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51. 发明专利

JP2014110428A Conditioning and wafer retaining ring, and manufacturing method thereof 有权
标题翻译：调节和保温保持环及其制造方法
公开(公告)号：JP2014110428A
公开(公告)日：2014-06-12
申请号：JP2013246089
申请日：2013-11-28
申请人： Ehwa Diamond Ind Co Ltd , イファダイヤモンドインダストリアルカンパニー,リミテッド
发明人： LEE SEH KWANG , LEE JOO HAN , PARK KWAN HEE
IPC分类号： H01L21/304 , B24B37/00 , B24B37/32 , B24B53/00 , B24B53/12
CPC分类号： B24B53/017 , B24B37/32
摘要： PROBLEM TO BE SOLVED: To provide a wafer retaining ring for use in a chemical mechanical polishing (CMP) process as a part of a semiconductor device manufacturing process.SOLUTION: A wafer retaining ring 100 for preventing a wafer from slipping during polishing in a CMP process has a structure including many cutting tips 110 comprising many protrusions, the cutting tips formed to be spaced at a predetermined distance on the surface of the ring to function as a conditioner.
摘要翻译：要解决的问题：提供用作化学机械抛光（CMP）工艺中的晶片保持环作为半导体器件制造工艺的一部分。解决方案：用于防止晶片在CMP抛光期间滑倒的晶片保持环100 工艺具有包括许多切割尖端110的结构，其包括许多突起，切割尖端形成为在环的表面上以预定距离隔开以用作调理器。

52. 发明专利

JP2004358648A Saw blade 审中-公开
公开(公告)号：JP2004358648A
公开(公告)日：2004-12-24
申请号：JP2003282859
申请日：2003-07-30
申请人： Ehwa Diamond Ind Co Ltd , 二和ダイヤモンド工業株式会社
发明人： LEE SEUNG WEON , PARK YONG HYUN , CHOI JONG SUK , JUNG EUI SEOK
IPC分类号： B23D61/02 , B23D61/04 , B24D3/00 , B24D5/06 , B24D5/12 , B28D1/04 , B28D1/12
CPC分类号： B28D1/121
摘要： PROBLEM TO BE SOLVED: To provide a saw blade which is so constituted that an impact force is not transmitted directly to a shank during grinding operation, mechanical strength is increased, amplification of vibration generated during operation is suppressed, and accumulation of fatigue is prevented.
SOLUTION: The saw blade 100 is provided with a disc shank 101, a connection hole 109 which is formed at the central section of the shank and connected to the axis of an electrically driven tool, a wave formation section 110 which is formed repeatedly and protrudably at a predetermined distance on the front face and the rear face of the shank by being extended in the radial direction of the shank disposed over the radial directional range disposed at a predetermined radial position from the center of the connection hole, and a processed chip 104 which contains highly hard particles for polishing a material to be polished and is mounted on the peripheral edge of the shank.
COPYRIGHT: (C)2005,JPO&NCIPI

53. 发明专利

JP2001252873A TOOL FOR POLISHING DRESSING, AND METHOD OF MANUFACTURING THE SAME 失效
公开(公告)号：JP2001252873A
公开(公告)日：2001-09-18
申请号：JP2001035606
申请日：2001-02-13
申请人： EHWA DIAMOND IND CO LTD
发明人： AN SEISHU
IPC分类号： B23K35/30 , B24B53/12 , B24D3/00 , B24D3/06 , B24D18/00 , C23C24/08 , C23C24/10 , C23C28/00 , C23C30/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a tool for polishing dressing to be used for mechanically and chemically flattening and polishing the surface of a precise and flat workpiece requiring fine polishing such as a semiconductor wafer, and a method of manufacturing the same. SOLUTION: After sintering and fusing abrasive grains to be fixed using nickel-based brazing metal, macro- and micro-scratches are reduced by filling or covering by spreading-coating unsintered parts which are likely to be cracked or removed from a sintered surface with recrystallized parts for reducing a defective rate of polished products, and improving service life of polishing.

54. 发明专利

JP3779110B2 Grinding machine for grinding wheel 有权
公开(公告)号：JP3779110B2
公开(公告)日：2006-05-24
申请号：JP35420199
申请日：1999-12-14
申请人：二和ダイヤモンド工業株式会社Ehwa Diamond Ind. Co., Ltd
发明人：チャンヒュンリー
IPC分类号： B24B55/06 , B24B5/00 , B24B55/10 , B24D5/00 , B24D7/06
CPC分类号： B24B55/102 , B24D7/06

55. 发明专利

JP2002239823A CORE DRILL 审中-公开
公开(公告)号：JP2002239823A
公开(公告)日：2002-08-28
申请号：JP2001190848
申请日：2001-06-25
申请人： EHWA DIAMOND IND CO LTD
发明人： HONG JAE HYUN , LEE CHANG HYUN , KIM SEE HYUNG
IPC分类号： B23B51/04 , B28D1/04 , B28D1/14 , E21B10/48
摘要： PROBLEM TO BE SOLVED: To provide a core drill to improve initial drilling workability by facilitating positioning by reducing frictional resistance at the time of positioning a segment chip on a surface of a drilling material, to improve a cooling property by reducing frictional resistance with the drilling material on which a core body is cut and formed by facilitating discharge of cutting powder cut from the segment chip or sludge to a spiral groove formed on the core body and to improve a cutting property. SOLUTION: The core drill constituted of the cylindrical core body having a specified diameter and length and a plural number of segment chips attached with constant intervals on a lower part of the core body and to cut the cutting material constitutes its characteristic feature of making a cutting thickness surface of the segment chip of a tapered acute thickness part to decrease frictional resistance with the cutting material.

56. 发明专利

JP2002178265A SUPER-ABRASIVE GRINDING WHEEL COMPOSITION FOR POLISHING CATHODE-RAY TUBE PANEL FACE, SUPER-ABRASIVE TOOL USING IT AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2002178265A
公开(公告)日：2002-06-25
申请号：JP2001296270
申请日：2001-09-27
申请人： SAMSUNG CORNING CO LTD , EHWA DIAMOND IND CO LTD
发明人： SUNG-GUK CHOE , HYUN-MYONG CHO , YONG-MO GANG , LEE KENSHIN , SAI CHOSHU , ZEN SHOHAKU , LEE KANHAKU , KIM KYUNSHUN , KO SANKAI , TEI KAKUSAI
IPC分类号： B24D3/00 , B24B13/015 , B24D3/02 , B24D3/06 , B24D3/10 , C09K3/14
摘要： PROBLEM TO BE SOLVED: To provide a super abrasive grinding wheel composition for polishing cathode-ray tube panel face without using slurry, not making scratches and not causing a loading phenomenon, a super abrasive tool having structure in which a sintered grinding wheel for polishing is not easily broken away by using it and its manufacturing method. SOLUTION: This grinding wheel composition for polishing cathode-ray tube panel face contains a super-abrasive particulate mixture mixing diamond and cubic boron nitride in a volumetric ratio of 8.5:1.5-9.5:0.5 and a binder. Additionally, the super abrasive tool 100 has the structure in which the polishing grinding wheel 110 sintered from this polishing grinding wheel composition is projected cylindrically toward its fixed member 120, and the manufacturing method of the super abrasive tool 100 constitutes its characteristic feature of carrying out hot press molding by putting the previously manufactured fixed member 120 in a die and thereafter introducing the super abrasive composition on it.

57. 发明公开

EP4043170A1 STONE CUTTING DEVICE 审中-公开
公开(公告)号：EP4043170A1
公开(公告)日：2022-08-17
申请号：EP22164194.7
申请日：2014-06-10
申请人： Ehwa Diamond Ind. Co. Ltd.
发明人： RHEE, Dae-Yeon , KIM, Nam-Kwang , KIM, Doo-Hoe , PARK, Hee-Dong
IPC分类号： B28D1/06 , B27B3/38 , B27B3/34
摘要： A stone cutting device (110) is disclosed. A stone cutting device (110) is provided to cut a material to be cut by swinging multiple cutting tools (120) by a predetermined angle. Each cutting tool (120) comprises a blade (122) extending in the longitudinal direction of the material to be cut and at least one cutting tip (140) provided on an end of the blade to protrude in the width direction, the cutting tip reciprocating by means of swing movements, thereby cutting the material to be cut. The cutting device (110) comprises a frame unit (130) provided to couple the multiple cutting tools (120), to cause the cutting tools to reciprocate, and to separately adjust tension of respective cutting tools. The frame unit (130) comprises an actuator (134) for applying tension such that a load of 8-27 tons acts on the cutting tools (120).

58. 发明公开

EP2377661A4 WORKPIECE FOR FRAME GANG SAW, METHOD FOR CUTTING THE WORKPIECE, AND PRODUCT CUT BY THE METHOD 有权
标题翻译：工作了往复锯，方法用于切割部分和程序切片产品基础
公开(公告)号：EP2377661A4
公开(公告)日：2017-03-08
申请号：EP09835279
申请日：2009-12-23
申请人： EHWA DIAMOND IND CO LTD
发明人： PARK HEE-DONG , KIM NAM-KWANG
IPC分类号： B28D1/06
CPC分类号： B28D1/06 , Y10T428/2457
摘要： There is provided a method or cutting or drilling a brittle workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.

59. 发明公开

EP3009245A4 STONE CUTTING DEVICE 有权
标题翻译：石材切割机
公开(公告)号：EP3009245A4
公开(公告)日：2016-06-01
申请号：EP14810155
申请日：2014-06-10
申请人： EHWA DIAMOND IND CO LTD
发明人： RHEE DAE-YEON , KIM NAM-KWANG , KIM DOO-HOE , PARK HEE-DONG
IPC分类号： B28D1/06 , B27B3/38
CPC分类号： B28D1/068 , B23D51/125 , B27B3/38 , B28D1/06

60. 发明公开

EP3009245A1 STONE CUTTING DEVICE 有权
标题翻译： STEINSCHNEIDEVORRICHTUNG
公开(公告)号：EP3009245A1
公开(公告)日：2016-04-20
申请号：EP14810155.3
申请日：2014-06-10
申请人： Ehwa Diamond Ind. Co. Ltd.
发明人： RHEE, Dae-Yeon , KIM, Nam-Kwang , KIM, Doo-Hoe , PARK, Hee-Dong
IPC分类号： B28D1/06
CPC分类号： B28D1/068 , B23D51/125 , B27B3/38 , B28D1/06
摘要： A stone cutting device is disclosed. A stone cutting device according to an aspect of the present invention is provided to cut a material to be cut by swinging multiple cutting tools by a predetermined angle. Each cutting tool comprises a blade extending in the longitudinal direction of the material to be cut and at least one cutting tip provided on an end of the blade to protrude in the width direction, the cutting tip reciprocating by means of swing movements, thereby cutting the material to be cut. The cutting device comprises a frame unit provided to couple the multiple cutting tools, to cause the cutting tools to reciprocate, and to separately adjust tension of respective cutting tools. The frame unit comprises an actuator for applying tension such that a load of 8-27 tons acts on the cutting tools.
摘要翻译：公开了一种石材切割装置。根据本发明的一个方面的石材切割装置被设置成通过使多个切割工具摆动预定角度来切割待切割的材料。每个切割工具包括沿待切割材料的纵向方向延伸的刀片和设置在刀片的端部上的至少一个切割尖端，以在宽度方向上突出，切割刀片通过摆动运动而往复运动，从而切割要切割的材料切割装置包括设置成联接多个切割工具的框架单元，以使切割工具往复运动，并且分别调节各个切割工具的张力。框架单元包括用于施加张力的致动器，使得8-27吨的载荷作用在切割工具上。

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