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41. 发明申请

US20020097138A1 Method for making a resistor using resistive foil 失效
标题翻译：使用电阻箔制造电阻的方法
公开(公告)号：US20020097138A1
公开(公告)日：2002-07-25
申请号：US10079085
申请日：2002-02-20
发明人： George V. Gerber , Anthony E. Troianello , Haim Goldberger
IPC分类号： H01C001/012
CPC分类号： F42B3/198 , F42B3/124 , Y10T29/49082 , Y10T29/49083 , Y10T29/49098 , Y10T29/49099
摘要： A fast heat rise resistor comprising a substrate, a foil bridge on the surface of the substrate, the foil bridge having an elevated portion and a contact portion, the elevated portion above the substrate, the contact portion in contact with the substrate, a conductive layer attached to the contact portion of said foil bridge. The activation energy and/or response time is reduced as the foil bridge is suspended over the substrate. Another aspect of the invention include a method of manufacturing the foil bridge and application to autoignition vehicle airbags.
摘要翻译：一种快速加热电阻器，包括衬底，在衬底表面上的箔桥，箔桥具有升高部分和接触部分，衬底上方的升高部分，与衬底接触的接触部分，导电层附接到所述箔桥的接触部分。当箔桥悬挂在衬底上时，激活能和/或响应时间减小。本发明的另一方面包括制造箔桥的方法和应用于自动对准车辆安全气囊。

42. 发明申请

US20020047773A1 Resistor component with multiple layers of resistive material 审中-公开
标题翻译：具有多层电阻材料的电阻元件
公开(公告)号：US20020047773A1
公开(公告)日：2002-04-25
申请号：US09921064
申请日：2001-08-02
申请人： GA-TEK Inc. (dba Gould Electronics Inc.)
发明人： Jiangtao Wang , Michael A. Centanni , Sidney J. Clouser
IPC分类号： H01C001/012
CPC分类号： H05K1/167 , H01C7/18 , H01C17/07 , H05K2201/0317 , H05K2201/0355 , H05K2201/0391 , H05K2203/0361 , H05K2203/0723 , Y10S29/016 , Y10T29/49082 , Y10T29/49099 , Y10T29/49101 , Y10T29/49156
摘要： A resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 null and 70 null is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 null and 500 null is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 null and 500 null is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
摘要翻译：一种电阻箔，由具有第一面和第二面的铜层构成。在铜层的第一面上设置有厚度为介于-5埃之间的粘结层金属层。第一层厚度为100埃至500埃的第一电阻器金属设置在该涂层金属层上，并且第一层第二层第二电阻金属层，其厚度介于100埃至500埃之间。第一电阻金属层。第一电阻金属具有与第二电阻金属不同的电阻。

43. 发明申请

US20020014949A1 Chip component 审中-公开
标题翻译：芯片组件
公开(公告)号：US20020014949A1
公开(公告)日：2002-02-07
申请号：US09956132
申请日：2001-09-20
申请人： TAIYO YUDEN CO., LTD
发明人： Hirotoshi Tanaka , Masataka Kohara , Hideya Maki
IPC分类号： H01C001/012
CPC分类号： H05K3/303 , H01C1/02 , H01C17/006 , H05K1/0269 , H05K2201/09954 , H05K2201/10636 , H05K2203/161 , H05K2203/168 , Y02P70/611 , Y02P70/613
摘要： A chip component such as chip resistor, which is capable of being mounted obversely or reversely to a substrate or the like. Since the color of the armor is adjusted so as to be green identical with that of a ceramics chip, the lightness distribution of the component front face is similar with that of the component back face. Therefore, there is no case that chip component mounted obversely and chip component mounted reversely are identified as different components in a testing step of detecting a positional deviation or unloaded component by a color or monochromatic image processing (digital image processing), even if the component is mounted reversely to a substrate or the like.
摘要翻译：诸如片状电阻器的芯片组件，其能够与衬底等相反地或相反地安装。由于将装甲的颜色调整为与陶瓷芯片相同的绿色，所以部件正面的亮度分布与部件背面的亮度分布相同。因此，在通过彩色或单色图像处理（数字图像处理）检测位置偏离或卸载成分的测试步骤中，即使该组件反向安装在基板等上。

44. 发明申请

US20040257194A1 Methods for making microwave circuits 失效
标题翻译：制作微波电路的方法
公开(公告)号：US20040257194A1
公开(公告)日：2004-12-23
申请号：US10600143
申请日：2003-06-19
发明人： John F. Casey , Lewis R. Dove , Ling Liu , James R. Drehle , R. Frederick Rau JR. , Rosemary O. Johnson
IPC分类号： H01L021/338 , H01P001/00 , H01C001/012
CPC分类号： H05K1/0221 , H01C17/065 , H01L2924/0002 , H01P11/003 , H05K1/0237 , H05K1/053 , H05K1/092 , H05K1/167 , H05K3/06 , H05K3/4664 , H05K2201/09809 , H05K2201/09981 , H05K2203/1476 , H01L2924/00
摘要： Disclosed are methods for making microwave circuits using thickfilm components, the thickfilm components including: a first, multi-layer thickfilm dielectric deposited on a ground plane; a thickfilm conductor deposited on the first thickfilm dielectric; a second, multi-layer thickfilm dielectric deposited on the first dielectric and conductor to encapsulate the conductor; a thickfilm ground shield layer deposited over the first and second dielectrics; and thickfilm resistors deposited in close proximity to the first and second dielectrics.
摘要翻译：公开了使用厚膜组件制造微波电路的方法，所述厚膜组件包括：沉积在接地平面上的第一多层厚膜电介质; 沉积在第一厚膜电介质上的厚膜导体; 沉积在第一电介质和导体上以封装导体的第二多层厚膜电介质; 沉积在第一和第二电介质上的厚膜接地屏蔽层; 和沉积在第一和第二电介质附近的厚膜电阻器。

45. 发明申请

US20040201447A1 Thin-film resistor device 审中-公开
标题翻译：薄膜电阻器件
公开(公告)号：US20040201447A1
公开(公告)日：2004-10-14
申请号：US10413798
申请日：2003-04-14
发明人： Marvin Glenn Wong
IPC分类号： H01C001/012
CPC分类号： H01C1/016 , H01C7/006 , H01H2061/006
摘要： A thin-film resistor device is disclosed. In one embodiment, the device comprises a substrate supporting first and second contacts. A compliant material is deposited on the substrate. A thin-film resistor is deposited on the compliant material and coupled between the first and second contacts.
摘要翻译：公开了一种薄膜电阻器件。在一个实施例中，该装置包括支撑第一和第二触点的基板。柔性材料沉积在基底上。薄膜电阻器沉积在顺应性材料上并且耦合在第一和第二触点之间。

46. 发明申请

US20040196137A1 Fuel tank resistor card having improved corrosion resistance 失效
公开(公告)号：US20040196137A1
公开(公告)日：2004-10-07
申请号：US10406356
申请日：2003-04-03
发明人： Ronald Dedert , Robert Heimann , Craig Hoffman , Kevin Kurtz
IPC分类号： H01C001/012
CPC分类号： H05K3/246 , G01F23/36 , H01C10/305 , H01C17/06526 , H05K1/092 , H05K1/167 , H05K2201/0347
摘要： A resistor card for a fuel level sensor has improved resistance to corrosion and wear. The resistor card has a substrate with a resistive layer and a conductive layer. A nickel layer covers the conductive layer. A nickel-gold alloy layer covers the nickel layer. The nickel-gold alloy layer protects the conductive layer from sulfur corrosion and improves wear resistance.

47. 发明申请

US20040130433A1 Arrangement of several resistors jointly positioned in a well of a semiconductor device, and a semiconductor device including at least one such arrangement 有权
标题翻译：共同位于半导体器件的阱中的多个电阻器的布置以及包括至少一个这样的布置的半导体器件
公开(公告)号：US20040130433A1
公开(公告)日：2004-07-08
申请号：US10663354
申请日：2003-09-16
发明人： Joachim Schnabel , Andre Schaefer , Xaver Obergrussberger , Sebastian Mosler
IPC分类号： H01C001/012
CPC分类号： H01L27/105 , H01L27/0207 , H01L27/0802 , H01L27/10897 , H01L27/118
摘要： An arrangement of several resistors jointly positioned in one and the same well of a semiconductor device, as well as to a semiconductor device including at least one such arrangement of resistors, wherein the resistors, when viewed in a longitudinal direction of the resistors, are displaced in relation to one another.
摘要翻译：共同位于半导体器件的同一个阱中的多个电阻器的布置以及包括至少一个这样的电阻器布置的半导体器件，其中当沿电阻器的纵向方向观察时，电阻器被移位相互之间。

48. 发明申请

US20040108937A1 Ball grid array resistor network 有权
标题翻译：球栅阵列电阻网络
公开(公告)号：US20040108937A1
公开(公告)日：2004-06-10
申请号：US10309704
申请日：2002-12-04
发明人： Craig Ernsberger , Jason B. Langhorn , Yinggang Tu
IPC分类号： H01C001/012
CPC分类号： H05K1/167 , H01C1/028 , H01C17/06 , H05K3/184 , H05K3/28 , H05K3/3436 , H05K2201/0355 , H05K2203/0361 , H05K2203/041 , H05K2203/1453
摘要： A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.
摘要翻译：球栅阵列电阻网络具有由有机材料形成的平面基板。基板优选为印刷电路板。基板具有顶表面和底表面。球垫位于底面。低温电阻位于底面，与球垫相连。除了球垫之外，焊接掩模位于第一表面之上。导电球附着在球垫上。回流焊膏将导电球连接到球垫。示出了本发明的几个实施例。

49. 发明申请

US20040075528A1 Printed circuit heaters with ultrathin low resistivity materials 审中-公开
标题翻译：具有超薄低电阻率材料的印刷电路加热器
公开(公告)号：US20040075528A1
公开(公告)日：2004-04-22
申请号：US10278184
申请日：2002-10-22
申请人： OAK-MITSUI, Inc.
发明人： Derek C. Carbin , Jeffrey T. Gray , John A. Andresakis
IPC分类号： H01C001/012
CPC分类号： H01C17/003 , H01C17/2412 , H01C17/2416 , H05B3/262 , H05B2203/003 , H05K1/167 , H05K3/025 , H05K2201/0355 , H05K2203/0361
摘要： A printed circuit heater and process for forming a printed circuit heater are described. The printed circuit heater is formed by depositing a thin metal layer onto a surface of a metal carrier foil, forming a composite. The thin metal layer has a thickness of about 0.1 nullm to about 2 nullm. The composite is attached to a substrate such that the thin metal layer is in contact with the substrate, forming a laminate. At least a portion of the metal carrier foil is selectively removed from portions of the laminate. The thin metal layer is patterned and etched such that the etched thin metal layer has a heat density of from about 0.5 watts/in2 to about 20 watts/in2 at working voltages from about 3 volts to about 600 volts. The remaining portions of the metal carrier foil, if any, can be selectively removed to thereby provide low resistance busses within the circuit, thus eliminating the need for multiple external connections, and to facilitate evenness of heat distribution.
摘要翻译：描述印刷电路加热器和用于形成印刷电路加热器的工艺。印刷电路加热器通过在金属载体箔的表面上沉积薄金属层而形成复合材料。薄金属层的厚度为约0.1μm至约2μm。复合材料附着在基材上，使得薄金属层与基材接触，形成叠层。金属载体箔的至少一部分从层压体的部分选择性地去除。薄金属层被图案化和蚀刻，使得蚀刻的薄金属层在约3伏至约600伏的工作电压下具有约0.5瓦特/平方英寸至约20瓦特/平方英寸的热密度。金属载体箔的剩余部分（如果有的话）可以被选择性地去除，从而在电路内提供低电阻总线，从而消除对多个外部连接的需要，并且便于热分布的均匀性。

50. 发明申请

US20040004535A1 Low temperature coefficient resistor 失效
标题翻译：低温系数电阻
公开(公告)号：US20040004535A1
公开(公告)日：2004-01-08
申请号：US10615039
申请日：2003-07-08
申请人： LSI Logic Corporation
发明人： Robindranath Banerjee
IPC分类号： H01C001/012
CPC分类号： H01L28/20 , H01C7/006 , H01C7/008 , H01L27/0802
摘要： A resistor having a desired temperature coefficient of resistance and a total electrical resistance. A first resistor segment has a first temperature coefficient of resistance and a first electrical resistance. A second resistor segment has a second temperature coefficient of resistance and a second electrical resistance. The first resistor segment is electrically connected in series with the second resistor segment, and the total electrical resistance equals a sum of the first electrical resistance and the second electrical resistance. The desired temperature coefficient of resistance is determined at least in part by the first temperature coefficient of resistance and the first electrical resistance of the first resistor and the second temperature coefficient of resistance and the second electrical resistance of the second resistor. Thus, in this manner the desired temperature coefficient of resistance of the resistor can be tailored to a desired value by selecting the resistance and temperature coefficients of resistance of the first and second resistor segments that are connected in series. The desired temperature coefficient of resistance can selectively be a positive value, a negative value, or a zero value, depending upon the selection of the material and the resulting resistance values and temperature coefficient of resistance values for the first and second resistor segments.
摘要翻译：具有期望的电阻温度系数和总电阻的电阻器。第一电阻器段具有第一温度系数电阻和第一电阻。第二电阻器段具有第二电阻温度系数和第二电阻。第一电阻器段与第二电阻器段串联电连接，总电阻等于第一电阻和第二电阻之和。期望的电阻温度系数至少部分地由第一电阻温度系数和第一电阻器的第一电阻以及第二电阻温度系数和第二电阻器的第二电阻确定。因此，以这种方式，通过选择串联连接的第一和第二电阻器段的电阻和电阻温度系数，可以将电阻器的期望温度系数调整到期望值。取决于材料的选择和所得到的电阻值和第一和第二电阻器段的电阻值的温度系数，所需的电阻温度系数可以选择性地为正值，负值或零值。

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