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    • 51. 发明授权
    • 포토리지스트를 이용한 반도체 소자 특성 개선 방법
    • 使用光刻胶的半导体的特性改进方法
    • KR1019950005476B1
    • 1995-05-24
    • KR1019920016714
    • 1992-09-15
    • (주)대우
    • 이재월
    • H01L29/78
    • The damage of a poly gate layer and a gate oxide layer of MOS device is prevented by suppressing transmission of high energy, high density ion through poly-gate layer by using residual photo-resist. The method includes the steps of; (A) forming a poly-gate layer by a first photomasking process; (B) etching a poly-silicon layer (4) and UV processing the residual photo-resist; (C) spraying photoresist (6) to form a source and drain region; (D) masking a second photo-mask; (E) baking the device about 30 minutes with temperature of 130 degree; (F) injecting ion on a source and a drain region; and (G) removing a residual photo-resist (6).
    • 通过使用残留光刻胶抑制通过多晶硅层的高能量,高密度离子的透射来防止MOS器件的多晶硅栅极层和栅极氧化物层的损伤。 该方法包括以下步骤: (A)通过第一光掩模工艺形成多晶硅层; (B)蚀刻多晶硅层(4)和UV处理残留光刻胶; (C)喷涂光致抗蚀剂(6)以形成源区和漏区; (D)掩蔽第二光掩模; (E)在130度的温度下烘烤约30分钟; (F)在源极和漏极区域注入离子; 和(G)去除残留的光致抗蚀剂(6)。