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    • 41. 发明申请
    • WDM SYSTEM WITH EXTERNALLY MODULATED FILTERED LASER ARRAY
    • 具有外部调制滤波器激光阵列的WDM系统
    • WO2014055730A1
    • 2014-04-10
    • PCT/US2013/063213
    • 2013-10-03
    • APPLIED OPTOELECTRONICS, INC.
    • ZHENG, Jun,MURRY, Stefan,HWANG, Wen-Yen,
    • H04J14/02
    • H01S5/4062H01S5/4087H04J14/0254H04J14/0279H04J14/0282
    • A filtered laser array assembly generally includes an array of laser emitters coupled between external modulators and an arrayed waveguide grating (AWG). Each of the laser emitters emits light across a plurality of wavelengths including, for example, channel wavelengths in an optical communication system. The AWG filters the emitted light from each of the laser emitters at different channel wavelengths associated with each of the laser emitters. Lasing cavities are formed between each of the laser emitters and a back reflector coupled to an output of the AWG such that laser output from the laser emitters is provided at the respective channel wavelengths of the reflected, filtered light. The external modulators enable high speed modulation of the laser output. The modulated laser output may then be optically multiplexed to produce an aggregate optical signal including multiple channel wavelengths.
    • 滤波的激光阵列组件通常包括耦合在外部调制器和阵列波导光栅(AWG)之间的激光发射器的阵列。 每个激光发射器在多个波长中发射光,包括例如光通信系统中的信道波长。 AWG在与每个激光发射器相关联的不同通道波长处对来自每个激光发射器的发射光进行滤波。 在每个激光发射器和耦合到AWG的输出端的后反射器之间形成激光腔,使得来自激光发射器的激光输出被提供在被反射的滤光光的各个通道波长处。 外部调制器可实现激光输出的高速调制。 调制的激光输出然后可以被光学多路复用以产生包括多个信道波长的聚合光信号。
    • 42. 发明申请
    • MODULAR LASER PACKAGE SYSTEM
    • 模块激光包装系统
    • WO2008098050A2
    • 2008-08-14
    • PCT/US2008053177
    • 2008-02-06
    • APPLIED OPTOELECTRONICS INCMURRY STEFAN JMORBI ZULFIKARLIN KAI-SHENG
    • MURRY STEFAN JMORBI ZULFIKARLIN KAI-SHENG
    • G02B6/36
    • G02B6/4201G02B6/4245G02B6/4271G02B6/4279G02B6/428
    • A modular laser package system may be used to mount one type of laser package, such as a coaxial or TO (transistor outline) can laser package, to a circuit board, such as a transmitter board or a motherboard, designed to receive another type of laser package housing, such as a butterfly-type laser package housing. The modular laser package system may include a circuit board mounting platform, a laser housing mount to mount the laser package to the circuit board mounting platform, and a mounting base to facilitate mounting to the transmitter board or motherboard. The modular laser package system may also include a temperature control device, such as a thermo-electric cooler (TEC), and a temperature sensor, such as a thermistor, mounted to the laser housing mount to control and monitor the temperature of the laser package.
    • 模块化激光器封装系统可以用于将诸如同轴或TO(晶体管轮廓)罐激光器封装之类的一种类型的激光器封装安装到诸如发射器板或主板的电路板上,所述电路板被设计成接收另一类型的 激光封装外壳,如蝶型激光封装外壳。 模块化激光器封装系统可以包括电路板安装平台,将激光器封装件安装到电路板安装平台的激光器外壳安装件,以及便于安装到传输器板或主板的安装基座。 模块化激光器封装系统还可以包括温度控制装置,诸如热电冷却器(TEC),以及安装到激光器外壳安装件的温度传感器,诸如热敏电阻器,以控制和监测激光器封装件的温度 。
    • 45. 发明申请
    • METHOD FOR DETERMINING PHOTODIODE PERFORMANCE PARAMETERS
    • 用于测定光致变色性能参数的方法
    • WO2002059935A1
    • 2002-08-01
    • PCT/US2002/000212
    • 2002-01-04
    • APPLIED OPTOELECTRONICS, INC.
    • JOHNSON, Jeffery, L.
    • H01J40/14
    • G01R31/2635
    • One or more photodiode performance parameters for a photodiode (310) are determined by first determining four data points Iph1, Voc1, Iph2, and Voc2, where Iph1 is a first short-circuit current, and Voc1 is a first open-circuit voltage, for the photodiode (310) under a first illumination condition (Qbk), and Iph2 is a second short-circuit current and Voc2 is a second open-circuit voltage, for the photodiode (310) under a second illumination condition (Qbk + Qb2). Then, at least one photodiode performance parameter for the photodiode is determined as a function of said four data points.
    • 通过首先确定四个数据点Iph1,Voc1,Iph2和Voc2,确定光电二极管(310)的一个或多个光电二极管性能参数,其中Iph1是第一短路电流,Voc1是第一开路电压, 在第一照明条件(Qbk)下的光电二极管(310)和在第二照明条件(Qbk + Qb2)下的光电二极管(310)的Iph2是第二短路电流,Voc2是第二开路电压。 然后,确定光电二极管的至少一个光电二极管性能参数作为所述四个数据点的函数。
    • 47. 发明申请
    • AN OPTICAL COMPONENT ASSEMBLY WITH A VERTICAL MOUNTING STRUCTURE FOR MULTI-ANGLE LIGHT PATH ALIGNMENT AND AN OPTICAL SUBASSEMBLY USING THE SAME
    • 一种垂直安装结构用于多角度光路对准的光学元件组件以及一种使用相同光学分路器的光学元件组件
    • WO2018044993A1
    • 2018-03-08
    • PCT/US2017/049305
    • 2017-08-30
    • APPLIED OPTOELECTRONICS, INC.
    • LIN, Kai-ShengWANG, ChongLII, Justin
    • G02B6/42G02B6/293
    • In an embodiment, an optical component assembly is disclosed and is configured to be at least partially disposed within at least one first opening of an optical subassembly housing. The at least one optical component assembly comprising a base extending from a first end to a second end along a longitudinal axis, and a vertical mount disposed on the base and including a first surface that provides a mounting region to couple to an optical component, the first surface defining a vertical axis that extends substantially upright from the base and a horizontal axis that is angled relative to the longitudinal axis of the base at a first angle, the vertical mount further providing a channel that extends through the vertical mount, wherein the channel provides an optical pathway angled relative to the first surface at the first angle, the first angle being substantially between about 15 and 75 degrees.
    • 在一个实施例中,公开了一种光学部件组件并且被配置为至少部分地设置在光学子组件外壳的至少一个第一开口内。 所述至少一个光学部件组件包括沿着纵向轴线从第一端延伸到第二端的基部以及设置在所述基部上并且包括提供安装区域以耦合到光学部件的第一表面的垂直安装件,所述 第一表面,其限定垂直轴线,所述垂直轴线从所述基部基本直立地延伸;以及水平轴线,所述水平轴线相对于所述基部的所述纵向轴线以第一角度成角度,所述垂直安装件还提供延伸穿过所述垂直安装件的通道, 提供以第一角度相对于第一表面成角度的光学路径,第一角度基本上在大约15和75度之间。
    • 49. 发明申请
    • TECHNIQUES FOR REDUCING INGRESS OF FOREIGN MATTER INTO AN OPTICAL SUBASSEMBLY
    • 减少外来物质进入光学分集的技术
    • WO2017189536A1
    • 2017-11-02
    • PCT/US2017/029347
    • 2017-04-25
    • APPLIED OPTOELECTRONICS, INC.
    • HO, I-LungLIAO, Hao-HsiangLII, Justin
    • G02B6/42
    • G02B6/4244G02B6/29362G02B6/4214G02B6/4215G02B6/4239G02B6/4253G02B6/4263
    • Techniques are disclosed for filling gaps formed between a press-fit component and an optical subassembly housing to introduce a seal or barrier that can prevent or otherwise mitigate the ingress of contaminants. In an embodiment, a layer of sealant material is applied to one or more surfaces of an optical component prior to press-fitting the component into an optical subassembly housing. Alternatively, or in addition to applying sealant to one or more surfaces of an optical component, a layer of sealant material may be disposed on an interface formed between an outer surface of the optical subassembly housing and the optical component press-fit into the same. Techniques disclosed herein are particularly well suited for small form-factor optical subassemblies that include one or more optical components press-fit into openings of a subassembly housing during manufacturing.
    • 公开了用于填充在压配部件和光学子组件壳体之间形成的间隙的技术,以引入可以防止或以其他方式减轻污染物进入的密封或屏障。 在一个实施例中,在将部件压配到光学子组件壳体中之前,将一层密封剂材料施加到光学部件的一个或多个表面。 作为替代或者除了将密封剂施加到光学部件的一个或多个表面上之外,密封剂材料层可以设置在形成在光学子组件壳体的外表面和压配合到其中的光学部件之间的界面上。 本文公开的技术特别适合于包括在制造期间压配合到子组件外壳的开口中的一个或多个光学部件的小形状因子光学子组件。