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41. 发明授权

US08063313B2 Printed circuit board and semiconductor package including the same 失效
标题翻译：印刷电路板和包括其的半导体封装
公开(公告)号：US08063313B2
公开(公告)日：2011-11-22
申请号：US12263614
申请日：2008-11-03
申请人： Yun-Jin Oh , Chang-Hoon Han , Kwang-Ryul Lee , Hyoung-Suk Kim
发明人： Yun-Jin Oh , Chang-Hoon Han , Kwang-Ryul Lee , Hyoung-Suk Kim
IPC分类号： H05K1/16 , H05K3/30
CPC分类号： H05K3/3452 , H01L24/73 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06562 , H01L2924/15311 , H05K2201/09772 , H05K2201/09881 , H05K2203/0191 , H05K2203/049 , H05K2203/0577 , H05K2203/058 , H05K2203/0582 , H05K2203/0585 , H05K2203/1476 , Y10T29/4913 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A printed circuit board (PCB) and a semiconductor package that are configured to prevent delamination and voids. In one example embodiment, the semiconductor package includes a PCB having a base substrate on which conductive patterns are formed and which includes an interior region having a die paddle for receiving a semiconductor chip and an exterior region disposed outside the interior region. The PCB also includes a first solder resist formed on a portion of the base substrate corresponding to the interior region and a second solder resist formed on a portion of the base substrate corresponding to the exterior region. The second solder resist may also have a greater surface roughness than the surface roughness of the first solder resist.
摘要翻译：配置为防止分层和空隙的印刷电路板（PCB）和半导体封装。在一个示例性实施例中，半导体封装包括具有其上形成有导电图案的基底基板的PCB，其包括具有用于接收半导体芯片的管芯焊盘和设置在内部区域外部的外部区域的内部区域。 PCB还包括形成在对应于内部区域的基底基板的一部分上的第一阻焊剂和形成在对应于外部区域的基底基板的一部分上的第二阻焊剂。第二阻焊剂也可以具有比第一阻焊剂的表面粗糙度更大的表面粗糙度。

42. 发明申请

US20090179335A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME 失效
标题翻译：印刷电路板和半导体封装，包括它们
公开(公告)号：US20090179335A1
公开(公告)日：2009-07-16
申请号：US12263614
申请日：2008-11-03
申请人： Yun-Jin OH , Chang-Hoon HAN , Kwang-Ryul LEE , Hyoung-Suk KIM
发明人： Yun-Jin OH , Chang-Hoon HAN , Kwang-Ryul LEE , Hyoung-Suk KIM
IPC分类号： H01L23/485 , H05K1/18
CPC分类号： H05K3/3452 , H01L24/73 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06562 , H01L2924/15311 , H05K2201/09772 , H05K2201/09881 , H05K2203/0191 , H05K2203/049 , H05K2203/0577 , H05K2203/058 , H05K2203/0582 , H05K2203/0585 , H05K2203/1476 , Y10T29/4913 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A printed circuit board (PCB) and a semiconductor package that are configured to prevent delamination and voids. In one example embodiment, the semiconductor package includes a PCB having a base substrate on which conductive patterns are formed and which includes an interior region having a die paddle for receiving a semiconductor chip and an exterior region disposed outside the interior region. The PCB also includes a first solder resist formed on a portion of the base substrate corresponding to the interior region and a second solder resist formed on a portion of the base substrate corresponding to the exterior region. The second solder resist may also have a greater surface roughness than the surface roughness of the first solder resist.
摘要翻译：配置为防止分层和空隙的印刷电路板（PCB）和半导体封装。在一个示例性实施例中，半导体封装包括具有其上形成有导电图案的基底基板的PCB，其包括具有用于接收半导体芯片的管芯焊盘和设置在内部区域外部的外部区域的内部区域。 PCB还包括形成在对应于内部区域的基底基板的一部分上的第一阻焊剂和形成在对应于外部区域的基底基板的一部分上的第二阻焊剂。第二阻焊剂也可以具有比第一阻焊剂的表面粗糙度更大的表面粗糙度。

43. 发明申请

US20080316724A1 UNIVERSAL SOLDER PAD 有权
标题翻译：通用焊盘
公开(公告)号：US20080316724A1
公开(公告)日：2008-12-25
申请号：US12049493
申请日：2008-03-17
申请人： Chun-Line Huang
发明人： Chun-Line Huang
IPC分类号： H05K7/00
CPC分类号： H05K1/111 , H05K1/0295 , H05K3/3442 , H05K3/3452 , H05K2201/09381 , H05K2201/099 , H05K2201/09954 , H05K2201/10636 , H05K2203/058 , Y02P70/611 , Y02P70/613
摘要： A universal solder pad is used with a plurality of SMD components having different sizes. Each SMD component includes a first conductive part and a second conductive part. The universal solder pad includes a first pad unit and a second pad unit. The first and second pad units are electrically connected to the first and second conductive parts of the SMD component, respectively. Each of the first and second pad units includes a main portion and a first extension portion. The first extension portion is extended from a first sidewall of the main portion and includes a first border, a second border and a third border. The second border and the third border of the first extension portion are parallel with each other for facilitating alignment of the first and second conductive parts of the SMD component with respect to the first pad unit and the second pad unit.
摘要翻译：通用焊盘与具有不同尺寸的多个SMD部件一起使用。每个SMD组件包括第一导电部分和第二导电部分。通用焊盘包括第一焊盘单元和第二焊盘单元。第一和第二焊盘单元分别电连接到SMD部件的第一和第二导电部分。第一和第二垫单元中的每一个包括主要部分和第一延伸部分。第一延伸部分从主要部分的第一侧壁延伸并且包括第一边界，第二边界和第三边界。第一延伸部分的第二边界和第三边界彼此平行，以便于SMD部件的第一和第二导电部分相对于第一焊盘单元和第二焊盘单元的对准。

44. 发明申请

US20070103632A1 Liquid crystal display panel module and flexible printed circuit board thereof 审中-公开
标题翻译：液晶显示面板模块及其柔性印刷电路板
公开(公告)号：US20070103632A1
公开(公告)日：2007-05-10
申请号：US11361629
申请日：2006-02-24
申请人： Hui-Chang Chen , Wen-Hung Lai , Chien-Liang Chen
发明人： Hui-Chang Chen , Wen-Hung Lai , Chien-Liang Chen
IPC分类号： G02F1/1345
CPC分类号： G02F1/13452 , H05K1/028 , H05K1/118 , H05K3/28 , H05K3/361 , H05K2201/0187 , H05K2203/058
摘要： A liquid crystal display panel module and a flexible printed circuit board thereof. The liquid crystal display panel module includes a substrate and the flexible printed circuit board connected with the substrate. The flexible printed circuit board includes a base, a lead, a passivation layer and an insulation layer. The lead is disposed on the base, and has a first end portion and a second end portion. The passivation layer covers the lead without covering the first end portion. The insulation layer is disposed at an interface between the passivation layer and the first end portion to cover part of the passivation layer and part of the first end portion.
摘要翻译：一种液晶显示面板模块及其柔性印刷电路板。液晶显示面板模块包括基板和与基板连接的柔性印刷电路板。柔性印刷电路板包括基底，引线，钝化层和绝缘层。引线设置在基座上，具有第一端部和第二端部。钝化层覆盖引线而不覆盖第一端部。绝缘层设置在钝化层和第一端部之间的界面处，以覆盖钝化层的一部分和第一端部的一部分。

45. 发明申请

US20070099123A1 METHOD OF FORMING SOLDER MASK AND WIRING BOARD WITH SOLDER MASK 有权
标题翻译：用焊膏掩模形成焊接掩模和接线板的方法
公开(公告)号：US20070099123A1
公开(公告)日：2007-05-03
申请号：US11307425
申请日：2006-02-07
申请人： Tzyy-Jang Tseng , Cheng-Po Yu
发明人： Tzyy-Jang Tseng , Cheng-Po Yu
IPC分类号： G03C5/00
CPC分类号： H05K3/28 , H05K3/3452 , H05K2203/013 , H05K2203/0557 , H05K2203/058 , H05K2203/1476
摘要： A method of forming solder mask, suitable for forming a solder mask on the surface of a wiring board, is provided. The surface of the wiring board includes a first region and a second region, and the surface of the wiring board has a wiring pattern thereon. The method includes forming a first sub solder mask in the first region on the surface of the wiring board by performing a screen-printing or a photolithographic process, and forming a second sub solder mask in the second region on the surface of the wiring board by performing an ink-jet printing process. The method not only improves the precision of the solder mask alignment on the wiring board and its reliability, but also increases the production rate and lowers the manufacturing cost.
摘要翻译：提供一种形成焊接掩模的方法，该方法适用于在布线板的表面上形成焊接掩模。布线板的表面包括第一区域和第二区域，并且布线板的表面上具有布线图案。该方法包括通过丝网印刷或光刻工艺在布线板的表面上的第一区域中形成第一子焊料掩模，并且在布线板的表面上的第二区域中形成第二副焊料掩模进行喷墨打印处理。该方法不仅提高了布线板上的焊盘对准的精度及其可靠性，而且提高了生产率，降低了制造成本。

46. 发明申请

US20070017090A1 Method of forming metal plate pattern and circuit board 审中-公开
标题翻译：形成金属板图案和电路板的方法
公开(公告)号：US20070017090A1
公开(公告)日：2007-01-25
申请号：US11486820
申请日：2006-07-13
申请人： Toyoaki Sakai , Katsuya Fukase
发明人： Toyoaki Sakai , Katsuya Fukase
IPC分类号： H01B13/00 , H05K3/00
CPC分类号： H05K3/064 , C23F1/02 , H01L2924/0002 , H05K3/06 , H05K3/062 , H05K3/202 , H05K2203/0369 , H05K2203/0508 , H05K2203/058 , H05K2203/0597 , H05K2203/1184 , H05K2203/1476 , H05K2203/1572 , Y10T29/49124 , H01L2924/00
摘要： A method of forming a high aspect ratio metal plate pattern and a circuit board by multi-stage etching with a metal mask is disclosed. A resist (12) is coated on one of two surfaces of a copper plate (10) and patterned to form a resist pattern. A tin plating layer (14) is formed using this resist pattern, and with this tin plating layer as a mask, the copper plate is selectively half etched. By coating, exposing and developing the positive resist (18), the side etched portion under the tin plating layer is protected by the positive resist. With the tin plating layer and the protective resist layer as a mask, the half etching is executed again. This process is repeated until the resist and the tin plating layer used as a mask are finally removed to produce a metal pattern (20).
摘要翻译：公开了一种通过金属掩模的多级蚀刻形成高纵横比金属板图案和电路板的方法。抗蚀剂（12）涂覆在铜板（10）的两个表面中的一个上并被图案化以形成抗蚀剂图案。使用该抗蚀剂图案形成锡镀层（14），以该镀锡层为掩模，选择性地对铜板进行半蚀刻。通过涂覆，曝光和显影正性抗蚀剂（18），镀锡层下面的侧蚀刻部分被正性抗蚀剂保护。以镀锡层和保护层为掩模，再次进行半蚀刻。重复该过程，直到最终除去用作掩模的抗蚀剂和锡镀层以产生金属图案（20）。

47. 发明申请

US20060008970A1 OPTIMIZED PLATING PROCESS FOR MULTILAYER PRINTED CIRCUIT BOARDS HAVING EDGE CONNECTORS 审中-公开
标题翻译：具有边缘连接器的多层印刷电路板优化镀层工艺
公开(公告)号：US20060008970A1
公开(公告)日：2006-01-12
申请号：US11160780
申请日：2005-07-08
申请人： Stefano Oggioni , Giorgio Viero
发明人： Stefano Oggioni , Giorgio Viero
IPC分类号： H01L21/8238
CPC分类号： H05K3/244 , H05K1/117 , H05K3/243 , H05K2201/0391 , H05K2203/054 , H05K2203/058 , H05K2203/072 , H05K2203/0723
摘要： A process for manufacturing printed wire boards with hard plated sliding contact tabs and soft plated wire bond pads. Sliding contact tabs are covered by a protective coating after being hard plated thus allowing the soft plating of wire bond pads without damaging the hard plated sliding contact tabs. In a preferred embodiment, the hard plating includes the step of electroplating nickel on the sliding contact tabs, followed by electroplating an alloy of gold and cobalt, using standard electroplating process. An electro-less soft plating process includes the steps of plating a nickel layer on the wire bond pads and then a gold layer after having “flash-etched” the copper seeding.
摘要翻译：一种制造具有硬镀滑动接触片和软电镀线接合垫的印刷线路板的方法。硬接触后，滑动接触片被保护层覆盖，从而允许电焊接焊盘的软电镀，而不会损坏硬镀滑动接触片。在优选实施例中，硬镀层包括在滑动接触片上电镀镍的步骤，然后使用标准电镀工艺电镀金和钴的合金。无电镀软工艺包括以下步骤：在铜接合焊盘上镀镍层，然后在“闪光蚀刻”铜接种之后镀金层。

48. 发明授权

US5464725A Method of manufacturing a printed wiring board 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US5464725A
公开(公告)日：1995-11-07
申请号：US959752
申请日：1992-10-13
申请人： Kiminori Ishido , Masahiro Yamaguchi
发明人： Kiminori Ishido , Masahiro Yamaguchi
IPC分类号： G03F7/00 , H05K3/06 , H05K3/28 , G03C5/00
CPC分类号： G03F7/0035 , H05K3/28 , H05K2201/09881 , H05K2203/058 , H05K2203/0582 , H05K2203/0759 , H05K3/061
摘要： After pads 2 for mounting parts are formed at desired positions on an insulating board 1 in a circuit forming process using etching resist 3, the etching resist 3 is left on the pads without peeling it off. A first photosolder resist 4 is then formed between the pads 2, exposed to light, and developing using a solvent able to separate the etching resist 3 as a developing liquid, following which the etching resist 3 is peeled off together with the not yet fully hardened first photosolder resist 4. After formation of the first photosolder resist 4, a second photosolder resist is formed on desired areas excluding the interspaces between the pads 2, exposed to light, and developed. Consequently, when a photosolder resist is formed between pads pitched at narrow intervals on a printed wiring board, attachment of the photosolder resist to the pads due to misalignment between the insulating board and a photo-mask can be avoided.
摘要翻译：在使用抗蚀剂3的电路形成工艺中，在绝缘板1上的期望位置处形成用于安装部件的焊盘2之后，将抗蚀剂3留在焊盘上而不剥离。然后将第一光固化剂抗蚀剂4形成在暴露于光的焊盘2之间，并使用能够分离作为显影液的抗蚀剂3的溶剂显影，随后将抗蚀剂3与尚未完全硬化第一光固化剂抗蚀剂4.在形成第一光致抗蚀剂4之后，在除了被曝光的衬垫2之间的间隙之外的所需区域上形成第二光固化抗蚀剂并显影。因此，当在印刷电路板上以窄间隔形成在衬垫之间形成光阻抗剂时，可以避免由于绝缘板和光掩模之间的不对准而将光敏抗蚀剂附着到焊盘。

49. 发明授权

US4411982A Method of making flexible printed circuits 失效
标题翻译：制造柔性印刷电路的方法
公开(公告)号：US4411982A
公开(公告)日：1983-10-25
申请号：US338907
申请日：1982-01-12
申请人： Chuji Shibuya , Satoshi Kaneda , Takashi Kanehisa , Masatoshi Kondo , Kenji Nogawa , Fumio Hasuike
发明人： Chuji Shibuya , Satoshi Kaneda , Takashi Kanehisa , Masatoshi Kondo , Kenji Nogawa , Fumio Hasuike
IPC分类号： H05K1/00 , H05K3/00 , H05K3/02 , H05K3/06 , H05K3/28 , H05K3/42 , G03C5/00
CPC分类号： H05K3/064 , H05K3/0097 , H05K3/02 , H05K1/0393 , H05K2201/09781 , H05K2201/2009 , H05K2203/058 , H05K2203/1394 , H05K2203/1545 , H05K3/0094 , H05K3/28 , H05K3/427 , Y10T29/49155
摘要： A disclosed method of continuous making flexible printed circuits for use in radio set or the like appliances, includes punching holes in a continuous copper-film clad insulating substrate, forming photopolymer films on the faces of the copper films exposing the photopolymer film to photochemical light of a predetermined pattern, developing the exposed photopolymer film, etching the copper film utilizing remaining parts of the photopolymer film as etching masks, removing the remaining photopolymer films 40 and printing solder-resist films on selected parts. The improvement is to provide and retain selected oblong parts of said conductor metal film disposed on and parallel to longitudinal direction of the continuous substrate by, for example, covering these parts by etching-resist films. The retained oblong parts of the metal film serve to prevent shrinkage of the substrate during the conduct of further manufacturing steps thereby assuring registration of the patterns of the printed circuits and the printed solder-resist films.
摘要翻译：公开的连续制造用于无线电设备或类似设备的柔性印刷电路的方法包括在连续的铜膜包覆绝缘基板中的冲孔，在将光聚合物膜暴露的铜膜的表面上形成光聚合物膜，曝光的光聚合物膜显影，利用剩余部分的光聚合物膜作为蚀刻掩模蚀刻铜膜，除去剩余的光聚合物膜40并在选定的部分上印刷阻焊膜。改进之处在于通过例如通过抗蚀剂膜覆盖这些部分来提供并保持设置在连续基板的纵向方向上且与其平行的所述导体金属膜的选定的长方形部分。金属膜的保留的长方形部分用于在进一步制造步骤期间防止基板的收缩，从而确保印刷电路图案和印刷的阻焊膜的配准。

50. 发明授权

US09516751B2 Wiring board and method for manufacturing same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US09516751B2
公开(公告)日：2016-12-06
申请号：US14417751
申请日：2013-05-17
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takahiro Hayashi , Makoto Nagai , Seiji Mori , Tomohiro Nishida , Makoto Wakazono , Tatsuya Ito
IPC分类号： H05K1/11 , G03F7/20 , G03F7/30 , H05K1/02 , G03F7/038 , H01L23/498 , H05K3/34 , H05K3/46
CPC分类号： H05K1/111 , G03F7/038 , G03F7/20 , G03F7/2024 , G03F7/30 , H01L23/49822 , H01L2224/16237 , H05K1/0298 , H05K3/3436 , H05K3/3452 , H05K3/4644 , H05K2201/09409 , H05K2201/09427 , H05K2201/09709 , H05K2201/09845 , H05K2201/099 , H05K2201/10674 , H05K2203/058 , H05K2203/0594 , H05K2203/1476
摘要： To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction. The solder resist layer 25 includes, within the opening portion 43, a side-surface covering portion 55 that covers the side surface of the connecting terminal portion 41 and a projecting wall portion 56 that is integrally formed with the side-surface covering portion 55 and disposed to project so as to intersect with the connection region 51.
摘要翻译：提供与半导体芯片的连接可靠性优异的布线板。在有机布线板10的基板主表面11侧形成有树脂绝缘层21,22和导体层24层叠的第一堆积层31.第一堆积层31中的最外层的导体层24包括多个用于倒装芯片安装半导体芯片的连接端子部分41。多个连接端子部分41通过阻焊层25的开口部分43露出。每个连接端子部分41包括用于半导体芯片的连接区域51和从连接区域51延伸的布线区域52 平面方向。阻焊层25在开口部43内具有覆盖连接端子部41的侧面的侧面覆盖部55和与侧面覆盖部55一体形成的突出壁部56，被设置为突出以与连接区域51相交。

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