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    • 52. 发明申请
    • DISPERSION COMPENSATION METHOD AND FIBER TRANSMISSION SYSTEM
    • 分散补偿方法和光纤传输系统
    • US20090175629A1
    • 2009-07-09
    • US12403865
    • 2009-03-13
    • Yue LiuWei FuZhihui Tao
    • Yue LiuWei FuZhihui Tao
    • H04B10/12H04B10/00H04B10/04H04B10/06
    • H04B10/25137H04B10/25133
    • A dispersion compensation method and a fiber transmission system are disclosed, pertaining to the field of fiber communications. The dispersion compensation method includes: after performing electrical pre-compensation processing on a digital transmit signal, the transmitting end controls the electrical/optical converting module to output a distorted optical signal; after receiving the optical signal, the receiving end performs post-compensation processing after converting the optical signal into an electrical signal, or converts the optical signal into an electrical signal after performing post-compensation processing on the optical signal. The fiber transmission system includes: a pre-compensation signal processing module, an optical source, an electrical/optical converting module, a fiber transmission line, an optical/electrical converting module, and a post-compensation processing module. With the technical solution of the present disclosure, the non-linear effect may be suppressed, and a flexible dispersion compensation solution may be provided for a dynamically configurable network.
    • 公开了涉及光纤通信领域的色散补偿方法和光纤传输系统。 色散补偿方法包括:在对数字发送信号进行电预处理处理之后,发送端控制电/光转换模块输出失真的光信号; 在接收到光信号之后,接收端在将光信号转换成电信号之后执行后补偿处理,或者在对光信号执行后补偿处理之后将光信号转换为电信号。 光纤传输系统包括:预补偿信号处理模块,光源,电/光转换模块,光纤传输线,光/电转换模块和后补偿处理模块。 利用本公开的技术方案,可以抑制非线性效应,并且可以为可动态配置的网络提供灵活的色散补偿解决方案。
    • 55. 发明授权
    • Methods of fabricating integrated optoelectronic devices
    • 集成光电子器件的制造方法
    • US07306959B2
    • 2007-12-11
    • US11022364
    • 2004-12-22
    • Yue Liu
    • Yue Liu
    • H01L21/00
    • H01L33/486H01L31/0203H01L2924/0002H01S5/0224H01S5/02272H01S5/18388H01L2924/00
    • This disclosure concerns methods for fabrication of integrated high speed optoelectronic devices. In one example of such a method, a device region that includes a top surface and a bottom surface is formed on a top surface of a substrate. The device region may take the form of an optical emitter, such as a VCSEL, or a detector, such as a photodiode. Next, an isolation region is formed that is configured such that the device region is surrounded by the isolation region. A superstrate is then disposed on the top surface of the device region. Finally, a micro-optical device, such as a lens, is placed on a top surface of the superstrate.
    • 本公开涉及用于制造集成高速光电子器件的方法。 在这种方法的一个实例中,包括顶表面和底表面的器件区域形成在衬底的顶表面上。 器件区域可以采取诸如VCSEL的光发射器或诸如光电二极管的检测器的形式。 接下来,形成隔离区域,其被配置为使得器件区域被隔离区域包围。 然后在装置区域的顶表面上设置覆盖层。 最后,诸如透镜的微光学装置被放置在顶板的顶表面上。