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51. 发明申请

US20060109366A1 Compact lens turret assembly 审中-公开
标题翻译：紧凑型镜头转塔组件
公开(公告)号：US20060109366A1
公开(公告)日：2006-05-25
申请号：US11265727
申请日：2005-11-02
申请人： Giles Humpston , Kenneth Honer , David Tuckerman
发明人： Giles Humpston , Kenneth Honer , David Tuckerman
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , G02B7/02 , H01L27/14625 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2924/0002 , H04N5/2253 , H04N5/2254 , H04N5/2257 , Y10T29/49117 , H01L2924/00
摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.
摘要翻译：电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。光学单元（50）包括一个或多个光学元件，例如透镜（58）。光学单元具有接合特征（64），其接合传感器单元上的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。

52. 发明授权

US07026744B2 Remote control and power system 失效
标题翻译：遥控和电力系统
公开(公告)号：US07026744B2
公开(公告)日：2006-04-11
申请号：US10276374
申请日：2001-05-10
申请人： Giles Humpston , Anthony Patrick Needham , Anthony John Salloway
发明人： Giles Humpston , Anthony Patrick Needham , Anthony John Salloway
IPC分类号： H01L41/107
CPC分类号： H04B10/807 , G08C23/06
摘要： A remote device such as a control value (4) is powered and controlled by optical energy, supplied by an intensity-modulated light source (8) and optical fiber (10). After conversion into electrical form, the light is detected at (12) and applied to a piezoelectric transformer (14). The output of the transformer powers and control an actuator (16) of the control value.
摘要翻译：诸如控制值（4）的远程设备由强度调制光源（8）和光纤（10）提供的光能供电和控制。转换成电形式后，在（12）处检测到光并施加到压电变压器（14）。变压器的输出为控制值的执行器（16）供电并控制。

53. 发明申请

US20050139984A1 Package element and packaged chip having severable electrically conductive ties 审中-公开
标题翻译：封装元件和封装芯片具有可分离的导电连接
公开(公告)号：US20050139984A1
公开(公告)日：2005-06-30
申请号：US11016034
申请日：2004-12-17
申请人： David Tuckerman , Richard Crisp , Belgacem Haba , Giles Humpston , Jae Park
发明人： David Tuckerman , Richard Crisp , Belgacem Haba , Giles Humpston , Jae Park
IPC分类号： H01L21/00 , H01L21/50 , H01L23/52 , H01L23/60 , H03H9/02 , H03H9/10
CPC分类号： H03H9/1092 , H01L23/60 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H03H9/02921 , H01L2924/00
摘要： According to one aspect of the invention, a capped chip is provided which includes a chip having a front surface, a back surface opposite the front surface and a plurality of bond pads exposed at at least one of the front and back surfaces. A cap is joined to the chip, the cap overlying one of the front and back surfaces of the chip. The cap includes a plurality of contacts which are conductively interconnected to the bond pads, and one or more temporary ties which conductively connect two or more of the contacts. The temporary ties are severable after the contacts are conductively interconnected to the bond pads.
摘要翻译：根据本发明的一个方面，提供了一种封盖芯片，其包括具有前表面，与前表面相对的后表面的芯片和暴露在前表面和后表面中的至少一个上的多个接合焊盘。盖子连接到芯片，盖子覆盖芯片的前表面和后表面之一。盖包括导电地互连到接合焊盘的多个触点，以及一个或多个导电地连接两个或更多个触点的临时连接。在触点与接合垫导电互连之后，临时接头是可分离的。

54. 发明申请

US20050095835A1 Structure and method of making capped chips having vertical interconnects 审中-公开
标题翻译：制造具有垂直互连的封盖芯片的结构和方法
公开(公告)号：US20050095835A1
公开(公告)日：2005-05-05
申请号：US10949674
申请日：2004-09-24
申请人： Giles Humpston , David Tuckerman , Bruce McWilliams , Belgacem Haba , Craig Mitchell
发明人： Giles Humpston , David Tuckerman , Bruce McWilliams , Belgacem Haba , Craig Mitchell
IPC分类号： H01L21/60 , H01L23/04 , H01L23/10 , H01L23/485 , H01L27/146 , H03H3/007 , H03H3/08 , H03H9/10 , H01L21/48
CPC分类号： H01L23/3114 , B81B2207/095 , B81C1/00293 , B81C1/00301 , B81C2203/0118 , B81C2203/0145 , B81C2203/019 , H01L21/76898 , H01L23/04 , H01L24/11 , H01L24/13 , H01L24/48 , H01L27/14618 , H01L27/14627 , H01L27/14636 , H01L33/62 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/11 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/1401 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/4824 , H01L2224/48247 , H01L2224/484 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/16151 , H01L2924/16195 , H01L2924/16235 , H01L2924/3011 , H01L2924/3025 , H03H3/007 , H03H9/0547 , H03H9/0585 , H03H9/059 , H03H9/1057 , H03H9/1064 , H03H9/1071 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The electrical interconnects may be solid, so as to form seals extending across the through holes. In some cases, stud bumps extend from the bond pads, forming parts of the electrical interconnects. In some cases, a fusible conductive medium forms a part of the electrical interconnects.
摘要翻译：提供了覆盖芯片和形成封盖芯片的方法，其中电互连通过至少部分地通过盖的多个通孔从芯片的焊盘延伸的导电元件制成。电互连可以是固体的，以便形成延伸穿过通孔的密封件。在一些情况下，螺柱凸起从接合焊盘延伸，形成电互连的部分。在一些情况下，可熔导电介质形成电互连的一部分。

55. 发明申请

US20050067681A1 Package having integral lens and wafer-scale fabrication method therefor 审中-公开
标题翻译：具有整体透镜和晶片级制造方法的封装
公开(公告)号：US20050067681A1
公开(公告)日：2005-03-31
申请号：US10928839
申请日：2004-08-27
申请人： Catherine De Villeneuve , Giles Humpston , David Tuckerman
发明人： Catherine De Villeneuve , Giles Humpston , David Tuckerman
IPC分类号： H01L23/04 , H01L23/10 , H01L31/0203 , H01L31/0232 , H01L31/18 , H03H9/10
CPC分类号： H01L27/14618 , H01L23/04 , H01L23/10 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L31/18 , H01L33/58 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2924/00014 , H01S5/02248 , H01S5/02292 , H01S5/4025 , H04N5/2257 , H01L2224/05599
摘要： A covered chip having an optical element integrated in the cover is provided which includes a chip having a front surface, an optically active circuit area, and bond pads disposed at the front surface. The chip is covered by an at least partially optically translucent or transparent unitary cover that is mounted to the front surface of the chip, and has at least one optical element integrated in the unitary cover. The cover is further aligned with the optically active circuit area and vertically spaced from the optically active circuit area.
摘要翻译：提供了具有集成在盖中的光学元件的覆盖芯片，其包括具有前表面，光学有效电路区域和设置在前表面的接合焊盘的芯片。该芯片由至少部分光学的半透明或透明的整体盖子覆盖，该盖子安装到芯片的前表面，并且具有集成在整体盖中的至少一个光学元件。盖子还与光学有源电路区域对准，并且与光学有源电路区域垂直地间隔开。

56. 发明授权

US5073210A Method of making electrical conductors 失效
标题翻译：制造电导体的方法
公开(公告)号：US5073210A
公开(公告)日：1991-12-17
申请号：US527050
申请日：1990-05-22
申请人： Giles Humpston , David M. Jacobson
发明人： Giles Humpston , David M. Jacobson
IPC分类号： C22C5/02 , C22F1/14 , H01L21/48 , H01L23/48
CPC分类号： H01L21/4821 , C22C5/02 , C22F1/14 , H01L21/4885 , H01L23/48 , H01L2924/0002
摘要： A method of making material in the form of a fine wire or thin strip or sheet suitable for use as electrical conductors comprises: forming an ingot substantially consisting of an alloy of gold and one or more of the metals titanium, lutetium, zirconium, scandium and hafnium, the amount of the or each of said one or more of the metals in the alloy lying in the range from substantially 0.1 at % to an upper limit comprising the atomic percentage of that metal corresponding to the maximum solubility of that metal in the alloy; solution heat treating the ingot and then quenching the ingot from the solution heat treatment temperature; mechanically working the ingot to have a maximum dimension in at least one direction of not greater than 250 .mu.m; and heat treating the resulting material at a temperature below its solvus temperature from an ambient atmosphere containing oxygen and/or nitrogen in the ambient atmosphere. The conductors exhibit high tensile strength and resistance to elongation under load and retention of such properties after being heated to elevated temperatures for extended periods of time, such as to render them particularly suitable for use as bond-wires in integrated circuit packages.

57. 发明授权

US5031822A Methods of joining components 失效
标题翻译：连接组件的方法
公开(公告)号：US5031822A
公开(公告)日：1991-07-16
申请号：US472220
申请日：1990-01-30
申请人： Giles Humpston , David M. Jacobson , Brian P. Cameron
发明人： Giles Humpston , David M. Jacobson , Brian P. Cameron
IPC分类号： B23K35/00 , H01L21/60 , H01L23/492
CPC分类号： H01L24/83 , B23K35/005 , H01L23/4924 , H01L24/29 , H01L2224/29109 , H01L2224/29111 , H01L2224/8319 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01063 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014
摘要： A method of brazing a silicon component to a molybdenum and/or tungsten component wherein prior to brazing the surface of the molybdenum and/or tungsten component is first provided with a thin gold coating and then a coating of palladium, platinum or rhodium. This allows satisfactory brazing to be effected using conventional aluminum-based brazes at temperatures below 650.degree. C.

58. 发明授权

US10147750B2 Optical imaging apparatus and methods of making the same 有权
公开(公告)号：US10147750B2
公开(公告)日：2018-12-04
申请号：US13145830
申请日：2010-02-03
申请人： Moshe Kriman , William Hudson Welch , Giles Humpston , Osher Avsian , Felix Hazanovich , Ekaterina Axelrod
发明人： Moshe Kriman , William Hudson Welch , Giles Humpston , Osher Avsian , Felix Hazanovich , Ekaterina Axelrod
IPC分类号： H04N5/232 , H01L27/146 , H04N5/225
摘要： The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.

59. 发明授权

US09029759B2 Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same 有权
标题翻译：紧凑型相机模块，具有降低Z高度和便于镜头对准的特征，以及制造相同的方法
公开(公告)号：US09029759B2
公开(公告)日：2015-05-12
申请号：US13445857
申请日：2012-04-12
申请人： Harpuneet Singh , Giles Humpston , Ellis Chau , Eddie Azuma , Peter Pietrangelo , Ocie Ward
发明人： Harpuneet Singh , Giles Humpston , Ellis Chau , Eddie Azuma , Peter Pietrangelo , Ocie Ward
IPC分类号： H01J5/02 , H01L31/0232 , H01L27/146 , H04N5/225
CPC分类号： H01L31/02327 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
摘要翻译：通过在保护性覆盖晶片上形成复制的透镜形状并且沉积材料以形成分别设置在其中的复制透镜形状的多个空腔而形成微型相机模块部件。载体晶片在被切割之前被耦合到保护盖晶片。中间晶片连接到保护盖晶片，并移除载体晶片。将图像传感器晶片连接到保护盖晶片，并移除中间晶片。

60. 发明授权

US08624342B2 Rear-face illuminated solid state image sensors 有权
标题翻译：背面照明固态图像传感器
公开(公告)号：US08624342B2
公开(公告)日：2014-01-07
申请号：US12940326
申请日：2010-11-05
申请人： Giles Humpston , Moshe Kriman
发明人： Giles Humpston , Moshe Kriman
IPC分类号： H01L31/02
CPC分类号： H01L27/14636 , H01L21/76898 , H01L27/14618 , H01L27/14632 , H01L27/14638 , H01L27/1464 , H01L27/14687 , H01L27/14806 , H01L2224/13024
摘要： A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
摘要翻译：微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。半导体元件还包括在连接到光检测器的前表面处的导电接触。导电接触包括薄区域和比薄区域更厚的较厚区域。导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

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