译：在一个实施方案中，提供了底物制备系统。该系统包括刷子，前头部和后头部。刷被配置为使用刷洗化学物质刷洗基材的背面。前头被限定在紧邻衬底的前表面的位置，而后头部被限定为紧邻衬底的背面。后头位于与前头大致相对的位置。当刷子离开基板时，前头和后头一对被施加到基底。

53. 发明授权

US07045018B2 Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same 有权
标题翻译：使用兼容化学物质的底物刷洗涤和邻近清洁干燥顺序，以及用于实施相同化学品的方法，装置和系统
公开(公告)号：US07045018B2
公开(公告)日：2006-05-16
申请号：US10816432
申请日：2004-03-31
申请人： Michael Ravkin , John M. de Larios
发明人： Michael Ravkin , John M. de Larios
IPC分类号： B08B7/04
CPC分类号： H01L21/67051 , H01L21/67028 , H01L21/67046 , Y10S134/902
摘要： A method for cleaning and drying a front and a back surface of a substrate is provided. The method includes brush scrubbing the back surface of the substrate using a brush scrubbing fluid chemistry. The method further includes applying a front meniscus onto the front surface of the substrate upon completing the brush scrubbing of the back surface. The front meniscus includes a front cleaning chemistry that is chemically compatible with the brush scrubbing fluid chemistry.
摘要翻译：提供了用于清洁和干燥基板的前表面和后表面的方法。该方法包括使用刷洗涤流体化学刷刷洗衬底的背面。该方法进一步包括在完成后表面的刷子洗涤时将前弯月面施加到基底的前表面上。前弯液面包括与刷洗涤液化学物质化学相容的前清洗化学物质。

54. 发明授权

US06988327B2 Methods and systems for processing a substrate using a dynamic liquid meniscus 失效
公开(公告)号：US06988327B2
公开(公告)日：2006-01-24
申请号：US10404692
申请日：2003-03-31
申请人： James P. Garcia , John M. de Larios , Michael Ravkin , Fred C. Redeker , Carl Woods
发明人： James P. Garcia , John M. de Larios , Michael Ravkin , Fred C. Redeker , Carl Woods
IPC分类号： F26B5/04
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

55. 发明授权

US06261407B1 Method and apparatus for removal of thin films from wafers 有权
标题翻译：从晶圆上去除薄膜的方法和装置
公开(公告)号：US06261407B1
公开(公告)日：2001-07-17
申请号：US09342333
申请日：1999-06-29
申请人： Helmuth Treichel , Michael Ravkin , Don Anderson , John M. de Larios
发明人： Helmuth Treichel , Michael Ravkin , Don Anderson , John M. de Larios
IPC分类号： C23C1600
CPC分类号： H01L21/67126 , H01L21/67075
摘要： A method and apparatus for processing a wafer are described. In one embodiment, a method for processing a wafer comprises applying a sealing mechanism to the wafer to create multiple separate, sealed portions of the wafer, and applying a plurality of different chemistries to multiple separate, sealed portions of the wafer through the sealing mechanism.
摘要翻译：描述了一种用于处理晶片的方法和装置。在一个实施例中，一种用于处理晶片的方法包括向晶片施加密封机构以产生晶片的多个分离的密封部分，以及通过密封机构将多个不同的化学物质施加到晶片的多个分离的密封部分。

56. 发明授权

US07395611B2 System processing a substrate using dynamic liquid meniscus 失效
标题翻译：使用动态液体半月板处理衬底的系统
公开(公告)号：US07395611B2
公开(公告)日：2008-07-08
申请号：US11525278
申请日：2006-09-21
申请人： James P. Garcia , John M. de Larios , Michael Ravkin , Fred C. Redeker , Carl Woods
发明人： James P. Garcia , John M. de Larios , Michael Ravkin , Fred C. Redeker , Carl Woods
IPC分类号： F26B21/06
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.
摘要翻译：将弯液面从第一表面移动到第二表面的系统和方法包括在头部和第一表面之间形成弯液面。弯液面可以从第一表面移动到相邻的第二表面，相邻的第二表面平行于第一表面。移动弯液面的系统和方法也可以用于沿着基板的边缘移动弯月面。

57. 发明授权

US07127831B2 Methods and systems for processing a substrate using a dynamic liquid meniscus 有权
标题翻译：使用动态液体弯月面处理衬底的方法和系统
公开(公告)号：US07127831B2
公开(公告)日：2006-10-31
申请号：US11318019
申请日：2005-12-22
申请人： James P. Garcia , John M. de Larios , Michael Ravkin , Fred C. Redeker , Carl Woods
发明人： James P. Garcia , John M. de Larios , Michael Ravkin , Fred C. Redeker , Carl Woods
IPC分类号： F26B5/04
CPC分类号： C25D5/22 , C25D7/12 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/68707 , Y10S134/902
摘要： A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.
摘要翻译：将弯液面从第一表面移动到第二表面的系统和方法包括在头部和第一表面之间形成弯液面。弯液面可以从第一表面移动到相邻的第二表面，相邻的第二表面平行于第一表面。移动弯液面的系统和方法也可以用于沿着基板的边缘移动弯月面。

58. 发明授权

US07067016B1 Chemically assisted mechanical cleaning of MRAM structures 有权
标题翻译： MRAM结构的化学辅助机械清洗
公开(公告)号：US07067016B1
公开(公告)日：2006-06-27
申请号：US10404403
申请日：2003-03-31
申请人： Katrina Mikhaylichenko , Michael Ravkin
发明人： Katrina Mikhaylichenko , Michael Ravkin
IPC分类号： B08B7/00
CPC分类号： B08B1/04 , B08B3/08 , C11D7/06 , C11D11/0047 , H01L21/67046 , Y10S438/906
摘要： A method for post-etch cleaning of a substrate with MRAM structures and MJT structures and materials is disclosed. The method includes inserting the substrate into a first brush box configured for double-sided mechanical cleaning of the substrate. A non-HF, copper compatible chemistry is introduced into the first brush box for cleaning the active and backside surfaces of the substrate. The substrate is then inserted into a second brush box which is also configured to provide double-sided mechanical cleaning of the active and backside surfaces of the substrate. A burst of chemistry is introduced into the second brush box followed by a DIW rinse. The substrate is then processed through an SRD apparatus for final rinse and dry.
摘要翻译：公开了一种使用MRAM结构和MJT结构和材料对衬底进行后蚀刻清洁的方法。该方法包括将基板插入被配置为用于基板的双面机械清洁的第一刷盒中。将非HF，铜兼容化学物质引入到第一刷盒中以清洁基底的活性和背面。然后将衬底插入第二刷盒中，第二刷盒还被配置为提供衬底的活性和背面的双面机械清洁。将化学爆炸物引入第二刷盒中，然后进行DIW冲洗。然后将基底通过SRD装置进行处理，以进行最终冲洗和干燥。

59. 发明申请

US20060096048A1 System and method for a combined contact and non-contact wafer cleaning module 有权
标题翻译：组合接触和非接触式晶片清洗模块的系统和方法
公开(公告)号：US20060096048A1
公开(公告)日：2006-05-11
申请号：US11316780
申请日：2005-12-23
申请人： Katrina Mikhaylichenko , Michael Ravkin , John deLarios
发明人： Katrina Mikhaylichenko , Michael Ravkin , John deLarios
IPC分类号： B08B1/04
CPC分类号： B08B1/04 , H01L21/67046
摘要： A system and a method for cleaning and rinsing a wafer includes at least three rollers that are capable of supporting a wafer by an edge of the wafer. At least one of the rollers is driven and thereby capable of rotating the wafer. At least one of the rollers is a movable roller mounted on an actuator. The system and method also includes a first movable scrubbing roller capable of being moved away from and alternatively to the first side of the wafer. A second movable scrubbing roller capable of being moved away from and alternatively to a second side of the wafer is also included. The second side of the wafer opposes the first side of the wafer. The system and method also includes at least one first side nozzle directed toward the first side of the wafer and at least one second side nozzle directed toward the second side of the wafer.
摘要翻译：用于清洁和漂洗晶片的系统和方法包括能够通过晶片的边缘支撑晶片的至少三个辊。驱动至少一个辊，从而能够使晶片旋转。至少一个辊是安装在致动器上的可动辊。该系统和方法还包括能够远离晶片的第一侧移动的第一可移动擦洗辊。还包括能够移动离开晶片的另一侧的第二可动擦洗辊。晶片的第二面与晶片的第一面相反。该系统和方法还包括朝向晶片的第一侧的至少一个第一侧喷嘴和朝向晶片的第二侧的至少一个第二侧喷嘴。

60. 发明授权

US06733596B1 Substrate cleaning brush preparation sequence, method, and system 失效
标题翻译：基材清洁刷制备顺序，方法和系统
公开(公告)号：US06733596B1
公开(公告)日：2004-05-11
申请号：US10328887
申请日：2002-12-23
申请人： Katrina Mikhaylichenko , Michael Ravkin
发明人： Katrina Mikhaylichenko , Michael Ravkin
IPC分类号： B08B704
CPC分类号： H01L21/67046 , B08B1/04 , B08B3/02
摘要： A method for cleaning top and bottom surfaces of a semiconductor substrate is provided. The method includes scrubbing top and bottom surfaces of the semiconductor wafer with top and bottom brushes, respectively. Top and bottom brushes are saturated and supplied with a scrubbing fluid. The top and bottom brushes are squeezed so as to press out excess scrubbing fluid by continuing to apply top and bottom brushes against top and bottom surfaces of the semiconductor substrate, respectively, but without supplying the scrubbing fluid. Top and bottom brushes are respectively moved away from the top and bottom surfaces of the semiconductor substrate. The top brush is rotated so as to prevent dripping onto the top surface of the semiconductor substrate. Top and bottom surfaces of the semiconductor substrate are rinsed using a rinse fluid while continuing to rotate the top brush that was squeezed to press out the excess scrubbing fluid.
摘要翻译：提供一种用于清洁半导体衬底的顶表面和底表面的方法。该方法包括分别用顶刷和底刷擦洗半导体晶片的顶表面和底表面。顶部和底部刷子是饱和的，并提供洗涤液。顶部和底部刷子被挤压以便分别通过将顶部和底部刷子分别对准半导体衬底的顶部和底部表面，但不供应洗涤流体来压出多余的洗涤流体。顶部和底部刷子分别从半导体衬底的顶部和底部表面移开。顶刷被旋转以防止滴在半导体衬底的顶表面上。使用冲洗液冲洗半导体衬底的顶表面和底表面，同时继续旋转顶部刷，挤压挤出多余的洗涤流体。

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