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    • 54. 发明申请
    • METHODS AND SYSTEMS FOR INSPECTION OF A SPECIMEN USING DIFFERENT INSPECTION PARAMETERS
    • 使用不同检查参数检验样本的方法和系统
    • US20100238433A1
    • 2010-09-23
    • US12796047
    • 2010-06-08
    • Steve R. LangePaul Frank MarellaNat CeglioShiow-Hwei HwangTao-Yi Fu
    • Steve R. LangePaul Frank MarellaNat CeglioShiow-Hwei HwangTao-Yi Fu
    • G01N21/01
    • G01N21/9501G01N21/8806
    • Methods and systems for inspection of a specimen using different parameters are provided. One computer-implemented method includes determining optimal parameters for inspection based on selected defects. This method also includes setting parameters of an inspection system at the optimal parameters prior to inspection. Another method for inspecting a specimen includes illuminating the specimen with light having a wavelength below about 350 nm and with light having a wavelength above about 350 nm. The method also includes processing signals representative of light collected from the specimen to detect defects or process variations on the specimen. One system configured to inspect a specimen includes a first optical subsystem coupled to a broadband light source and a second optical subsystem coupled to a laser. The system also includes a third optical subsystem configured to couple light from the first and second optical subsystems to an objective, which focuses the light onto the specimen.
    • 提供了使用不同参数检查试样的方法和系统。 一种计算机实现的方法包括基于所选择的缺陷来确定用于检查的最佳参数。 该方法还包括在检查之前将检查系统的参数设置为最佳参数。 用于检查样品的另一种方法包括用波长低于约350nm的光和波长高于约350nm的光照射样品。 该方法还包括处理代表从样品收集的光的信号,以检测样品上的缺陷或过程变化。 配置成检查样本的一个系统包括耦合到宽带光源的第一光学子系统和耦合到激光器的第二光学子系统。 该系统还包括配置成将来自第一和第二光学子系统的光耦合到物镜的第三光学子系统,其将光聚焦到样本上。
    • 59. 发明授权
    • Systems and methods for closed loop defect reduction
    • 闭环缺陷减少的系统和方法
    • US07236847B2
    • 2007-06-26
    • US10342819
    • 2003-01-15
    • Paul Frank Marella
    • Paul Frank Marella
    • G06F17/50H01L21/00
    • H01L22/20G01N21/55
    • Systems and methods for repairing defects on a specimen are provided. A method may include processing a specimen, detecting defects on the specimen, and repairing one or more of the defects. An additional method may include detecting defects on a specimen, repairing one or more of the defects, and inspecting the specimen to detect defects remaining on the specimen subsequent to repair. A system may include a process chamber, a measurement device configured to detect defects on a specimen, and a repair tool configured to repair one or more of the defects detected on the specimen. An additional system may include a measurement device, a repair tool, and an inspection tool configured to detect defects remaining on the specimen subsequent to repair. The systems may also include a processor configured to alter a parameter of an instrument coupled to the repair tool in response to output from the measurement device.
    • 提供了用于修复试样缺陷的系统和方法。 方法可以包括处理样品,检测样品上的缺陷,以及修复一个或多个缺陷。 附加方法可以包括检测样本上的缺陷,修复一个或多个缺陷,以及检查样本以检测在修复之后残留在样本上的缺陷。 系统可以包括处理室,被配置为检测样本上的缺陷的测量装置和被配置为修复在样本上检测到的一个或多个缺陷的修复工具。 附加系统可以包括测量装置,修理工具和检查工具,其被配置为检测在修复之后残留在样本上的缺陷。 系统还可以包括处理器,其被配置为响应于来自测量装置的输出而改变耦合到修复工具的仪器的参数。