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41. 发明申请

US20110134518A1 SURGICAL MICROSCOPE SYSTEM 有权
标题翻译：手术显微镜系统
公开(公告)号：US20110134518A1
公开(公告)日：2011-06-09
申请号：US13059351
申请日：2009-08-18
申请人： Masao Doi , Toshio Yamazaki
发明人： Masao Doi , Toshio Yamazaki
IPC分类号： G02B21/00
CPC分类号： A61B19/5223 , A61B90/20
摘要： Only a front end part 16 of a surgical microscope 15 is turned in a left-right direction X around a main axis S, so that an observation angle of a surgical site T is freely changed in the left-right direction. Even if the observation angle is changed, the orientation of eyepieces 22 is unchanged, and therefore, an operator does not need to bend his or her neck and no burden is imposed on the neck of the operator even if the operator must conduct an operation that takes a long time.
摘要翻译：只有手术显微镜15的前端部16在左右方向X绕主轴S旋转，使得手术部位T的观察角度在左右方向上自由变化。即使观察角度发生变化，目镜22的方向也不变，因此，即使操作者必须进行操作，操作人员不需要弯曲他或她的脖子，也不会对操作者的颈部造成负担，需要很长时间。

42. 发明申请

US20060274075A1 Moving picture conversion apparatus and method, moving picture reconstruction apparatus and method, and computer program 审中-公开
标题翻译：运动图像转换装置和方法，运动图像重建装置和方法以及计算机程序
公开(公告)号：US20060274075A1
公开(公告)日：2006-12-07
申请号：US11418095
申请日：2006-05-05
申请人： Toshio Yamazaki , Seiji Kobayashi , Yasutaka Hirasawa
发明人： Toshio Yamazaki , Seiji Kobayashi , Yasutaka Hirasawa
IPC分类号： G06F12/02
CPC分类号： H04N19/59 , H04N19/132 , H04N19/137 , H04N19/176 , H04N19/587 , H04N19/61
摘要： A moving-picture conversion apparatus includes a block generator configured to generate blocks by dividing each frame forming moving picture data into the blocks, an amount-of-movement detector configured to detect an amount of movement of a subject corresponding to each block generated by the block generator, a block processor configured to receive the blocks generated by the block generator and information concerning the amount of movement detected by the amount-of-movement detector to perform decimation processing on the blocks, and a packing processor configured to receive the blocks decimated by the block processor to generate a packed block including pixel data forming the decimated blocks. The packing processor generates a packed block by correcting positions of pixels forming the packed block substantially to relative positions of the corresponding pixels forming an original image.
摘要翻译：运动图像转换装置包括块生成器，其被配置为通过将形成运动图像数据的每个帧划分为块来生成块;运动量检测器，被配置为检测与由所述块生成的每个块相对应的被摄体的移动量块生成器，块处理器，被配置为接收由块生成器生成的块和关于由移动量检测器检测到的移动量的信息以对块执行抽取处理;以及打包处理器，被配置为接收被舍弃的块通过块处理器来产生包括形成抽取块的像素数据的压缩块。打包处理器通过将形成打包块的像素的位置基本上校正到形成原始图像的对应像素的相对位置来生成打包块。

43. 发明申请

US20050054762A1 Silicone rubber coating composition and airbag 失效
标题翻译：硅橡胶涂料组合物和气囊
公开(公告)号：US20050054762A1
公开(公告)日：2005-03-10
申请号：US10934355
申请日：2004-09-07
申请人： Atsushi Yaginuma , Toshiyuki Ozai , Toshio Yamazaki , Masayuki Yoshida
发明人： Atsushi Yaginuma , Toshiyuki Ozai , Toshio Yamazaki , Masayuki Yoshida
IPC分类号： B60R21/16 , B05D7/00 , B05D7/24 , C08K5/5455 , C09D7/12 , C09D183/04 , D06M11/79 , D06M15/564 , C08K3/34 , C08K5/24
CPC分类号： C08K5/5455 , Y10T428/31663 , C08L83/04
摘要： A silicone rubber coating composition comprising (A) a diorganopolysiloxane containing an average of at least two alkenyl groups, (B) silica powder having a specific surface area of at least 50 m2/g, (C) an organosilicon compound containing a ureido group, an isocyanuric acid ester modified with an organosilicon compound or a (partial) hydrolytic condensate thereof, and (D) a curing agent is applied and vulcanized to base fabric to form a coated fabric, from which airbags are prepared. The composition has a sufficient adhesion to withstand high temperature and abrupt elongation upon inflation of the airbag even after long-term storage under hot humid conditions.
摘要翻译：一种硅橡胶涂料组合物，其包含（A）含有平均至少两个烯基的二有机聚硅氧烷，（B）比表面积至少为50m 2 / g的二氧化硅粉末，（C）含有脲基，用有机硅化合物或其（部分）水解缩合物改性的异氰脲酸酯，和（D）固化剂，并将其硫化成基布，形成涂布的织物，制备安全气囊。该组合物具有足够的粘附性，即使在热潮湿条件下长期储存后，气囊充气时也能承受高温和突然伸长。

44. 发明授权

US06365432B1 Fabrication process of semiconductor package and semiconductor package 失效
公开(公告)号：US06365432B1
公开(公告)日：2002-04-02
申请号：US09487682
申请日：2000-01-19
申请人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
发明人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/0002
摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

45. 发明授权

US6064111A Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package 失效
标题翻译：用于保持半导体封装芯片，半导体封装和半导体封装的制造工艺的衬底
公开(公告)号：US6064111A
公开(公告)日：2000-05-16
申请号：US903996
申请日：1997-07-31
申请人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
发明人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
IPC分类号： H01L23/02 , H01L23/498 , H01L23/495 , H01L21/44
CPC分类号： H01L23/4985 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/181
摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.
摘要翻译：本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。在绝缘支撑基板上的绝缘性支撑基板上形成有各自的配线的绝缘物的绝缘体上设置开口部，绝缘性支撑基板是设置有内部连接部的外部连接部的部分。绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。

46. 发明授权

US5976912A Fabrication process of semiconductor package and semiconductor package 失效
标题翻译：半导体封装和半导体封装的制造工艺
公开(公告)号：US5976912A
公开(公告)日：1999-11-02
申请号：US716362
申请日：1996-09-18
申请人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
发明人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
IPC分类号： H01L21/48 , H01L21/56 , H01L21/58 , H01L21/68 , H01L23/31 , H01L23/498 , H05K3/20 , H01L23/28
CPC分类号： H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20
摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
摘要翻译： PCT No.PCT / JP95 / 00492 Sec。 371日期1996年9月18日 102（e）1996年9月18日PCT PCT 1995年3月17日PCT公布。公开号WO95 / 26047 日期1995年9月28日提供了半导体封装基板，可以满足半导体高集成化的趋势。将镍层电镀在电镀铜箔上以形成布线图案。将LSI芯片安装在铜箔上，通过引线接合连接LSI芯片和布线图案的端子，然后用半导体密封环氧树脂密封。只有铜箔用碱蚀刻剂溶解掉才能暴露镍。对于具有低铜溶力的镍剥离器，去除镍层以露出布线图案。涂覆阻焊剂，并且以使连接端子部分露出的方式形成图案。将焊球放置在布线图案的露出部分，然后熔合。布线图案通过焊球与外部印刷电路板连接。

47. 发明授权

US5776596A Magnetic recording medium having a magnetic layer and intermediate layer each containing a specified fatty acid and fatty acid ester 失效
标题翻译：具有磁性层和中间层的磁记录介质各自含有特定的脂肪酸和脂肪酸酯
公开(公告)号：US5776596A
公开(公告)日：1998-07-07
申请号：US754958
申请日：1996-11-22
申请人： Toshio Yamazaki , Shigeaki Wakana , Satoshi Nagai , Tetsutaro Inoue
发明人： Toshio Yamazaki , Shigeaki Wakana , Satoshi Nagai , Tetsutaro Inoue
IPC分类号： C08K5/09 , C08K5/10 , C08L5/10 , C09D5/23 , C09D7/12 , G11B5/71 , G11B5/73 , G11B5/735 , G11B5/738
CPC分类号： G11B5/71 , G11B5/738 , Y10S428/90 , Y10T428/24942 , Y10T428/24975 , Y10T428/256 , Y10T428/265
摘要： A magnetic recording medium comprising a nonmagnetic substrate, an intermediate layer provided on the nonmagnetic substrate, and a magnetic layer provided on the intermediate layer, wherein the magnetic layer contains, as a lubricant, (A) a fatty acid ester derived from a straight-chain or branched aliphatic alcohol having 3 to 7 carbon atoms and a straight-chain or branched fatty acid having 12 to 18 carbon atoms and (B) a fatty acid ester derived from a straight-chain or branched aliphatic alcohol having 8 to 14 carbon atoms and a straight-chain or branched fatty acid having 12 to 18 carbon atoms.
摘要翻译：一种磁记录介质，包括非磁性基板，设置在非磁性基板上的中间层和设置在中间层上的磁性层，其中磁性层含有：（A）由直链状的基材衍生的脂肪酸酯，具有3至7个碳原子的直链或支链脂族醇和具有12至18个碳原子的直链或支链脂肪酸和（B）衍生自具有8至14个碳原子的直链或支链脂族醇的脂肪酸酯和具有12至18个碳原子的直链或支链脂肪酸。

48. 发明授权

US5516868A Vinyl copolymer, method for making, and room temperature curing resin composition 失效
标题翻译：乙烯基共聚物，制备方法和室温固化树脂组合物
公开(公告)号：US5516868A
公开(公告)日：1996-05-14
申请号：US497052
申请日：1995-06-30
申请人： Toshio Yamazaki , Shinichi Morioka , Nobuyuki Syzuki , Ichinobe Shoji
发明人： Toshio Yamazaki , Shinichi Morioka , Nobuyuki Syzuki , Ichinobe Shoji
IPC分类号： C08F230/08 , C08G77/08
CPC分类号： C08F230/08
摘要： A vinyl copolymer is provided comprising a silanol group-containing (meth)acryl siloxane unit of formula (1): ##STR1## wherein R.sup.1 is hydrogen or methyl, R.sup.2, R.sup.3, and R.sup.4 are independently a monovalent C.sub.1 -C.sub.8 hydrocarbon group or a siloxy group, R.sup.5 is a monovalent C.sub.1 -C.sub.8 hydrocarbon group, n=1 to 12, and a=0 or 1. The vinyl copolymer is prepared by copolymerizing a polymerizable vinyl monomer with a silanol group-containing (meth)acryl siloxane in the presence of a radical initiator or by emulsion polymerizing a polymerizable vinyl monomer with a silanol group-containing (meth)acryl siloxane in an aqueous medium in the presence of a surfactant and a polymerization initiator. The copolymer is blended with a condensation catalyst to form a room temperature curable resin composition which crosslinks in the presence of moisture into a cured coating having weatherability, flexibility, and adherence.
摘要翻译：提供了包含式（1）的含硅烷醇基的（甲基）丙烯酸硅氧烷单元的乙烯基共聚物：其中R1是氢或甲基，R2，R3和R4独立地是一价C1-C8烃基团或甲硅烷氧基，R5是单价C1-C8烃基，n = 1〜12，a = 0或1.乙烯基共聚物通过将可聚合乙烯基单体与含硅烷醇基的（甲基）丙烯酸在自由基引发剂的存在下，通过在水性介质中，在表面活性剂和聚合引发剂的存在下，使可聚合的乙烯基单体与含硅烷醇基的（甲基）丙烯酸硅氧烷乳液聚合。将共聚物与缩合催化剂混合以形成室温可固化树脂组合物，其在水分存在下交联成具有耐候性，柔韧性和粘附性的固化涂层。

49. 发明授权

US5004281A Automobile side door extendable and retractable bump protector 失效
标题翻译：汽车侧门可伸缩保护器
公开(公告)号：US5004281A
公开(公告)日：1991-04-02
申请号：US294189
申请日：1989-01-09
申请人： Toshio Yamazaki
发明人： Toshio Yamazaki
IPC分类号： B60R13/04
CPC分类号： B60R13/04
摘要： Door mounted extendable protectors for protection against damage from bumping by an opening door of another vehicle parked closely adjacent in side by side relation. Resilient bumper elements are mounted outside each car door extended substantially the front to back length of the door. The door extending mechanism is connected via bumper element mounting rods that extend from connection to the extending mechanism out through the outer sheet metal skin of the door to connection with the bumper element. In one embodiment the door bumper extending mechanism is also a retracting mechanism while in another embodiment the bumper element must be manually returned to the retracted state flush against the door when the extending mechanism is not activated.
摘要翻译：门安装的可延伸保护器，用于防止由并排关系紧密相邻的另一车辆的开门撞击而造成的损坏。弹性保险杠元件安装在每个车门外部，大体上基本上延伸到门的前后长度。门延伸机构通过保险杠元件安装杆连接，该连接杆通过门的外部金属板皮从连接延伸机构延伸出来，以与保险杠元件连接。在一个实施例中，门保险杠延伸机构也是缩回机构，而在另一个实施例中，当延伸机构未被启动时，保险杠元件必须手动返回到缩回状态，以与门齐平。

50. 发明授权

US09045637B2 Addition curing silicone rubber composition and its cured product 有权
标题翻译：加成固化硅橡胶组合物及其固化产物
公开(公告)号：US09045637B2
公开(公告)日：2015-06-02
申请号：US12061467
申请日：2008-04-02
申请人： Noriyuki Meguriya , Shinichi Ide , Toshio Yamazaki
发明人： Noriyuki Meguriya , Shinichi Ide , Toshio Yamazaki
IPC分类号： C08L83/04 , C08G77/04 , C08G77/12 , C08G77/20
CPC分类号： C08L83/04 , C08G77/045 , C08G77/12 , C08G77/20 , C08L83/00
摘要： An addition curing silicone rubber composition and a cured product thereof are provided. In this composition, amount of the low molecular weight siloxane component volatilizing from the cured product has been reduced, and as a consequence, this composition is free from the problems such as clouding or haze, contact fault, adhesion failure, and hydrophobicization of the surface caused by the deposition of the volatilized low-molecular weight siloxane component on the surrounding surfaces. More specifically, the addition curing silicone rubber composition comprises; (A) 100 parts by weight of a polyorganosiloxane containing, on average, at least two alkenyl groups which are bonded to silicon atom; (B) 0.3 to 20 parts by weight of an organohydrogenpolysiloxane containing at least two hydrogen atoms which are bonded to silicon atom (SiH functional groups) per molecule; and (C) a catalytic amount of a addition reaction catalyst, and content of the polyorganosiloxane having a degree of polymerization of up to 10 and containing at least one SiH functional group per molecule is up to 0.5% by weight in relation to the entire composition.
摘要翻译：提供加成硫化硅橡胶组合物及其固化物。在该组合物中，从固化物挥发的低分子量硅氧烷成分的量已经减少，结果，该组合物没有诸如混浊或混浊，接触不良，粘附破坏和表面疏水化的问题这是由挥发的低分子量硅氧烷组分沉积在周围的表面上引起的。更具体地，加成固化硅橡胶组合物包含：（A）100重量份含有至少两个与硅原子键合的链烯基的聚有机硅氧烷; （B）0.3〜20重量份含有每分子与硅原子（SiH官能团）键合的至少两个氢原子的有机氢聚硅氧烷; 和（C）催化量的加成反应催化剂，聚合有机硅氧烷的含量至多为10，每分子含有至少一个SiH官能团，其含量相对于整个组合物为至多0.5重量％。

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