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    • 43. 发明授权
    • Graded gate field
    • 分级门字段
    • US07956425B1
    • 2011-06-07
    • US12698973
    • 2010-02-02
    • James Montague Cleeves
    • James Montague Cleeves
    • H01L21/02
    • H01L29/78621H01L29/66757
    • Thin film transistors (TFT) and methods for making same. The TFTs generally comprise: (a) a semiconductor layer comprising source and drain terminals and a channel region therebetween; (b) a gate electrode comprising a gate and a gate dielectric layer between the gate and the channel region; (c) a first dielectric layer adjacent to the gate electrode and in contact with the source and drain terminals, the first dielectric layer comprising a material which comprises a dopant therein; and (d) an electrically functional source/drain extensions in the channel region, adjacent to the source and drain terminals, comprising a material which comprises the same dopant as the first dielectric layer.
    • 薄膜晶体管(TFT)及其制造方法。 TFT通常包括:(a)包括源极和漏极端子以及它们之间的沟道区域的半导体层; (b)栅电极,在栅极和沟道区之间包括栅极和栅介质层; (c)与栅电极相邻并与源极和漏极端子接触的第一电介质层,第一介电层包括在其中包含掺杂剂的材料; 和(d)沟道区域中的与源极和漏极端子相邻的电功率源极/漏极延伸部分,包括与第一介电层相同的掺杂剂的材料。
    • 45. 发明授权
    • Wafer temperature control apparatus and method
    • 晶圆温度控制装置及方法
    • US06786998B1
    • 2004-09-07
    • US08581347
    • 1995-12-29
    • James Montague Cleeves
    • James Montague Cleeves
    • C23F102
    • H01L21/68721H01J2237/2001H01L21/67069H01L21/67109H01L21/67126
    • An assembly for holding a substrate is provided. The substrate has a first surface, a second surface, opposite the first surface and an outer peripheral portion. The assembly includes a holding body having a support surface for supporting the substrate. The holding body has an aperture for passing therethrough a gas having a thermal conductivity. Additionally, the assembly includes a heat transferring seal having a first surface for frictionally engaging the second surface of the substrate. The heat transferring seal has a second surface, opposite the first surface, for frictionally engaging the support surface of the holding body. The heat transferring seal also has an inner peripheral portion defining an opening for receiving the gas. The heat transferring seal has a thermal conductivity closely matched with the first thermal conductivity of the gas for providing substantially uniform heat transfer across the substrate.
    • 提供了一种用于保持基板的组件。 基板具有与第一表面相对的第一表面,第二表面和外周边部分。 组件包括具有用于支撑衬底的支撑表面的保持体。 保持体具有用于使具有导热性的气体通过的孔。 另外,组件包括具有用于摩擦地接合衬底的第二表面的第一表面的传热密封件。 传热密封件具有与第一表面相对的第二表面,用于与保持体的支撑表面摩擦接合。 传热密封件还具有限定用于接收气体的开口的内周部分。 传热密封件具有与气体的第一热导率密切匹配的导热性,以提供穿过基底的基本上均匀的热传递。
    • 47. 发明授权
    • Series circuits and devices
    • 串联电路和器件
    • US08891264B1
    • 2014-11-18
    • US11940161
    • 2007-11-14
    • James Montague CleevesPatrick Smith
    • James Montague CleevesPatrick Smith
    • H02H7/125H02H7/127
    • G06K19/0701H01L27/0266Y02P80/30
    • Embodiments of the present invention relate to a rectifier circuit and methods of making the same for use in wireless devices (e.g., RFID tags). The present invention is drawn to a rectifier circuit comprising first and second diode-wired transistors in series, each having a gate oxide layers of the same target thickness. The first diode-wired transistor receives an alternating current and the second diode-wired transistor provides a rectifier output. The first and second diode-wired transistors are configured to divide between them a first voltage differential across the rectifier circuit. The gate oxides are exposed to a peak stress that is similar to a stress on the gate oxide of logic transistors made using the same process. The present invention is further drawn to a method of making a rectifier circuit, comprising printing a plurality of transistor bodies on a substrate, forming a gate oxide on each of the transistor bodies and a gate on each gate oxide, doping exposed portions of the transistor body to form first and second source/drain terminals therein, and forming interconnects electrically connecting the first source/drain terminals to the gate over the corresponding transistor body.
    • 本发明的实施例涉及一种整流电路及其制造方法,用于无线设备(例如RFID标签)。 本发明涉及一种包括串联的第一和第二二极管接线晶体管的整流电路,每个具有相同目标厚度的栅氧化层。 第一二极管接线晶体管接收交流电流,第二二极管接线晶体管提供整流器输出。 第一和第二二极管接线晶体管被配置为在它们之间划分整流器电路两端的第一电压差。 栅极氧化物暴露于与使用相同工艺制造的逻辑晶体管的栅极氧化物上的应力相似的峰值应力。 本发明进一步涉及一种制造整流器电路的方法,包括在衬底上印刷多个晶体管本体,在每个晶体管本体上形成栅极氧化物,并在每个栅极氧化物上形成栅极,掺杂晶体管的暴露部分 从而在其中形成第一和第二源极/漏极端子,以及形成将第一源极/漏极端子电连接到相应晶体管本体上的栅极的互连。