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    • 43. 发明授权
    • Adaptive wireless sensor network and method of routing data in a wireless sensor network
    • 自适应无线传感器网络和在无线传感器网络中路由数据的方法
    • US08514760B2
    • 2013-08-20
    • US12767850
    • 2010-04-27
    • Amitava Mukherjee
    • Amitava Mukherjee
    • G08C17/00H04W4/00G01R31/08
    • H04L45/00H04L49/00H04W40/28Y02D30/20Y02D70/22
    • A method of routing data in a wireless sensor network, a program product and a wireless sensor network. The method, includes: (a) detecting a temporal event by a source sensor node of a wireless sensor network comprising a multiplicity of sensor nodes; (b) identifying multiple paths from the source sensor node to a sink of the wireless sensor network, the multiple paths consisting of sensor node to sensor node hops; and after (b), (c) using a processor of the source sensor node, optimizing a distribution of data packets to each path of the multiple paths by simultaneously reducing (i) power consumed by sensor nodes in each path of the multiple paths and (ii) a time to transmit the data packets from the source sensor node to the sink.
    • 一种在无线传感器网络,程序产品和无线传感器网络中路由数据的方法。 该方法包括:(a)由包括多个传感器节点的无线传感器网络的源传感器节点检测时间事件; (b)识别从源传感器节点到无线传感器网络的接收器的多个路径,所述多个路径由传感器节点到传感器节点跳数组成; 并且在(b)之后,(c)使用源传感器节点的处理器,通过同时减少(i)多个路径中的每个路径中的传感器节点消耗的功率来优化数据分组到多个路径的每个路径的分布,以及 (ii)将数据分组从源传感器节点传送到接收器的时间。
    • 48. 发明申请
    • Apparatus and methods for integrally packaging optoelectronic devices, IC chips and optical transmission lines
    • 用于整体封装光电器件,IC芯片和光传输线的装置和方法
    • US20050063634A1
    • 2005-03-24
    • US10669944
    • 2003-09-24
    • Guy CohenFuad DoanyJeannine Trewhella
    • Guy CohenFuad DoanyJeannine Trewhella
    • G02B6/00G02B6/12G02B6/36G02B6/42H04B10/00H04B10/12
    • B29D11/0075G02B6/42G02B6/4224G02B6/423G02B6/4249
    • Apparatus and methods for packaging optical communication devices include optical bench structures, such as silicon-optical benches (SiOB). An optical communications apparatus includes an optical bench comprising a substrate having an electrical turning via formed therein. An optoelectronic (OE) chip and integrated circuit (IC) chip are mounted on the optical bench and electrically connected using the electrical turning via. The electrical turning via extends in directions both perpendicular and transverse to a surface of the substrate such that the OE chip and IC chip can be mounted on perpendicular surfaces of the optical bench in close proximity and electrically connected using the electrical turning via. More specifically, the OE chip and IC chip are mounted on the optical bench such that a light-emitting or light-detecting surface of the OE chip is substantially perpendicular to a surface of the IC chip having contacts, and such that optical transmission lines that are mounted parallel to the substrate surface can be directly coupled to the OE chip.
    • 用于封装光通信设备的装置和方法包括光学台架结构,例如硅光学台(SiOB)。 一种光通信设备包括一个光学台,包括一个具有形成在其中的电转通路的基板。 光电(OE)芯片和集成电路(IC)芯片安装在光学平台上,并使用电动转向电路进行电气连接。 电动转向通孔在垂直于基板表面的横向方向上延伸,使得OE芯片和IC芯片可以安装在光学平台的垂直表面上,并且使用电动转向电路进行电连接。 更具体地,OE芯片和IC芯片安装在光学平台上,使得OE芯片的发光或光检测表面基本上垂直于具有触点的IC芯片的表面,并且使得光传输线 平行于衬底表面安装可以直接耦合到OE芯片。