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    • 45. 发明授权
    • Method of making a semiconductor wafer imaging mask having uniform pattern features
    • 制造具有均匀图案特征的半导体晶片成像掩模的方法
    • US06599665B1
    • 2003-07-29
    • US09686099
    • 2000-10-10
    • Shy-Jay LinSheng-Chi Chin
    • Shy-Jay LinSheng-Chi Chin
    • G03F900
    • G03F1/78G03F1/36G03F1/80G03F7/30
    • A mask used to image circuit patterns onto a semiconductor wafer exhibits improved uniformity of critical feature dimensions. A pattern of dummy features is formed around the outer periphery of the main pattern during manufacture of the mask. The presence of the dummy field eliminates loading of the etch rate at the marginal areas of the main pattern, thereby assuring that all of the features in the main pattern field are etched at substantially the same rate. By using differing radiation dosages to expose the photoresist employed to form the main pattern and dummy patterns, a thickness of the photoresist remains over the dummy field pattern after development of the photoresist. This remaining photoresist has a thickness sufficient to prevent subsequent etching of the underlying metal which would otherwise leave features in the metal layer that would be imaged onto the wafer.
    • 用于将电路图案成像到半导体晶片上的掩模表现出改进的关键特征尺寸的均匀性。 在制造掩模期间,在主图案的外周围形成虚拟特征图案。 虚拟场的存在消除了在主图案的边缘区域处的蚀刻速率的加载,从而确保主图案场中的所有特征以基本相同的速率被蚀刻。 通过使用不同的辐射剂量来暴露用于形成主图案和虚设图案的光致抗蚀剂,在光致抗蚀剂显影之后,光致抗蚀剂的厚度保留在伪场图案上。 该剩余的光致抗蚀剂具有足以防止随后蚀刻下面的金属的厚度,否则将会残留在将被成像到晶片上的金属层中的特征。