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    • 53. 发明申请
    • CMOS STRUCTURE FOR BODY TIES IN ULTRA-THIN SOI (UTSOI) SUBSTRATES
    • 超薄SOI(UTSOI)衬底中的体型的CMOS结构
    • US20080248615A1
    • 2008-10-09
    • US11925136
    • 2007-10-26
    • Jeffrey W. Sleight
    • Jeffrey W. Sleight
    • H01L21/8238
    • H01L21/76229H01L21/84H01L27/1203H01L27/1207
    • The present invention provides a semiconducting structure including a substrate having an UTSOI region and a bulk-Si region, wherein the UTSOI region and the bulk-Si region have a same crystallographic orientation; an isolation region separating the UTSOI region from the bulk-Si region; and at least one first device located in the UTSOI region and at least one second device located in the bulk-Si region. The UTSOI region has an SOI layer atop an insulating layer, wherein the SOI layer has a thickness of less than about 40 nm. The bulk-Si region further comprises a well region underlying the second device and a contact to the well region, wherein the contact stabilizes floating body effects.
    • 本发明提供一种半导体结构,其包括具有UTSOI区域和体积-Si区域的衬底,其中UTSOI区域和体积-Si区域具有相同的晶体取向; 将UTSOI区域与体Si区域分离的隔离区域; 以及位于UTSOI区域中的至少一个第一器件和位于本体Si区域中的至少一个第二器件。 UTSOI区域在绝缘层顶上具有SOI层,其中SOI层的厚度小于约40nm。 体硅区域还包括位于第二器件下面的阱区域和与阱区域的接触,其中接触稳定浮体效应。
    • 54. 发明申请
    • CURVED FINFETS
    • 弯曲的熔体
    • US20080164535A1
    • 2008-07-10
    • US11621228
    • 2007-01-09
    • Dureseti ChidambarraoShreesh NarasimhaEdward J. NowakJohn J. PekarikJeffrey W. SleightRichard Q. Williams
    • Dureseti ChidambarraoShreesh NarasimhaEdward J. NowakJohn J. PekarikJeffrey W. SleightRichard Q. Williams
    • H01L29/78H01L21/336
    • H01L29/785H01L29/0649H01L29/66795H01L29/7843
    • A method of forming a transistor patterns a semiconductor fin on a substrate, such that the fin extends from the substrate. Then, the method forms a gate conductor over a central portion of the fin, leaving end portions of the fin exposed. Next, the end portions of the fin are doped with at least one impurity to leave the central portion of the fin as a semiconductor and form the end portions of the fin as conductors. The end portions of the fin are undercut to disconnect the end portions of the fin from the substrate, such that the fin is connected to the substrate along a central portion and is disconnected from the substrate along the end portions and that the end portions are free to move and the central portion is not free to move. A straining layer is formed on a first side of the fin and the straining layer imparts physical pressure on the fin such that the end portions are permanently moved away from a straight-line orientation with the central portion after the forming of the straining layer. Thus, the undercutting in combination with the forming of the straining layer curves the fin such that, when viewed from a top of the substrate, the fin is bowed and has a curved shape.
    • 一种形成晶体管的方法在衬底上形成半导体鳍片,使得鳍片从衬底延伸。 然后,该方法在鳍片的中心部分上形成栅极导体,使翅片的端部部分露出。 接下来,翅片的端部掺杂有至少一种杂质,以使翅片的中心部分作为半导体,并将翅片的端部形成为导体。 翅片的端部被底切以使翅片的端部与基板断开,使得翅片沿着中心部分连接到基板,并且沿着端部与基板断开,并且端部部分是自由的 移动,中央部分不能自由移动。 在翅片的第一侧上形成有应变层,并且应变层在翅片上施加物理压力,使得端部在紧固层形成之后永久地与中心部分的直线取向远离。 因此,与形成应变层相结合的底切使翅片弯曲,使得当从基板的顶部观察时,翅片弯曲并具有弯曲形状。