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    • 58. 发明授权
    • System and method for imprint lithography to facilitate dual damascene integration in a single imprint act
    • 用于压印光刻的系统和方法,以便于在单一印记法中双重镶嵌一体化
    • US07148142B1
    • 2006-12-12
    • US10874500
    • 2004-06-23
    • Srikanteswara Dakshina-MurthyBhanwar SinghKhoi A. Phan
    • Srikanteswara Dakshina-MurthyBhanwar SinghKhoi A. Phan
    • H01L21/44
    • G03F7/0002B82Y10/00B82Y40/00H01L21/76807H01L21/76817H01L2221/1021
    • A system and method are provided to facilitate dual damascene interconnect integration in a single imprint step. The method provides for creation of a translucent imprint mold with three-dimensional features comprising the dual damascene pattern to be imprinted. The imprint mold is brought into contact with a photopolymerizable organosilicon imaging layer deposited upon a transfer layer which is spin coated or otherwise deposited upon a dielectric layer of a substrate. When the photopolymerizable layer is exposed to a source of illumination, it cures with a structure matching the dual damascene pattern of the imprint mold. A halogen breakthrough etch followed by oxygen transfer etch transfer the vias from the imaging layer into the transfer layer. A second halogen breakthrough etch followed by a second oxygen transfer etch transfer the trenches from the imaging layer into the transfer layer. A dielectric etch transfers the pattern from the transfer layer into the dielectric layer. A metal fill process then fills the dual damascene openings of the dielectric layer with metal.
    • 提供了一种系统和方法,以便在单个压印步骤中促进双镶嵌互连集成。 该方法提供了具有三维特征的半透明压印模具的创建,该三维特征包括要印刷的双镶嵌图案。 压印模具与沉积在转移层上的可光聚合的有机硅成像层接触,转移层被旋涂或以其它方式沉积在基底的电介质层上。 当可光聚合层暴露于照明源时,它可以用匹配印模的双镶嵌图案的结构固化。 卤素穿透蚀刻随后氧传递蚀刻将通孔从成像层转移到转移层中。 第二个卤素穿透蚀刻,随后是第二次氧转移蚀刻,将沟槽从成像层转移到转移层中。 电介质蚀刻将图案从转印层转移到电介质层中。 然后,金属填充过程用金属填充介电层的双镶嵌开口。