会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 56. 发明授权
    • Method for transferring wafer cassettes after checking whether process equipment is in a suitable mode
    • 在检查过程设备是否处于合适模式之后转移晶片盒的方法
    • US06175777B1
    • 2001-01-16
    • US09008083
    • 1998-01-16
    • Sang-yong Kim
    • Sang-yong Kim
    • G06F1900
    • H01L21/67276H01L21/67763
    • A method and system for transferring a wafer cassette between an Automated Guide Vehicle (AGV) and process equipment in a semiconductor fabrication facility involves transmitting a first signal from the AGV to the process equipment indicative of a cassette transfer request, checking whether the process equipment is in a suitable mode, setting the process equipment to the suitable mode after the checking step if the process equipment was not already in the suitable mode, and transferring the cassette between the AGV and the process equipment. A second transmitting step may be included, which sends a signal from the process equipment to the AGV authorizing the transfer of the cassette. The transmissions may be accomplished by wireless communications links such as a photo-coupled Parallel Input/Output link. A plurality of sensors may be used to detect whether a cassette is anywhere on a cassette stage during the checking step.
    • 用于在半导体制造设备中的自动引导车辆(AGV)和处理设备之间传送晶片盒的方法和系统包括将来自AGV的第一信号发送到指示盒传送请求的处理设备,检查处理设备是否是 在合适的模式下,如果过程设备尚未处于适当的模式,并且在AGV和处理设备之间传送盒子,则在检查步骤之后将处理设备设置为适当的模式。 可以包括第二发送步骤,其将来自处理设备的信号发送到授权传送盒式磁带的AGV。 传输可以通过诸如光耦合并行输入/输出链路的无线通信链路来实现。 可以使用多个传感器来检测在检测步骤期间盒式磁带是否在盒式磁带的任何位置。
    • 57. 发明授权
    • Masking process for forming self-aligned dual wells or self-aligned
field-doping regions
    • 用于形成自对准双阱或自对准场掺杂区的掩模工艺
    • US6090715A
    • 2000-07-18
    • US223458
    • 1998-12-30
    • Sang-Yong Kim
    • Sang-Yong Kim
    • H01L21/027H01L21/266H01L21/00
    • H01L21/266
    • A masking process for forming first and second ion-doped regions on a substrate of a semiconductor device. An oxide layer and a first nitride layer are formed on the substrate in order. The first nitride layer is etched using a photolithography process to form a first predetermined pattern which exposes portions of the oxide layer. The exposed portions of the oxide layer are then etched using the first predetermined pattern as an etching mask, until portions of the substrate corresponding to the first ion-doped regions are exposed. Next, first ions are doped into the exposed portions of the substrate using the first predetermined pattern as a doping mask. The first predetermined pattern is removed. A second nitride layer is then formed over the substrate and the patterned oxide layer. Portions of the second nitride layer are removed to reveal the top of the patterned oxide layer, forming a second predetermined pattern on the substrate. The patterned oxide layer is etched, using the second predetermined pattern as an etching mask, until portions of the substrate corresponding to the second ion-doped regions are exposed. Next, second ions are doped into the exposed portions of the substrate using the second predetermined pattern as a doping mask.
    • 一种用于在半导体器件的衬底上形成第一和第二离子掺杂区域的掩模工艺。 依次在基板上形成氧化物层和第一氮化物层。 使用光刻工艺蚀刻第一氮化物层,以形成暴露部分氧化物层的第一预定图案。 然后使用第一预定图案作为蚀刻掩模蚀刻氧化物层的暴露部分,直到暴露与第一离子掺杂区域对应的基板的部分。 接下来,使用第一预定图案作为掺杂掩模,将第一离子掺杂到衬底的暴露部分中。 第一预定图案被去除。 然后在衬底和图案化氧化物层上形成第二氮化物层。 去除第二氮化物层的部分以露出图案化氧化物层的顶部,在衬底上形成第二预定图案。 使用第二预定图案作为蚀刻掩模蚀刻图案化氧化物层,直到暴露与第二离子掺杂区域相对应的衬底的部分。 接下来,使用第二预定图案作为掺杂掩模,将第二离子掺杂到衬底的暴露部分中。