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    • 44. 发明授权
    • Charge trap layer for a charge trap semiconductor memory device and method of manufacturing the same
    • 用于电荷陷阱半导体存储器件的电荷陷阱层及其制造方法
    • US07795159B2
    • 2010-09-14
    • US11987425
    • 2007-11-30
    • Kwang-soo SeolYo-sep MinSang-min Shin
    • Kwang-soo SeolYo-sep MinSang-min Shin
    • H01L21/31
    • H01L29/792H01L21/28273H01L21/28282H01L29/42324H01L29/4234H01L29/7883Y10T428/31678
    • Provided are a charge trap semiconductor memory device including a charge trap layer on a semiconductor substrate, and a method of manufacturing the charge trap semiconductor memory device. The method includes: (a) coating a first precursor material on a surface of a semiconductor substrate to be deposited and oxidizing the first precursor material to form a first layer formed of an insulating material; (b) coating a second precursor material formed of metallicity on the first layer; (c) supplying the first precursor material on the surface coated with the second precursor material to substitute the second precursor material with the first precursor material; and (d) oxidizing the first and second precursor materials obtained in (c) to form a second layer formed of an insulating material and a metal impurity, and (a) through (d) are performed at least one time to form a charge trap layer having a structure in which the metal impurity is isolated in the insulating material.
    • 提供了一种在半导体衬底上包括电荷陷阱层的电荷陷阱半导体存储器件,以及制造电荷阱半导体存储器件的方法。 该方法包括:(a)在待沉积的半导体衬底的表面上涂覆第一前体材料并氧化第一前体材料以形成由绝缘材料形成的第一层; (b)在第一层上涂覆由金属性形成的第二前体材料; (c)在涂覆有第二前体材料的表面上提供第一前体材料以用第一前体材料代替第二前体材料; 和(d)氧化由(c)中得到的第一和第二前体材料以形成由绝缘材料和金属杂质形成的第二层,并且(a)至(d)至少进行一次以形成电荷阱 具有金属杂质在绝缘材料中隔离的结构的层。