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    • 53. 发明专利
    • DE19910983A1
    • 2000-09-21
    • DE19910983
    • 1999-03-12
    • BOSCH GMBH ROBERT
    • BECKER VOLKERLAERMER FRANZSCHILP ANDREA
    • B81C99/00H01L21/02H01L21/66H01L21/306
    • The invention relates to a device and a method for determining the extent of an at least partial lateral undercut of a structured surface layer (23) on a sacrificial coating (21). To this end, a part of said structured surface layer (23) comprises at least one passive electronic component (31) with which a measurable physical variable can be determined that is proportional to the extent of the lateral undercut. According to the inventive method for producing said device, at least a part of the surface layer (21) on the structured surface layer (23) is provided in a first etching step with a structure comprising trenches (15'). In a second etching step, a lateral undercut on at least a part of the structured surface layer (23) is carried out starting from said trenches (15'). In the first etching step, at least one passive electronic component (31) is additionally produced by structuring a part of the surface layer (23). During the following undercutting of the surface layer (23) said electronic component is also undercut. The measurable physical variable is determined in a contactless manner, preferably by irradiating the passive component (31) with electromagnetic radiation.
    • 58. 发明专利
    • DE50015718D1
    • 2009-10-01
    • DE50015718
    • 2000-03-13
    • BOSCH GMBH ROBERT
    • BECKER VOLKERLAERMER FRANZSCHILP ANDREA
    • H01L21/66B81C99/00H01L21/02
    • A device and a method for determining the extent of an at least locally lateral undercut of a structured surface layer on a sacrificial layer. The structured surface layer for this purpose locally has at least one passive electronic component, using which a physical measured quantity can be determined, which is proportional to the extent of the lateral undercut. The method for generating this device proposes, initially on the structured surface layer in a first etching method, to provide the surface layer at least locally with a structuring having trenches and, in a second etching method, proceeding from the trenches, to undertake at least locally a lateral undercut of the structured surface layer. In this context, in the first etching method on the surface layer, locally at least one passive electronic component is additionally delineated out, which in response to a subsequent undercutting of the surface layer is also undercut. The physical measured quantity is determined without contact, preferably by sending an electromagnetic emission into the passive component.