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    • 54. 发明申请
    • Thermo-expansive microspheres, their production process and their application
    • 热膨胀微球,其生产工艺及其应用
    • US20050080151A1
    • 2005-04-14
    • US10954212
    • 2004-10-01
    • Katsushi MikiToshiaki MasudaIchiro TakaharaTakashi FujieIkuo Yosejima
    • Katsushi MikiToshiaki MasudaIchiro TakaharaTakashi FujieIkuo Yosejima
    • B01J13/14C08J9/32C08J9/00
    • C08J9/32B01J13/14C08J2203/14C08J2203/22
    • The present invention provides thermo-expansive microspheres comprising thermoplastic resinous shell and a blowing agent being encapsulated in the shell, the blowing agent which is a fluorine-containing C2-10 compound having ether linkage, being free of chlorine and bromine atoms and gasifying at a temperature not higher than the softening point of the thermoplastic resin; and also provides the production and application processes thereof. The thermo-expansive microspheres have preferably an average particle size ranging from 1 to 100 μm and a CV, or coefficient of variation, of particle size distribution being 30% or less, and a retaining ratio of blowing agent encapsulated being 90% or more. The thermo-expansive microspheres have low environmental loading and superior flame-retardant or flame-resistant performance, and have particle sizes distributing in narrow ranges. Those thermo-expansive microspheres and foamed hollow microspheres are suitable for applying to fire-proof paints, flame-retardant or flame-resistant thermo-insulating materials, flame-retardant or flame-resistant lightweight fillers, and flame-retardant or flame-resistant lightweight molded products, in addition to the conventional application field.
    • 本发明提供包含热塑性树脂壳和封装在壳中的发泡剂的热膨胀性微球,发泡剂是具有醚键的含氟C2-10化合物,不含氯和溴原子,并在 温度不高于热塑性树脂的软化点; 并提供其生产和应用程序。 热膨胀性微球体的平均粒径优选为1〜100μm,粒径分布的CV或变异系数为30%以下,发泡剂的保持率为90%以上。 热膨胀微球具有低环境负荷和优异的阻燃或阻燃性能,并且粒度分布范围窄。 这些热膨胀微球和发泡中空微球适用于防火涂料,阻燃或阻燃绝热材料,阻燃或阻燃轻质填料,以及阻燃或阻燃轻质 模制产品,除了常规应用领域。
    • 57. 发明授权
    • Heat-expandable microcapsules and method of utilizing the same
    • 热膨胀性微囊及其利用方法
    • US06235800B1
    • 2001-05-22
    • US09646050
    • 2000-09-13
    • Seiji KyunoToshiaki Masuda
    • Seiji KyunoToshiaki Masuda
    • C08J932
    • B01J13/025B01J13/14C08J9/32C08J2203/22
    • The present invention relates to a heat-expandable microcapsule produced from acrylonitrile and N-substituted maleimide as the main polymerizable monomers, or further a monomer giving a hompolymer having a Tg of 50 to 200° C. and polymerizable unsaturated carboxylic acid (including anhydrides), resin foam using this, and a process for producing a foamed resin composite. The present invention can provide a heat-expandable microcapsule that is less apt to color even upon thermal expansion at 200° C. or higher, and a resin foam and a foamed resin composite capable of forming a processed surface, e.g., a matte surface giving a bulky feeling, by using this microcapsule.
    • 本发明涉及由丙烯腈和N-取代的马来酰亚胺作为主要的可聚合单体制备的热膨​​胀性微胶囊,或者另外提供Tg为50〜200℃的均聚物的单体和可聚合不饱和羧酸(包括酸酐) ,使用该树脂发泡体,以及发泡树脂复合体的制造方法。 本发明可以提供即使在200℃以上的热膨胀下也不易变色的热膨胀性微胶囊,以及能够形成加工面的树脂发泡体和发泡树脂复合体,例如赋予 笨重的感觉,通过使用这个微胶囊。