专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明申请

US20100258287A1 HEAT SINK AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20100258287A1
公开(公告)日：2010-10-14
申请号：US12537267
申请日：2009-08-07
申请人： GUO CHEN , PENG LIU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： GUO CHEN , PENG LIU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： H01L21/4882 , H01L23/3672 , H01L23/3677 , H01L2924/0002 , Y10T29/4935 , Y10T29/49368 , H01L2924/00
摘要： A heat sink includes a base, a cover and plurality of columned fins. The base protrudes a plurality of studs from a top surface thereof. The cover defines a plurality of recesses and orifices therein. The columned fins each have a head received in corresponding recess of the base and a body extending from the head through the cover. The base joints with the cover by the studs of the base riveted in the orifices of the cover. The base cooperates with the cover to sandwich the heads of the fins therebetween to thereby secure the columned fins to the cover.
摘要翻译：散热器包括基座，盖和多个柱状翅片。底座从其顶面突出多个螺柱。该盖在其中限定多个凹口和孔。柱状翅片各自具有容纳在基部的相应凹部中的头部和从头部延伸穿过盖子的本体。基座上的基座与基座的螺栓铆接在盖子的孔中。基座与盖配合以将翅片的头部夹在其间，从而将柱状翅片固定到盖上。

52. 发明申请

US20100243207A1 THERMAL MODULE 审中-公开
标题翻译：热模块
公开(公告)号：US20100243207A1
公开(公告)日：2010-09-30
申请号：US12504683
申请日：2009-07-17
申请人： PENG LIU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： PENG LIU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F13/00 , F28F7/00
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/04 , F28F1/32 , F28F3/02 , F28F3/022 , H01L2924/0002 , H01L2924/00
摘要： A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick structure is received in the chamber and attached to an inner wall of the heat spreader surrounding the chamber. The fin unit comprises a plurality of fins stacked together.
摘要翻译：热模块包括平板散热器，布置在散热器上方的翅片单元和将散热器与散热片单元互连的多个实心极。散热器在其中限定了一个室。工作流体填充在腔室中。灯芯结构被容纳在腔室中并且附接到围绕室的散热器的内壁。翅片单元包括堆叠在一起的多个翅片。

53. 发明申请

US20100163213A1 ACTIVE HEAT SINK FOR USE WITH ELECTRONIC DEVICE 失效
标题翻译：与电子设备一起使用的主动散热器
公开(公告)号：US20100163213A1
公开(公告)日：2010-07-01
申请号：US12496653
申请日：2009-07-02
申请人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0208 , F28D15/0275 , F28F1/34 , F28F13/125 , F28F2215/00 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
摘要翻译：散热器包括导热基座，热连接并相对于基座旋转的导热轴和多个翅片。轴包括热连接到基座的热吸收部分和与吸热部分连接的散热部分。翅片设置在轴的散热部分上。

54. 发明申请

US20100147502A1 HEAT DISSIPATION DEVICE WITH HEAT PIPE 审中-公开
标题翻译：热管散热装置
公开(公告)号：US20100147502A1
公开(公告)日：2010-06-17
申请号：US12432745
申请日：2009-04-29
申请人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F1/10
CPC分类号： F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F13/08 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat pipe. The heat pipe includes an evaporating section connecting with a heat spreader, a condensing section connecting with a fin assembly, and a connecting section interconnecting the evaporating section and the condensing section. The evaporating section of the heat pipe has a diameter smaller than that of the condensing section.
摘要翻译：散热装置包括热管。热管包括与散热器连接的蒸发部分，与翅片组件连接的冷凝部分和将蒸发部分和冷凝部分互连的连接部分。热管的蒸发部分的直径小于冷凝部分的直径。

55. 发明申请

US20100101757A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20100101757A1
公开(公告)日：2010-04-29
申请号：US12396484
申请日：2009-03-03
申请人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHOU-BIAO XU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting.
摘要翻译：从电子设备去除热量的散热装置包括基板，与基板热连接的散热片，固定部件和两个风扇。固定构件包括联接到翅片组的顶部的驱动部分，位于翅片组的圆周的两个相对侧的两个安装部分和从驱动部分向外延伸并与两个安装部分连接的两个连接臂。分别安装在固定构件的两个安装部分上并且位于翅片组的圆周的两个相对位置处的两个风扇被驱动以由驱动部分围绕翅片组的周边旋转，并产生两股气流其流过不相交的翅片组。

56. 发明授权

US07646604B2 Heat dissipation device having a fan mounted thereon 失效
标题翻译：具有安装在其上的风扇的散热装置
公开(公告)号：US07646604B2
公开(公告)日：2010-01-12
申请号：US11767040
申请日：2007-06-22
申请人： Jun Cao , Peng Liu , Shi-Wen Zhou
发明人： Jun Cao , Peng Liu , Shi-Wen Zhou
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： F28D15/0275 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for at least a heat-generating electronic component includes a heat sink, a fan for providing an airflow through the heat sink and a fan holder coupling the fan to the heat sink. The heat sink has a first locking part and a second locking part opposite to the first locking part. The fan holder has a first engaging part engaging with the first locking part at one side of the heat sink and a second engaging part engaging with the second locking part of the heat sink at an opposite side thereof. The first engaging part has a horizontally extending fixing arm and a barb extending downwardly from the fixing arm and hooking with a top side of the heat sink.
摘要翻译：用于至少一个发热电子部件的散热装置包括散热器，用于提供通过散热器的气流的风扇和将风扇连接到散热器的风扇架。散热器具有与第一锁定部相对的第一锁定部和第二锁定部。风扇保持器具有与散热器一侧的第一锁定部分接合的第一接合部分和在其相对侧与散热器的第二锁定部分接合的第二接合部分。第一接合部分具有水平延伸的固定臂和从固定臂向下延伸并与散热器的顶侧钩住的倒钩。

57. 发明授权

US07631850B2 Apparatus for supporting cooling device 失效
标题翻译：用于支撑冷却装置的装置
公开(公告)号：US07631850B2
公开(公告)日：2009-12-15
申请号：US11135745
申请日：2005-05-24
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Ping-An Yang , Meng Fu
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).
摘要翻译：一种用于在其上支撑冷却装置（30）的装置（1）包括托架（10）和在其上承载冷却装置（30）的鞍座（20）。支架（10）限定了两个相对的轨道（12），（13）和沿轨道（12），（13）延伸的方向延伸的洗衣板状构件（14）。所述鞍座（20）包括定位构件（26），所述定位构件（26）接合在所述盥洗板状构件（14）中，以将所述鞍座（20）定位到所述支架（10）以及可在所述轨道（12）上滑动的两个块（24），在定位构件（26）与盥洗板状构件（14）分离的条件下，支架（10）的底面（13）是13。

58. 发明申请

US20090284927A1 HEAT SINK AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20090284927A1
公开(公告)日：2009-11-19
申请号：US12252373
申请日：2008-10-16
申请人： YI-JIUN LI , PENG LIU , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： YI-JIUN LI , PENG LIU , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： H05K7/20 , B21D53/02
CPC分类号： H01L23/3677 , H01L21/4882 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
摘要翻译：散热器包括基板和从基板向上延伸的多个圆柱形销。圆柱销每个包括上消散部分，下安装部分和消散部分和安装部分之间的接合部分。安装部分周向地装配在基板的相应孔的下部中。接合部的直径小于安装部的直径。接合部分被基板的内壁夹住，通过在对应的孔的边缘处向下冲压基板的上表面来限定基板的相应孔的上部。

59. 发明申请

US20090255648A1 PROTECTIVE DEVICE FOR PROTECTING THERMAL INTERFACE MATERIAL AND FASTENERS OF HEAT DISSIPATION DEVICE 有权
标题翻译：用于保护热界面材料的保护装置和散热装置的紧固件
公开(公告)号：US20090255648A1
公开(公告)日：2009-10-15
申请号：US12102016
申请日：2008-04-14
申请人： SHI-WEN ZHOU , JUN CAO , QING-SONG XU
发明人： SHI-WEN ZHOU , JUN CAO , QING-SONG XU
IPC分类号： F28F7/00
CPC分类号： F28D15/0275 , F28F2265/02 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
摘要翻译：散热装置组件包括用于从电子元件散发热量的散热装置和保护装置组件。所述散热装置包括具有贯穿其中的紧固件的基座，布置在所述基座的顶部上的多个翅片以及附接在所述基座的底部上的导热板。热界面材料散布在导热板的底表面上。保护装置组件包括附接到导热板的底部的第一盖和与第一盖分离并附接到基部的侧面的第二盖。当散热装置运输时，第一盖保护热界面材料免受污染，并且第二盖保护紧固件免于从基座掉落。

60. 发明申请

US20090242168A1 HEAT SINK ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：散热装置及其制造方法
公开(公告)号：US20090242168A1
公开(公告)日：2009-10-01
申请号：US12056298
申请日：2008-03-27
申请人： JUN CAO , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： JUN CAO , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00
CPC分类号： F28F1/32 , F28D15/0266 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
摘要翻译：散热器组件包括基座，翅片组和与基座和翅片组连接的热管。翅片组包括多个翅片。每个翅片在其下部限定凹部。热管包括延伸穿过基座的蒸发部分和延伸穿过翅片组的冷凝部分。基座沿圆周方向嵌合在翅片的凹槽中。基座，翅片组和热管直接相互紧密连接。凹槽和底座具有相应的T形轮廓。每个翅片形成限定凹部的弯曲凸缘。弯曲的法兰与基座和热管的蒸发部分紧密接触。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式