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    • 42. 发明授权
    • Diffusion sidewall for a semiconductor structure
    • 用于半导体结构的扩散侧壁
    • US08105893B2
    • 2012-01-31
    • US12621216
    • 2009-11-18
    • Dechao GuoShu-Jen HanChung-Hsun LinNing Su
    • Dechao GuoShu-Jen HanChung-Hsun LinNing Su
    • H01L21/8238
    • H01L21/76224H01L21/76283H01L21/84H01L27/1203
    • A method of forming diffusion sidewalls in a semiconductor structure and a semiconductor structure having diffusion sidewalls includes etching a trench into a semiconductor substrate to form first and second active regions, lining each trench with an oxide liner along exposed sidewalls of an active silicon region (RX) of the first and second active regions, removing the oxide liner formed along the exposed sidewalls of the RX region of one of the first and second active regions, forming diffusion sidewalls by epitaxially growing in-situ doped material within the exposed sidewalls of the RX region of the one of the first and second active regions, and forming an isolation region within the trench between the first and second active regions to electrically isolate the first and second active regions from each other.
    • 在半导体结构中形成扩散侧壁的方法和具有扩散侧壁的半导体结构的方法包括将沟槽蚀刻到半导体衬底中以形成第一和第二有源区,沿着有源硅区(RX )去除沿着第一和第二有源区域之一的RX区域的暴露的侧壁形成的氧化物衬垫,通过在RX的暴露侧壁内外延生长原位掺杂材料来形成扩散侧壁 区域,并且在第一和第二有源区域之间的沟槽内形成隔离区域,以将第一和第二有源区域彼此电隔离。