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41. 发明申请

US20080165469A1 Multilayer chip capacitor 有权
标题翻译：多层片式电容器
公开(公告)号：US20080165469A1
公开(公告)日：2008-07-10
申请号：US12003884
申请日：2008-01-03
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228 , H01G4/005
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： A multilayer chip capacitor including: a capacitor body formed of a lamination of a plurality of dielectric layers and having a bottom surface that is a mounting area; a plurality of internal electrodes disposed to be opposite to each other, interposing a dielectric layer there between in the capacitor body and having one lead extended to the bottom surface, respectively; and three or more external electrodes formed on the bottom surface and connected to corresponding internal electrodes via the leads, wherein the internal electrodes are vertically disposed on the bottom surface, and the leads of the internal electrodes having a different polarity from each other, adjacent to each other in a lamination direction, are disposed to be always adjacent to each other in a horizontal direction.
摘要翻译：一种多层片状电容器，包括：电容器本体，其由多个电介质层的叠层形成，并且具有作为安装区域的底面; 设置成彼此相对的多个内部电极，在电容器主体之间插入介电层，并具有分别延伸到底面的一个引线; 以及三个或更多个外部电极，形成在底表面上并且经由引线连接到相应的内部电极，其中内部电极垂直设置在底部表面上，并且内部电极的引线彼此具有不同的极性，彼此在层叠方向上彼此沿水平方向布置。

42. 发明授权

US07262952B2 Multilayer chip capacitor 失效
标题翻译：多层片式电容器
公开(公告)号：US07262952B2
公开(公告)日：2007-08-28
申请号：US11453880
申请日：2006-06-16
申请人： Byoung Hwa Lee , Chang Hoon Shim , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Chang Hoon Shim , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232
摘要： The invention provides a multilayer chip capacitor reduced in ESL. A capacitor body has a plurality of dielectric layers stacked in a thickness direction. A plurality of first and second internal electrodes are separated from one another by the dielectric layers within the capacitor body. Each of the first internal electrodes opposes each of the second internal electrodes. Each of the first and second internal electrodes includes at least two leads extending toward any side of the capacitor body. Also, a plurality of external electrodes are formed on an outer surface of the capacitor body and connected to the internal electrodes via the leads. Further, vertically adjacent ones of the leads having the same polarity extend in different directions at a predetermined angle. The leads of the first and second internal electrodes are disposed adjacent to and alternate with those of the second internal electrodes.
摘要翻译：本发明提供了一种减少ESL的多层片式电容器。电容器本体具有沿厚度方向堆叠的多个电介质层。多个第一和第二内部电极通过电容器体内的电介质层彼此分离。每个第一内部电极与每个第二内部电极相对。第一和第二内部电极中的每一个包括朝向电容器主体的任何一侧延伸的至少两个引线。此外，多个外部电极形成在电容器主体的外表面上并经由引线连接到内部电极。此外，具有相同极性的垂直相邻的引线以预定角度在不同方向上延伸。第一和第二内部电极的引线设置成与第二内部电极的引线相邻并与其交替。

43. 发明授权

US09036330B2 Multilayer chip capacitor and method of fabricating the same 有权
标题翻译：多层片式电容器及其制造方法
公开(公告)号：US09036330B2
公开(公告)日：2015-05-19
申请号：US12650134
申请日：2009-12-30
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005 , H01G4/228 , H01G4/06 , H01G4/232 , H01G2/06 , H01G4/30 , H05K1/02 , H05K1/18
CPC分类号： H01G4/232 , H01G2/065 , H01G4/30 , H05K1/0231 , H05K1/0295 , H05K1/181 , H05K2201/0979 , H05K2201/09954 , Y10T29/435
摘要： A multilayer chip capacitor includes: a capacitor main body; a plurality of first and second inner electrodes; and m (m≧3) number of first and second outer electrodes. The plurality of first and second inner electrodes are connected with two outer electrodes positioned on both opposing surfaces and having the same polarity as that of the first and second inner electrodes, and classified into a plurality of groups depending on the locations of the outer electrodes connected to the first and second inner electrodes. At least one of two outer electrodes connected with inner electrodes of each group is different from an outer electrode connected with inner electrodes of a different group having the same polarity, and inner electrodes of one group are connected to outer electrodes connected with at least another one group so that all the inner electrodes belonging to the same polarity can be electrically connected.
摘要翻译：一种多层片状电容器包括：电容器主体; 多个第一和第二内部电极; 和m（m≥3）个数的第一和第二外部电极。多个第一和第二内部电极与位于两个相对表面上并且具有与第一和第二内部电极相同的极性的两个外部电极连接，并且根据连接的外部电极的位置被分成多个组到第一和第二内部电极。与每组的内部电极连接的两个外部电极中的至少一个不同于与具有相同极性的不同组的内部电极连接的外部电极，并且一组的内部电极连接到与至少另一个连接的外部电极使得属于相同极性的所有内部电极可以电连接。

44. 发明授权

US08213155B2 Multilayer chip capacitor 有权
标题翻译：多层片式电容器
公开(公告)号：US08213155B2
公开(公告)日：2012-07-03
申请号：US12340200
申请日：2008-12-19
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005 , H01G4/228
CPC分类号： H01G4/35 , H01G4/012 , H01G4/232 , H01G4/30 , H01G4/38
摘要： There is provided a multilayer chip capacitor a multilayer chip capacitor including: a capacitor body including first and second capacitor units arranged therein; and first to fourth outer electrodes, wherein the first capacitor unit includes first and second inner electrodes, and the first capacitor unit includes a plurality of capacitor elements each having a pair of the first and second inner electrodes repeatedly laminated, the second capacitor unit includes third and fourth inner electrodes, and the second capacitor unit includes at least one capacitor element having a pair of the third and fourth inner electrodes repeatedly laminated, and at least one of the capacitor elements of the first capacitor unit is different from the other capacitor elements of the first capacitor unit in a lamination number of the first and second inner electrodes or a resonant frequency.
摘要翻译：提供了一种多层片状电容器，其包括：电容器主体，包括布置在其中的第一和第二电容器单元; 以及第一至第四外部电极，其中所述第一电容器单元包括第一和第二内部电极，并且所述第一电容器单元包括多个电容器元件，每个电容器元件具有反复层叠的一对第一和第二内部电极，所述第二电容器单元包括第三电极单元和第四内部电极，并且第二电容器单元包括至少一个电容器元件，其具有重复层叠的一对第三和第四内部电极，并且第一电容器单元的电容器元件中的至少一个与其他电容器元件不同第一电容器单元的第一和第二内部电极的叠层数或谐振频率。

45. 发明授权

US08194389B2 Multilayer chip capacitor including two terminals 有权
标题翻译：多层片式电容器包括两个端子
公开(公告)号：US08194389B2
公开(公告)日：2012-06-05
申请号：US12245865
申请日：2008-10-06
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005 , H01G4/06 , H01G4/228
CPC分类号： H01G4/005 , H01G4/30
摘要： A multilayer chip capacitor includes a capacitor body including first and second longer side surfaces facing each other and first and second shorter side surfaces facing each other, first and second external electrodes respectively disposed at the first and second longer side surfaces, one or more first internal electrode pairs each including first and second internal electrodes, and one or more second internal electrode pairs each including third and fourth internal electrodes. The first to fourth internal electrodes each have one lead and are sequentially disposed in a stacked direction. The first to fourth internal electrodes have first to fourth leads respectively extending to first to fourth corners or portions adjacent thereto, and alternately connected with the first and second external electrodes. The first internal electrode pair and the second internal electrode pair cause a current to diagonally flow in opposite directions with respect to a long side direction.
摘要翻译：一种多层片状电容器包括：电容器主体，包括彼此面对的第一和第二较长侧表面;以及彼此面对的第一和第二短边表面，分别设置在第一和第二长边侧表面的第一和第二外部电极，每个电极对包括第一和第二内部电极，以及一个或多个第二内部电极对，每个包括第三和第四内部电极。第一至第四内部电极各自具有一个引线并且沿堆叠方向依次布置。第一至第四内部电极具有分别延伸到第一至第四角部或与其相邻的部分的第一至第四引线，并且与第一和第二外部电极交替连接。第一内部电极对和第二内部电极对使得电流相对于长边方向在相反的方向上斜向流动。

46. 发明授权

US08184444B2 Electrode pad for mounting electronic component and structure for mounting electronic component 有权
标题翻译：用于安装电子部件的电极垫和用于安装电子部件的结构
公开(公告)号：US08184444B2
公开(公告)日：2012-05-22
申请号：US12425068
申请日：2009-04-16
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H05K7/00
CPC分类号： H05K1/111 , H05K1/0231 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , Y02P70/611
摘要： Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.
摘要翻译：提供了一种用于将电子部件安装在电路板的表面上的电极焊盘。电极焊盘包括彼此面对的第一和第二电极部分，以及彼此面对的第三和第四电极部分。第三和第四电极部分与第一和第二电极部分相邻设置，用于与第一和第二电极部分一起形成电极焊盘的拐角。第一至第四电极部件中的至少一个包括通过切割形成电极焊盘的角部的第一至第四电极部分中的至少一个的角部而形成的倒角表面。因此，当电极焊盘用于安装电子部件时，能够充分地增加电子部件的外部电极的宽度，能够容易地调整外部电极的形状或尺寸。

47. 发明授权

US08050012B2 Multilayer chip capacitor and circuit board device including the same 有权
标题翻译：多层片式电容器和电路板装置包括相同
公开(公告)号：US08050012B2
公开(公告)日：2011-11-01
申请号：US12195015
申请日：2008-08-20
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/005
CPC分类号： H05K1/0231 , H01G4/005 , H01G4/232 , H01G4/385 , H05K2201/09481 , H05K2201/10015 , H05K2201/10636 , Y02P70/611
摘要： A multilayer chip capacitor including: a capacitor body having a lamination structure where a plurality of dielectric layers are laminated and including a first capacitor part and a second capacitor part arranged according to a lamination direction; first to fourth outer electrodes formed on side surfaces of the capacitor body, the first and third outer electrodes having the same polarity and the second and fourth outer electrodes having the same polarity opposite to that of the first outer electrode; and one or more connection conductor lines formed on an outer surface of the capacitor body and connecting the first outer electrode to the third outer electrode or connecting the second outer electrode to the fourth outer electrode.
摘要翻译：一种多层片状电容器，包括：层叠有多个电介质层的叠层结构的电容器体，具有根据层叠方向配置的第一电容器部和第二电容器部; 形成在电容器主体的侧面的第一至第四外部电极，第一和第三外部电极具有相同的极性，第二和第四外部电极具有与第一外部电极的极性相反的极性; 以及一个或多个连接导线，形成在电容器主体的外表面上，并将第一外电极连接到第三外电极或将第二外电极连接到第四外电极。

48. 发明授权

US07990677B2 Multilayer chip capacitor 有权
标题翻译：多层片式电容器
公开(公告)号：US07990677B2
公开(公告)日：2011-08-02
申请号：US12817046
申请日：2010-06-16
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228 , H01G4/248 , H01G4/06
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the first and second side surfaces, respectively, to cover a respective lower edge of the side surfaces and to partially extend to the bottom surface; and a third external electrode having a second polarity and formed on the bottom surface. The internal electrodes are disposed in perpendicular to the bottom surface. Each of the first internal electrodes has a first lead drawn to the first side and bottom surfaces and a second lead drawn to the second side and bottom surfaces. Each of the second internal electrodes has a third lead drawn to the bottom surface.
摘要翻译：一种多层片状电容器包括：具有第一和第二侧表面和底表面的电容器本体; 电容器主体中的多个第一和第二内部电极; 第一和第二外部电极分别具有第一极性并形成在第一和第二侧表面上，以覆盖侧表面的相应下边缘并部分地延伸到底面; 和具有第二极性并形成在底面上的第三外部电极。内部电极垂直于底面设置。每个第一内部电极具有被引导到第一侧面和底部表面的第一引线和被引导到第二侧面和底部表面的第二引线。每个第二内部电极具有被引导到底面的第三引线。

49. 发明授权

US07961453B2 Multilayer chip capacitor 有权
标题翻译：多层片式电容器
公开(公告)号：US07961453B2
公开(公告)日：2011-06-14
申请号：US12003884
申请日：2008-01-03
申请人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H01G4/228 , H01G4/005 , H01G4/06
CPC分类号： H01G4/30 , H01G4/012 , H01G4/232
摘要： A multilayer chip capacitor including: a capacitor body formed of a lamination of a plurality of dielectric layers and having a bottom surface that is a mounting area; a plurality of internal electrodes disposed to be opposite to each other, interposing a dielectric layer there between in the capacitor body and having one lead extended to the bottom surface, respectively; and three or more external electrodes formed on the bottom surface and connected to corresponding internal electrodes via the leads, wherein the internal electrodes are vertically disposed on the bottom surface, and the leads of the internal electrodes having a different polarity from each other, adjacent to each other in a lamination direction, are disposed to be always adjacent to each other in a horizontal direction.
摘要翻译：一种多层片状电容器，包括：电容器本体，其由多个电介质层的叠层形成，并且具有作为安装区域的底面; 设置成彼此相对的多个内部电极，在电容器主体之间插入介电层，并具有分别延伸到底面的一个引线; 以及三个或更多个外部电极，形成在底表面上并且经由引线连接到相应的内部电极，其中内部电极垂直设置在底部表面上，并且内部电极的引线彼此具有不同的极性，彼此在层叠方向上彼此沿水平方向布置。

50. 发明申请

US20100032193A1 ELECTRODE PAD FOR MOUNTING ELECTRONIC COMPONENT AND STRUCTURE FOR MOUNTING ELECTRONIC COMPONENT 有权
标题翻译：用于安装电子部件的电极板和用于安装电子部件的结构
公开(公告)号：US20100032193A1
公开(公告)日：2010-02-11
申请号：US12425068
申请日：2009-04-16
申请人： Byoung Hwa LEE , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
发明人： Byoung Hwa LEE , Sung Kwon Wi , Hong Yeon Cho , Dong Seok Park , Sang Soo Park , Min Cheol Park
IPC分类号： H05K1/16 , H05K1/11
CPC分类号： H05K1/111 , H05K1/0231 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , Y02P70/611
摘要： Provided is an electrode pad for mounting an electronic component on a surface of a circuit board. The electrode pad includes first and second electrode parts facing each other, and third and fourth electrode parts facing each other. The third and fourth electrode parts are disposed adjacent to the first and second electrode parts for forming corners of the electrode pad together with the first and second electrode parts. At least one of the first to fourth electrode parts includes a chamfered surface formed by cutting a corner of the at least one of the first to fourth electrode parts forming the corner of the electrode pad. Therefore, when the electrode pad is used for mounting an electronic component, the width of an outer electrode of the electronic component can be sufficiently increased, and thus the shape or size of the outer electrode can be easily adjusted.
摘要翻译：提供了一种用于将电子部件安装在电路板的表面上的电极焊盘。电极焊盘包括彼此面对的第一和第二电极部分，以及彼此面对的第三和第四电极部分。第三和第四电极部分与第一和第二电极部分相邻设置，用于与第一和第二电极部分一起形成电极焊盘的拐角。第一至第四电极部件中的至少一个包括通过切割形成电极焊盘的角部的第一至第四电极部分中的至少一个的角部而形成的倒角表面。因此，当电极焊盘用于安装电子部件时，能够充分地增加电子部件的外部电极的宽度，能够容易地调整外部电极的形状或尺寸。

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