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51. 发明申请

US20120298502A1 ELECTRO CHEMICAL DEPOSITION AND REPLENISHMENT APPARATUS 有权
标题翻译：电化学沉积和补充装置
公开(公告)号：US20120298502A1
公开(公告)日：2012-11-29
申请号：US13445217
申请日：2012-04-12
申请人： Demetrius Papapanayiotou , Arthur Keigler , David Guarnaccia , Jonathan Hander , Johannes Chiu
发明人： Demetrius Papapanayiotou , Arthur Keigler , David Guarnaccia , Jonathan Hander , Johannes Chiu
IPC分类号： C25B15/08
CPC分类号： C25D21/22 , C25D17/001 , C25D17/002 , C25D17/06 , C25D21/10
摘要： A process electrolyte replenishment module adapted to replenish ions in a process electrolyte in a substrate electrochemical deposition apparatus having a first anode and a first cathode, the replenishment module having a second anode. A process electrolyte recirculation compartment is disposed in the frame configured so that the process electrolyte is recirculating between the replenishment module and the deposition apparatus. An anode compartment is coupled to the process electrolyte recirculation compartment having the second anode, that is a soluble anode, for immersion in a secondary anolyte, and having a first ion exchange membrane being a cationic member separating the secondary anolyte from the process electrolyte. A cathode compartment is provided in the frame coupled to the process electrolyte recirculation compartment having a second cathode for immersion in a secondary catholyte, and having a second ion exchange membrane being a monovalent selective membrane separating the secondary catholyte from the process electrolyte.
摘要翻译：一种适用于在具有第一阳极和第一阴极的基板电化学沉积设备中补充处理电解质中的离子的过程电解质补充模块，所述补充模块具有第二阳极。处理电解质再循环隔室设置在框架中，其被构造成使得处理电解质在补充模块和沉积设备之间循环。阳极室耦合到具有第二阳极（即可溶性阳极）的工艺电解质再循环室，用于浸渍在次级阳极液中，并且具有第一离子交换膜是将次级阳极液与工艺电解质分离的阳离子构件。阴极室设置在耦合到处理电解质再循环隔间的框架中，该隔室具有用于浸入次级阴极电解液中的第二阴极，并且具有第二离子交换膜是将次级阴极电解液与工艺电解质分开的一价选择膜。

52. 发明申请

US20120152752A1 SEED LAYER DEPOSITION IN MICROSCALE FEATURES 审中-公开
标题翻译：微粒特征中的种子层沉积
公开(公告)号：US20120152752A1
公开(公告)日：2012-06-21
申请号：US12971744
申请日：2010-12-17
申请人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
发明人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
IPC分类号： C25D5/00 , C25D5/48 , C25D5/02
CPC分类号： C25D5/02 , C25D5/10 , C25D5/50 , H01L24/11 , H01L2224/11462 , H01L2224/11502 , H01L2224/11849 , H01L2224/11901 , H01L2924/01322 , H01L2924/14 , H01L2924/00 , H01L2224/1146
摘要： A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver alloy layer onto the substantially pure tin layer.
摘要翻译：提供了一种在沉积工件上形成金属特征的方法。该方法包括在工件上提供用于焊接电子器件的凸块下金属层，将基本上纯的锡层直接沉积到凸块下金属层上，并将锡银合金层沉积到基本上纯的锡层上。

53. 发明申请

US20120103799A1 METHOD AND APPARATUS FOR FLUID PROCESSING A WORKPIECE 有权
标题翻译：流体加工工艺的方法和装置
公开(公告)号：US20120103799A1
公开(公告)日：2012-05-03
申请号：US13275158
申请日：2011-10-17
申请人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
发明人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
IPC分类号： C25D17/00
CPC分类号： C25D17/001 , C25D5/003 , C25D7/123 , C25D17/005 , C25D17/06 , C25D21/10 , C25D21/12 , H01L21/67023 , H01L21/67126
摘要： A workpiece holder for fluid processing a workpiece including a transportable frame, a flexible member connected to the frame and defining at least one retaining feature, and a ring comprising at least one engagement feature engageable with the at least one retaining feature of the flexible member, wherein the flexible member is flexed to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.
摘要翻译：一种用于流体处理工件的工件保持器，包括可运输框架，连接到框架并限定至少一个保持特征的柔性构件，以及包括可与柔性构件的至少一个保持结构接合的至少一个接合特征的环，其中所述柔性构件弯曲以向所述至少一个接合特征提供力，以使所述环形成与所述工件的流体入口的阻挡。

54. 发明申请

US20110114623A1 Apparatus for thermal processing with micro-environment 失效
标题翻译：微环境热处理设备
公开(公告)号：US20110114623A1
公开(公告)日：2011-05-19
申请号：US12590852
申请日：2009-11-13
申请人： Daniel Goodman , Arthur Keigler , David G. Guarnaccia , Matthew R. Jeffers
发明人： Daniel Goodman , Arthur Keigler , David G. Guarnaccia , Matthew R. Jeffers
IPC分类号： H01L21/477
CPC分类号： H01L21/6719 , H01L21/67109
摘要： A substrate thermal processing system. The system has at least one substrate holding module having a housing configured for holding an isolated environment therein. A substrate heater is located in the housing and has a substrate heating surface. A substrate cooler is located in the housing and having a substrate cooling surface. A gas feed opening into the housing and feeding inert or reducing gas into the housing when the substrate is heated by the heating surface. A gas restrictor is within the housing restricting the fed gas between the substrate heating surface and a surrounding atmospheric region substantially surrounding the substrate heating surface in the housing and forming an aperture through which the fed gas communicates with the atmospheric region.
摘要翻译：基板热处理系统。该系统具有至少一个基板保持模块，该模块具有用于在其中保持隔离环境的壳体。衬底加热器位于壳体中并且具有衬底加热表面。衬底冷却器位于壳体中并且具有衬底冷却表面。当基板被加热表面加热时，气体进入开口并进入惰性气体或还原气体进入壳体。气体限制器在壳体内部，限制基板加热表面和基本上围绕壳体中的基板加热表面的周围大气区域之间的进料气体，并形成进料气体与大气区域连通的孔。

55. 发明申请

US20110024964A1 SUBSTRATE PROCESSING PALLET WITH COOLING 审中-公开
标题翻译：带冷却的基板加工托盘
公开(公告)号：US20110024964A1
公开(公告)日：2011-02-03
申请号：US12901173
申请日：2010-10-08
申请人： Daniel Goodman , Arthur Keigler , Stephen Golovato , David Felsenthal
发明人： Daniel Goodman , Arthur Keigler , Stephen Golovato , David Felsenthal
IPC分类号： B23Q3/00
CPC分类号： H01L21/67103 , H01L21/67109 , H01L21/67703 , H01L21/6831
摘要： In one exemplary embodiment, a substrate processing pallet is provided. The substrate processing pallet includes a base member, and an interface pad attachable to the base member. The interface pad has substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate. The substrate processing pallet also having a surface of the base member having features for aligning a substrate on the interface pad.
摘要翻译：在一个示例性实施例中，提供了基板处理托盘。基板处理托盘包括基部构件和可附接到基座构件的接口垫。界面垫具有与基底构件基本上相同的热膨胀系数，并且适于促进衬底的冷却。衬底处理托盘也具有基底构件的表面，其具有用于对准接口衬垫上的衬底的特征。

56. 发明申请

US20080220622A1 Substrate processing pallet with cooling 有权
标题翻译：基板加工托盘带冷却
公开(公告)号：US20080220622A1
公开(公告)日：2008-09-11
申请号：US11716538
申请日：2007-03-09
申请人： Daniel Goodman , Arthur Keigler , Stephen Golovato , David Felsenthal
发明人： Daniel Goodman , Arthur Keigler , Stephen Golovato , David Felsenthal
IPC分类号： H01L21/00 , B05C11/00
CPC分类号： H01L21/67103 , H01L21/67109 , H01L21/67703 , H01L21/6831
摘要： A substrate processing pallet can cool a substrate. A substrate processing pallet can include a base member; an interface pad attachable to the base member, the interface pad having substantially the same coefficient of thermal expansion as the base member and adapted to facilitate cooling of the substrate; and a surface of the base member having features for aligning a substrate on the interface pad. A substrate processing pallet can also include a base member; an interface pad attachable to the base member; an electrostatic chuck for gripping the substrate during processing; an energy storage system for storing energy to sustain the electrostatic chuck at sufficient charge to sustain grip the substrate during processing; and a conduit for transporting gas to a backside of the substrate to facilitate cooling of the substrate.
摘要翻译：基板处理托盘可以冷却基板。基板处理托盘可以包括基部构件; 接口垫，其可附接到所述基底构件，所述界面垫具有与所述基底构件基本上相同的热膨胀系数并且适于促进所述衬底的冷却; 并且所述基底构件的表面具有用于使所述界面垫上的衬底对准的特征。基板处理托盘还可以包括基部构件; 可附接到基座构件的接口垫; 用于在加工期间夹持基板的静电卡盘; 能量存储系统，用于存储能量以在足够的电荷下维持静电卡盘，以在加工期间保持夹持基板; 以及用于将气体输送到衬底的背面以便于冷却衬底的导管。

57. 发明申请

US20060110536A1 Balancing pressure to improve a fluid seal 失效
标题翻译：平衡压力以改善流体密封
公开(公告)号：US20060110536A1
公开(公告)日：2006-05-25
申请号：US11265543
申请日：2005-11-02
申请人： Arthur Keigler , Qunwei Wu , Zhenqiu Liu , John Harrell
发明人： Arthur Keigler , Qunwei Wu , Zhenqiu Liu , John Harrell
IPC分类号： B05D5/00 , B05D1/18 , B05D3/00
CPC分类号： H01L21/67126 , C25D5/003 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/67023
摘要： A method and apparatus for fluid sealing a workpiece retained by a workpiece holder are described. A pressure differential can be formed across a fluid seal to counteract fluid attempting to penetrate the fluid seal, which can contaminate the underside of the workpiece. The apparatus can include a ring forming a barrier to fluid entry with the workpiece and a source providing pressure to form the pressure differential. The pressure or the pressure differential can counteract hydroscopic fluid pressure or hydrostatic fluid pressure that is acting to force fluid through the barrier between the ring and the workpiece.
摘要翻译：描述了用于流体密封由工件保持器保持的工件的方法和装置。可以跨流体密封件形成压力差，以抵消试图渗透流体密封件的流体，这可能污染工件的下侧。该装置可以包括形成与流体进入工件的阻挡物的环和提供压力以形成压力差的源。压力或压力差可抵消吸入液体压力或静压流体压力，其作用是迫使流体通过环和工件之间的阻挡层。

58. 发明申请

US20050283993A1 Method and apparatus for fluid processing and drying a workpiece 审中-公开
标题翻译：用于流体处理和干燥工件的方法和装置
公开(公告)号：US20050283993A1
公开(公告)日：2005-12-29
申请号：US11155008
申请日：2005-06-16
申请人： Qunwei Wu , Arthur Keigler , Zhenqiu Liu , John Harrell , Steve Bowler
发明人： Qunwei Wu , Arthur Keigler , Zhenqiu Liu , John Harrell , Steve Bowler
IPC分类号： B08B3/00 , B08B3/10 , B08B3/12 , B08B11/02 , F26B3/00 , F26B21/06 , H01L21/00 , H01L21/02
CPC分类号： H01L21/67034 , B08B3/102 , B08B11/02 , H01L21/02068 , H01L21/67028
摘要： A method and apparatus for fluid processing a workpiece are described. A gas can be used to agitate a fluid to improve cleaning and/or rinsing of a workpiece surface. The gas can reduce surface tension of the fluid to promote improved contact of the fluid with a surface of the workpiece. The surface of the workpiece can be dried by flowing gas along a portion of the workpiece surface during or after draining of the fluid.
摘要翻译：描述了用于流体处理工件的方法和装置。可以使用气体来搅拌流体以改善工件表面的清洁和/或漂洗。气体可以降低流体的表面张力，以促进流体与工件表面的接触。在流体排放期间或之后，工件的表面可以通过沿工件表面的一部分流动气体来干燥。

59. 发明申请

US20050110291A1 Ultra-thin wafer handling system 有权
标题翻译：超薄晶圆处理系统
公开(公告)号：US20050110291A1
公开(公告)日：2005-05-26
申请号：US10618091
申请日：2003-07-11
申请人： Martin Klein , Arthur Keigler , David Felsenthal
发明人： Martin Klein , Arthur Keigler , David Felsenthal
IPC分类号： A47J45/00 , H01L21/683
CPC分类号： H01L21/6838
摘要： An improved Bernoulli end effector for holding, handling, and transporting ultra-thin substrates includes edge guides to aid in the positioning of the substrate and may include friction pads that impede motion of the substrate lifted by the end effector. The Bernoulli end effector may be incorporated into an apparatus and method for supinating a substrate so that both surfaces of the substrate can be processed. In addition, the Bernoulli end effector may be used to place ultra-thin substrates on and retrieve substrates from a substrate handling structure that includes weights that prevent the substrates from bowing or flexing during processing and includes guides that prevent the ultra-thin substrates from moving or translating on the surface of the substrate handling structure.
摘要翻译：用于保持，处理和运输超薄基板的改进的伯努利端部执行器包括边缘引导件以帮助基板的定位，并且可以包括妨碍由末端执行器提升的基板的运动的摩擦垫。伯努利末端执行器可以结合到用于使衬底延伸的装置和方法中，使得可以处理衬底的两个表面。此外，伯努利末端执行器可用于将超薄基板放置在基板处理结构上并从基板处理结构回收基板，该基板处理结构包括在加工期间防止基板弯曲或弯曲的重量，并且包括防止超薄基板移动的引导件或在基板处理结构的表面上平移。

60. 发明授权

US06540899B2 Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces 有权
标题翻译：流体密封的方法和装置，同时电接触湿法加工的工件
公开(公告)号：US06540899B2
公开(公告)日：2003-04-01
申请号：US09827084
申请日：2001-04-05
申请人： Arthur Keigler
发明人： Arthur Keigler
IPC分类号： C25D502
CPC分类号： H01L21/67126 , C25D17/001 , C25D17/004 , C25D17/06
摘要： A method and apparatus for fluid sealing the underside of a workpiece, such as a semiconductor wafer and the like, during wet-processing such as electrodeposition and the like, employing an elastomeric encased ring of flexible fingers against which the periphery of the workpiece underside is forced to deflect the fingers downwardly and engage a peripheral sealing bead against the underside periphery of the workpiece; and where electrical contact with the workpiece is desired, resiliently engaging electrical contact tips protruding through peripheral openings in the elastomeric covering within the sealing ring, with the underside periphery of the workpiece.
摘要翻译：一种用于在诸如电沉积等的湿加工期间流体密封工件（例如半导体晶片等）的下侧的方法和装置，其使用柔性指状物的弹性体包裹环，工件底面的周边与所述柔性指状物迫使手指向下偏转，并使外周密封珠抵靠工件的下侧周边; 并且其中需要与工件电接触，弹性接合的电接触尖端突起穿过密封环内的弹性体覆盖件中的周边开口与工件的下侧周边。

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