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51. 发明申请

US20110081768A1 WORKPIECE DIVIDING METHOD 审中-公开
标题翻译：工作分歧方法
公开(公告)号：US20110081768A1
公开(公告)日：2011-04-07
申请号：US12885675
申请日：2010-09-20
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： H01L21/78
CPC分类号： H01L21/67092 , H01L21/78
摘要： In a workpiece dividing method, an expansion tape is stuck to an adhesive film side of a workpiece in a state where an adhesive film is stuck to the rear surface of a wafer. Respective positions of the predetermined dividing lines on the front surface of the wafer are detected. On the basis of information on the detected predetermined dividing lines, a laser beam passing through the wafer from the front surface of the wafer is focused on and directed to the front surface or inside of the adhesive film to form modified areas on the front surface of or in the inside of the adhesive film. On the basis of information on the detected predetermined dividing lines, a laser beam passing through the wafer from the front surface of the wafer is focused on and directed to the inside of the wafer to form modified areas in the inside of the wafer. The expansion tape is expanded to divide the workpiece along the predetermined dividing lines with the modified areas taken as start points.
摘要翻译：在工件分割方法中，在粘合膜粘附到晶片的后表面的状态下，将膨胀带粘贴到工件的粘合膜侧。检测在晶片前表面上的预定划分线的相应位置。基于检测到的预定分割线的信息，从晶片的前表面通过晶片的激光束聚焦在并指向粘合膜的前表面或内部，以在粘合膜的前表面上形成改质区域或在粘合膜的内部。基于检测到的预定分割线的信息，从晶片的前表面通过晶片的激光束被聚焦并导向晶片的内部，以在晶片内部形成改质区域。膨胀带被扩展以沿着预定分割线划分工件，将修改后的区域作为起点。

52. 发明授权

US07803696B2 Wafer dividing method 有权
标题翻译：晶圆分割法
公开(公告)号：US07803696B2
公开(公告)日：2010-09-28
申请号：US11705428
申请日：2007-02-13
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , B28D5/0052 , H01L21/67092 , H01L21/6836 , H01L2221/68327
摘要： A method of dividing a wafer which is partitioned by a plurality of first dividing lines extending in a predetermined direction and a plurality of second dividing, lines formed in a direction perpendicular to the plurality of first dividing lines, along the first dividing lines and the second dividing lines, comprising the step of forming a first continuous deteriorated layer in the inside of the wafer along the first dividing lines by applying a laser beam along the first dividing lines; the step of forming a second deteriorated layer in the inside of the wafer along the second dividing lines except for the intersections with the first dividing lines by applying a laser beam along the second dividing lines except for the intersections with the first dividing lines; the step of dividing the wafer along the first dividing lines where the first deteriorated layer has been formed by exerting external force to the wafer along the first dividing lines; and the step of dividing the wafer along the second dividing lines where the second deteriorated layer has been formed by exerting external force to the wafer along the second dividing lines.
摘要翻译：一种分割由沿预定方向延伸的多个第一分割线分隔的晶片和沿与第一分割线垂直的方向形成的多个第二分割线的方法，沿着第一分割线和第二分割线分割线，包括通过沿着第一分割线施加激光束沿着第一分割线在晶片内部形成第一连续劣化层的步骤; 除了与第一分割线的交点之外，通过沿除了与第一分割线的交点之外的第二分割线施加激光束，沿着第二分割线在晶片内部形成第二劣化层的步骤; 通过沿着第一分割线向晶片施加外力，沿着已经形成第一劣化层的第一分割线分割晶片的步骤; 以及通过沿着第二分割线向晶片施加外力，沿着已经形成第二劣化层的第二分割线分割晶片的步骤。

53. 发明申请

US20100116919A1 SELF-PROPELLED CRUSHING SYSTEM 失效
标题翻译：自蔓延破碎系统
公开(公告)号：US20100116919A1
公开(公告)日：2010-05-13
申请号：US12597552
申请日：2008-04-11
申请人： Mitsunobu Yamada , Toshimasa Kanda , Hiroyuki Umeda , Koya Iizuka , Masaru Nakamura , Masaaki Uetake
发明人： Mitsunobu Yamada , Toshimasa Kanda , Hiroyuki Umeda , Koya Iizuka , Masaru Nakamura , Masaaki Uetake
IPC分类号： B02C23/02
CPC分类号： B02C21/026 , B02C23/02
摘要： A mobile crushing system is for crushing inputted objects and dropping the crushed objects directly into an ore path. The mobile crushing system includes a crusher vehicle on which a crushing device for crushing the objects is mounted and which includes carriers, and a feeder vehicle on which a transfer device for transferring the objects to the crushing device and which includes carriers. The crusher vehicle and the feeder vehicle travel independently and include a crusher-side connecting portion and a feeder-side connecting portion that are connected to each other. During crushing operation, the ore path is interposed between the crusher vehicle and the feeder vehicle in the front-rear direction.
摘要翻译：移动破碎系统用于破碎输入物体并将破碎的物体直接放入矿石路径。移动破碎系统包括：破碎机，其上安装有用于破碎物体的破碎装置，并且包括载体;以及馈送车，其上传送装置用于将物体传送到破碎装置并包括载体。破碎机车辆和送料车辆独立地行进，并且包括彼此连接的破碎机侧连接部和进料器侧连接部。在破碎操作期间，矿石路径在前后方向插入在破碎机车辆和进料车辆之间。

54. 发明申请

US20100099221A1 STACKED DEVICE MANUFACTURING METHOD 有权
标题翻译：堆叠设备制造方法
公开(公告)号：US20100099221A1
公开(公告)日：2010-04-22
申请号：US12576010
申请日：2009-10-08
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： H01L21/50
CPC分类号： H01L21/6836 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68336 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
摘要： A stacked device manufacturing method including a kerf forming step of forming a kerf on the front side of each of plural wafers along each street, the kerf having a depth corresponding to a predetermined finished thickness of each wafer, a first stacking step of stacking a first one of the wafers and a second one of the wafers in such a manner that the front side of the second wafer is opposed to the front side of the first wafer and that the electrodes of the second wafer are respectively bonded to the electrodes of the first wafer, a first back grinding step of grinding the back side of the second wafer to expose each kerf of the second wafer to the back side of the second wafer, a second stacking step of stacking a third one of the wafers to the second wafer in such a manner that the front side of the third wafer is opposed to the back side of the second wafer and that the electrodes of the third wafer are respectively bonded to the electrodes of the second wafer, and a second back grinding step of grinding the back side of the third wafer to expose each kerf of the third wafer to the back side of the third wafer.
摘要翻译：一种堆叠式装置制造方法，包括：沿着每条街道在多个晶片的前侧形成切口的切口形成步骤，所述切口具有与每个晶片的预定最终厚度对应的深度;第一堆叠步骤，一个晶片和第二个晶片，使得第二晶片的前侧与第一晶片的前侧相对，并且第二晶片的电极分别接合到第一晶片的电极晶片，第一后研磨步骤，其研磨第二晶片的背面以将第二晶片的每个切口暴露于第二晶片的背面;第二堆叠步骤，将第三个晶片堆叠到第二晶片; 使得第三晶片的前侧与第二晶片的背面相对并且第三晶片的电极分别接合到第二晶片的电极，并且第二背面研磨步骤，研磨第三晶片的背面以将第三晶片的每个切口暴露于第三晶片的背面。

55. 发明授权

US07682858B2 Wafer processing method including formation of a deteriorated layer 有权
标题翻译：晶片加工方法，包括形成劣化层
公开(公告)号：US07682858B2
公开(公告)日：2010-03-23
申请号：US11151526
申请日：2005-06-14
申请人： Yusuke Nagai , Satoshi Kobayashi , Masaru Nakamura
发明人： Yusuke Nagai , Satoshi Kobayashi , Masaru Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L21/304 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/78 , H01L2221/6834
摘要： A wafer processing method for dividing a wafer having function elements in area sectioned by dividing lines formed on the front surface in a lattice pattern into individual chips along the dividing lines, comprising a deteriorated layer forming step for forming a deteriorated layer on the side of the back surface of a position at a distance corresponding to the final thickness of the chip from the front surface of the wafer by applying a laser beam capable of passing through the wafer along the dividing lines from the back surface of the wafer; a dividing step for dividing the wafer into individual chips along the dividing lines by applying external force to the wafer in which the deteriorated layer has been formed along the dividing lines; and a back surface grinding step for grinding the back surface of the wafer divided into individual chips to the final thickness of the chip.
摘要翻译：一种晶片处理方法，其特征在于，将沿着划分线将在前表面上形成的划分线的划分线的区域的功能元件分割为各个芯片，所述晶片处理方法包括在劣化层形成步骤中形成劣化层通过施加能够从晶片的背面沿着划分线穿过晶片的激光束，从与晶片的前表面相对应的与芯片的最终厚度相对应的距离的位置的背面; 分割步骤，通过沿着分割线向已经形成有劣化层的晶片施加外力，沿着分割线将晶片分割成单个芯片; 以及后表面研磨步骤，用于将分成单个芯片的晶片的背面研磨至芯片的最终厚度。

56. 发明授权

US07666760B2 Method of dividing wafer 有权
标题翻译：分割晶片的方法
公开(公告)号：US07666760B2
公开(公告)日：2010-02-23
申请号：US12272320
申请日：2008-11-17
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/78
摘要： A method of dividing a wafer includes: a denatured layer forming step of forming a denatured layer in the inside of the wafer along streets; a first feeding step in which the whole area of the wafer's back-side surface is suction held, and the wafer is mounted on a support base of a tape adhering unit, with the wafer's back-side surface on the upper side; a dicing tape adhering step of adhering a dicing tape to the wafer's back-side surface and an annular frame; a wafer reversing step of reversing the wafer and the annular frame face side back; a second feeding step of feeding said wafer and said annular frame to a tape expanding unit whole holding them by suction; a protective tape peeling step of peeling off a protective tape adhered to the wafer's face-side surface; and a wafer dividing step of expanding the dicing tape so as to divide the wafer along the streets along which the denatured layer has been formed.
摘要翻译：分割晶片的方法包括：变性层形成步骤，沿着街道在晶片内部形成变性层; 将晶片背面的整个区域吸引保持的第一供给工序，将晶片安装在带状粘接单元的支撑基板上，将晶片的背面设置在上侧; 将切割带粘附到晶片的背面表面的切割胶粘合步骤和环形框架; 将晶片和环形框架面侧反转的晶片倒转步骤; 第二馈送步骤，将所述晶片和所述环形框架馈送到整个通过抽吸保持它们的带扩展单元; 保护带剥离步骤，剥离粘附到晶片的表面侧的保护带; 以及晶片分割步骤，使切割带扩展，以沿着形成有变性层的街道划分晶片。

57. 发明申请

US20090303853A1 Optical information recording/reproduction apparatus and recording condition adjusting method 失效
标题翻译：光信息记录/再现装置和记录条件调整方法
公开(公告)号：US20090303853A1
公开(公告)日：2009-12-10
申请号：US12309032
申请日：2007-06-27
申请人： Masaru Nakamura
发明人： Masaru Nakamura
IPC分类号： G11B7/00
CPC分类号： G11B20/10009 , G11B7/005 , G11B20/10037 , G11B20/10046 , G11B20/10055 , G11B20/10101 , G11B20/10111 , G11B20/1012 , G11B20/10212 , G11B20/10296 , G11B20/10425 , G11B20/14 , G11B2220/2537
摘要： An adaptive equalization circuit (105) operates for PR-equalization of the reproduced signal that is subjected to an A/D conversion by an A/D converter (103) and shaped by a waveform shaping circuit (104). An ideal-waveform generation circuit (110) generates an ideal waveform that corresponds to the reproduced signal that is binarized by a Viterbi-decoding circuit (108). A mark-length/space-length calculation circuit (112) calculates the actual mark length/space length relative to the mark length/space length to be formed, based on the equalization error that arises when the ideal waveform assumes a central reference level as calculated by an equalization-error calculation circuit (111) and the intervals of polarity inversions of binarized data detected by a 0-cross detection circuit (109). A system controller (114) adjusts the edge shift quantity of the recording waveform when forming a mark based on the calculated mark length/space length.
摘要翻译：自适应均衡电路（105）对通过A / D转换器（103）进行A / D转换的再生信号的PR均衡进行操作，并由波形整形电路（104）整形。理想波形生成电路（110）产生与由维特比解码电路（108）二值化的再现信号对应的理想波形。标记长度/空间长度计算电路（112）基于当理想波形呈现中心参考电平时出现的均衡误差来计算相对于要形成的标记长度/空格长度的实际标记长度/空格长度通过均衡误差计算电路（111）计算，以及由0交叉检测电路（109）检测的二值化数据的极性反转的间隔。系统控制器（114）根据所计算的标记长度/间隔长度，在形成标记时，调整记录波形的边沿位移量。

58. 发明申请

US20090298264A1 METHOD OF CUTTING ADHESIVE FILM ON A SINGULATED WAFER BACKSIDE 审中-公开
标题翻译：将胶粘片切割成背面叠合的方法
公开(公告)号：US20090298264A1
公开(公告)日：2009-12-03
申请号：US12534406
申请日：2009-08-03
申请人： Kazuhisa Arai , Masaru Nakamura
发明人： Kazuhisa Arai , Masaru Nakamura
IPC分类号： H01L21/304
CPC分类号： H01L21/6835 , B23K26/40 , B23K26/50 , B23K26/53 , B23K2103/50 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/00 , H01L2924/3512
摘要： On the back surface of the chip of which a front surface is formed with an electronic circuit, an adhesive film of a shape and dimensions corresponding to at least the back surface of the chip is adhered to obtain the semiconductor chip with the entire back surface covered with the adhesive film. Such a semiconductor chip is obtained by forming a division groove in the front surface of a semiconductor wafer to be divided into plural chips, grinding a back surface of the wafer until the division groove appears to divide the wafer into plural chips, adhering the adhesive film and a dicing tape on the entire back surface of the wafer, and stretching the dicing tape to cut the adhesive film along the division groove.
摘要翻译：在其表面形成有电子电路的芯片的背面上，粘附至少与芯片的背面对应的形状和尺寸的粘合剂膜，以获得整个背面覆盖的半导体芯片与粘合膜。这样的半导体芯片通过在半导体晶片的前表面形成分割槽而形成分割槽，从而分割成多个芯片，研磨晶片的背面，直到划分凹槽出现将晶片分成多个芯片，以及在晶片的整个后表面上的切割胶带，并且拉伸切割带以沿着分割槽切割粘合剂膜。

59. 发明申请

US20090176575A1 GAME SERVER SYSTEM, GAME ELEMENT PROVIDING METHOD, GAME DEVICE, AND PROGRAM PRODUCT 审中-公开
标题翻译：游戏服务器系统，游戏元素提供方法，游戏设备和程序产品
公开(公告)号：US20090176575A1
公开(公告)日：2009-07-09
申请号：US10592710
申请日：2005-03-01
申请人： Yukizumi Terao , Masaru Nakamura , Ryuta Tamura , Kenji Kobayashi , Yukihiro Sato , Atsushi Kitagawa , Masato Miyazaki , Katsutoshi Yoshida , Sachiko Seino
发明人： Yukizumi Terao , Masaru Nakamura , Ryuta Tamura , Kenji Kobayashi , Yukihiro Sato , Atsushi Kitagawa , Masato Miyazaki , Katsutoshi Yoshida , Sachiko Seino
IPC分类号： A63F9/24
CPC分类号： A63F13/352 , A63F13/10 , A63F13/12 , A63F13/332 , A63F13/335 , A63F13/71 , A63F13/79 , A63F13/95 , A63F2300/204 , A63F2300/206 , A63F2300/308 , A63F2300/406 , A63F2300/407 , A63F2300/513 , A63F2300/532 , A63F2300/554 , A63F2300/5546 , A63F2300/6018 , A63F2300/636 , A63F2300/8047
摘要： There are stored in a database stored in a host server (12) of a server system (10), a portable phone terminal ID, a player ID, a card ID, and individual information in association with one another. The card ID is identical to a card ID stored in a card (28) carried by a player. A course data set contained in the individual information specifies an order and names of music pieces to be played by a game device (18) capable of communicating with the game server system (10). A player uses a portable information terminal (26) to execute an application to specify a card ID and generate a course data set, the generated course data set is registered in the database together with a portable telephone terminal ID of the portable information terminal (26), as individual information corresponding to the card ID. When a player inserts his/her own card (28) in a game device (18), the game device (18) transmits to the game device (18) a course data set corresponding to the card ID by accessing host server (12).
摘要翻译：存储在存储在服务器系统（10）的主机服务器（12），便携式电话终端ID，玩家ID，卡ID以及彼此关联的个人信息的数据库中。卡ID与存储在玩家携带的卡（28）中的卡片ID相同。包含在个人信息中的课程数据集指定能够与游戏服务器系统（10）通信的游戏装置（18）播放的乐曲的顺序和名称。玩家使用便携式信息终端（26）执行应用程序来指定卡片ID并生成课程数据集，所生成的课程数据集与便携式信息终端（26）的便携式电话终端ID一起登记在数据库中），作为对应于卡ID的个人信息。当玩家将自己的卡片（28）插入游戏装置（18）时，游戏装置（18）通过访问主机服务器（12）向游戏装置（18）发送对应于卡片ID的课程数据集，。

60. 发明授权

US07545542B2 Image forming apparatus 失效
标题翻译：图像形成装置
公开(公告)号：US07545542B2
公开(公告)日：2009-06-09
申请号：US10937284
申请日：2004-09-10
申请人： Kohji Oshikiri , Masaru Nakamura , Toshiaki Watanabe , Haruo Shida
发明人： Kohji Oshikiri , Masaru Nakamura , Toshiaki Watanabe , Haruo Shida
IPC分类号： G03G15/01 , B41J2/385
CPC分类号： G06K15/00 , H04L12/18 , H04N1/0096 , H04N1/32502 , H04N1/32512 , H04N1/32518 , H04N1/32529 , H04N1/32534 , H04N2201/0094
摘要： In an image forming apparatus in which an input module, an output module, a process module, and a memory have a plurality of ports and are connected by a packet switch having independent paths for data transmission, a path controlling part determines a process path based on data information from the input module and data transmission ability of paths within the image forming apparatus, and conducts a selection control to select a data transmission path in response to data transmission delay time for each process path and a data type of data to be transmitted.
摘要翻译：在其中输入模块，输出模块，处理模块和存储器具有多个端口并且通过具有用于数据传输的独立路径的分组交换机连接的图像形成装置中，路径控制部件基于来自输入模块的数据信息和图像形成装置内的路径的数据传输能力，并且进行选择控制以响应于每个处理路径的数据传输延迟时间和要发送的数据的数据类型来选择数据传输路径。

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