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41. 发明申请

US20100291491A1 Resist pattern slimming treatment method 审中-公开
标题翻译：抗皱图案减肥治疗方法
公开(公告)号：US20100291491A1
公开(公告)日：2010-11-18
申请号：US12662343
申请日：2010-04-13
申请人： Masahiro Yamamoto , Yoshihiro Kondo , Atsushi Ookouchi , Toyohisa Tsuruda
发明人： Masahiro Yamamoto , Yoshihiro Kondo , Atsushi Ookouchi , Toyohisa Tsuruda
IPC分类号： G03F7/38
CPC分类号： G03F7/38 , H01L21/0273
摘要： A resist pattern slimming treatment method of performing a slimming treatment on a resist pattern formed on a substrate includes: a slimming treatment step of performing a slimming treatment on the resist pattern by applying a reactant solubilizing the resist pattern onto the resist pattern, then performing a heat treatment on the resist pattern under a heat treatment condition determined in advance, and then performing a developing treatment on the resist pattern; and a first line width measurement step of measuring a line width of the resist pattern before the slimming treatment step. The heat treatment condition is determined based on a measurement value of the line width measured in the first line width measurement step.
摘要翻译：对形成在基板上的抗蚀剂图案进行减肥处理的抗蚀剂图案减肥处理方法包括：减肥处理步骤，通过将抗蚀剂图案溶解在抗蚀剂图案上来进行抗蚀剂图案的减肥处理，然后进行在预先确定的热处理条件下对抗蚀剂图案进行热处理，然后对抗蚀剂图案进行显影处理; 以及第一线宽测量步骤，用于在减肥处理步骤之前测量抗蚀剂图案的线宽。基于在第一线宽测量步骤中测量的线宽的测量值来确定热处理条件。

42. 发明申请

US20100073866A1 COOLING DEVICE AND ELECTRONIC EQUIPMENT INCLUDING COOLING DEVICE 有权
标题翻译：冷却装置和包括冷却装置的电子设备
公开(公告)号：US20100073866A1
公开(公告)日：2010-03-25
申请号：US12544166
申请日：2009-08-19
申请人： Hiroyuki TOYODA , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
发明人： Hiroyuki TOYODA , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： F28D15/043 , F28D15/046 , H01L2924/0002 , H05K7/20809 , H01L2924/00
摘要： A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.
摘要翻译：提供了包括具有高性能CPU的冷却结构的刀片服务器。为了提高滞留在翅片之间的冷凝工作流体的排水性能，使用蒸气冷凝管，在上述管内表面上沿与管轴方向大致平行的方向形成有槽，上述散热片的一排在上述槽的侧面露出，当上述槽位于上述的蒸汽冷凝管的管轴方向的中心线时，上述槽沿垂直方向配置在下侧将上述凹槽安装在上述蒸汽冷凝管中，并且将具有小于上述翅片排的翅片空间的线空间的芯填充在上述凹槽内。

43. 发明申请

US20100073863A1 ELECTRONIC APPARATUS 有权
标题翻译：电子设备
公开(公告)号：US20100073863A1
公开(公告)日：2010-03-25
申请号：US12544153
申请日：2009-08-19
申请人： Hitoshi MATSUSHIMA , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
发明人： Hitoshi MATSUSHIMA , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , H05K7/20245
摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.
摘要翻译：诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管，其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

44. 发明申请

US20090154104A1 Cooling Device and Electronic Apparatus Using the Same 有权
标题翻译：冷却装置及其使用的电子设备
公开(公告)号：US20090154104A1
公开(公告)日：2009-06-18
申请号：US12328967
申请日：2008-12-05
申请人： Yoshihiro Kondo , Akio Idei , Shigeyasu Tsubaki , Hitoshi Matsushima , Tadakatsu Nakajima , Hiroyuki Toyoda , Tomoo Hayashi , Tatsuya Saito , Takeshi Kato , Kenji Ogiro
发明人： Yoshihiro Kondo , Akio Idei , Shigeyasu Tsubaki , Hitoshi Matsushima , Tadakatsu Nakajima , Hiroyuki Toyoda , Tomoo Hayashi , Tatsuya Saito , Takeshi Kato , Kenji Ogiro
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.
摘要翻译：本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中冷却单元，第二散热部设置在壳体的外部。

45. 发明授权

US07296618B2 Liquid cooling system and electronic apparatus using the same 失效
标题翻译：液体冷却系统及使用其的电子设备
公开(公告)号：US07296618B2
公开(公告)日：2007-11-20
申请号：US10791823
申请日：2004-03-04
申请人： Rintaro Minamitani , Shinji Matsushita , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Osamu Suzuki
发明人： Rintaro Minamitani , Shinji Matsushita , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Osamu Suzuki
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20
CPC分类号： H01L23/473 , G06F1/203 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system is disclosed for use in an electronic apparatus. The system is constructed to be of a reduced size and thickness, thus allowing it to be used for cooling heat-generating devices such as semiconductor elements, while maintaining corrosion resistance. The system includes a pump, a heat-receiving jacket, and flow passages through which the cooling liquid is circulated. An ion exchange bag having a water-permeable bag is disposed within the liquid cooling system. The water-permeable bag further contains an ion exchange resin therein.
摘要翻译：公开了一种用于电子设备的液体冷却系统。该系统被构造为具有减小的尺寸和厚度，从而允许其用于冷却诸如半导体元件的发热装置，同时保持耐腐蚀性。该系统包括泵，热接收夹套和冷却液循环通过的流动通道。具有透水袋的离子交换袋设置在液体冷却系统内。透水性袋还含有离子交换树脂。

46. 发明申请

US20050088820A1 Liquid cooling system 有权
标题翻译：液体冷却系统
公开(公告)号：US20050088820A1
公开(公告)日：2005-04-28
申请号：US10791772
申请日：2004-03-04
申请人： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Osamu Suzuki , Hitoshi Matsushima
发明人： Takashi Naganawa , Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Osamu Suzuki , Hitoshi Matsushima
IPC分类号： F25D17/02 , F25D9/00 , F28D1/053 , F28F9/00 , F28F9/04 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： F28F9/002 , F28D1/05341 , F28F9/0246 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.
摘要翻译：一种液体冷却系统，包括：与发热元件热连接的热接收套7，附接到散热器1a上的泵和在散热器1a上的罐部分2，其中冷却剂液体在热接收护套7和散热器1a，从而获得用于电子设备的液体冷却系统，适用于小尺寸和薄型，同时保持其高可靠性。

47. 发明授权

US5579370A Portable telephone system 失效
标题翻译：便携式电话系统
公开(公告)号：US5579370A
公开(公告)日：1996-11-26
申请号：US941963
申请日：1992-09-08
申请人： Yutaka Fukushima , Tetsuo Takemura , Shinichi Iwaki , Mitsuyoshi Hashida , Masao Wanami , Isao Shimbo , Mitsuhiro Wada , Hirofumi Udaki , Yoshihiro Kondo , Yoshinobu Yamamoto , Arata Nakagoshi , Kouichi Ohta , Hiroshi Kuwahara , Yumiko Watanabe
发明人： Yutaka Fukushima , Tetsuo Takemura , Shinichi Iwaki , Mitsuyoshi Hashida , Masao Wanami , Isao Shimbo , Mitsuhiro Wada , Hirofumi Udaki , Yoshihiro Kondo , Yoshinobu Yamamoto , Arata Nakagoshi , Kouichi Ohta , Hiroshi Kuwahara , Yumiko Watanabe
IPC分类号： H04B10/00 , H04B10/032 , H04B10/035 , H04B10/07 , H04B10/272 , H04B10/29 , H04M3/22 , H04W4/16 , H04W24/04 , H04W24/06 , H04W56/00 , H04W60/04 , H04W64/00 , H04W84/04 , H04W88/08 , H04W92/00 , H04M11/04 , H04M11/00
CPC分类号： H04W24/04 , H04B10/25754 , H04W84/042 , H04W24/06 , H04W4/16 , H04W60/04 , H04W64/006 , H04W88/08
摘要： Duplicate optical fibers connect between a base station controller and a radio base station for each route. The duplicate optical fiber is connected to each of the radio base stations for each route through a star coupler. The radio base stations are arranged in each of areas so that the radio base stations for different routes are arranged adjacent to each other.
摘要翻译：每个路由，重复的光纤连接在基站控制器和无线基站之间。复制光纤通过星形耦合器连接到每个无线电基站，用于每个路由。无线基站配置在各个区域中，使得用于不同路由的无线基站彼此相邻配置。

48. 发明申请

US20120198253A1 Operational Management Method for Information Processing System and Information Processing System 有权
标题翻译：信息处理系统和信息处理系统的运行管理方法
公开(公告)号：US20120198253A1
公开(公告)日：2012-08-02
申请号：US13395070
申请日：2009-09-09
申请人： Takeshi Kato , Tatsuya Saito , Jun Okitsu , Yoko Shiga , Tadakatsu Nakajima , Yoshihiro Kondo
发明人： Takeshi Kato , Tatsuya Saito , Jun Okitsu , Yoko Shiga , Tadakatsu Nakajima , Yoshihiro Kondo
IPC分类号： G06F1/32 , G06F1/20 , G06F1/26
CPC分类号： G06F1/20 , G06F1/3203 , H02J3/005 , H02J3/14 , Y02B70/3225 , Y04S20/222 , Y04S20/224
摘要： In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments. The operation management method for the information processing system includes: a procedure for acquiring, from each of the groups, operating information indicating the performances and the power consumptions of the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups; and another procedure for controlling, based on the operating information, the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups so that the performances with respect to the power consumptions become large.
摘要翻译：在包括信息处理设备组和设备设备组的信息处理系统中，获得了性能的提高和功耗的降低，从而实现了高效且灵活的操作管理。多个信息处理设备被分成多个组，每个组包括供电设备和冷却设备。信息处理系统的操作管理方法包括：从各组中获取表示信息处理设备的性能和功耗的操作信息的步骤，供电设备和包括在每个团体以及用于基于操作信息控制包括在每个组中的信息处理设备，供电设备和冷却设备的另一过程，使得相对于功耗的性能变大。

49. 发明授权

US08164902B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08164902B2
公开(公告)日：2012-04-24
申请号：US12544153
申请日：2009-08-19
申请人： Hitoshi Matsushima , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
发明人： Hitoshi Matsushima , Tadakatsu Nakajima , Takayuki Atarashi , Yoshihiro Kondo , Hiroyuki Toyoda , Tomoo Hayashi , Akio Idei , Shigeyasu Tsubaki , Takumi Sugiura , Yasuhiro Kashirajima
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , H05K7/20245
摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.
摘要翻译：诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管，其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

50. 发明授权

US08130497B2 Blade server 有权
标题翻译：刀片服务器
公开(公告)号：US08130497B2
公开(公告)日：2012-03-06
申请号：US12620742
申请日：2009-11-18
申请人： Yoshihiro Kondo , Tadakatsu Nakajima , Akio Idei , Shigeyasu Tsubaki , Hiroyuki Toyoda , Tomoo Hayashi
发明人： Yoshihiro Kondo , Tadakatsu Nakajima , Akio Idei , Shigeyasu Tsubaki , Hiroyuki Toyoda , Tomoo Hayashi
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H05K7/20818
摘要： A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.
摘要翻译：一种具有冷却能力的服务器系统，其可以应对可拆卸地安装在刀片服务器上的服务器模块的CPU产生的热量的增加。服务器模块包括容纳其中安装有CPU，存储器等的母板的壳体和用于冷却由CPU产生的热的沸腾冷却装置的一部分。容纳在风扇模块中的风扇适于通过服务器模块外壳的开口将空气吹入服务器模块。沸腾冷却装置包括设置在服务器模块外壳中的第一传热构件，设置在服务器模块外壳外部的第二传热构件和连接它们的多个管道。第一传热构件是具有用于气密地密封制冷剂的内部空间的盒体，其一个外部平面被热连接到CPU，而另一个外部平面设置有散热器。第二传热构件设置在风扇模块单元中，并且用于管道的散热构件与主板一起形成气流通道。

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