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    • 44. 发明申请
    • Air purifier
    • 空气净化器
    • US20070000221A1
    • 2007-01-04
    • US11363205
    • 2006-02-28
    • Chan ParkYoung KimSun Oh
    • Chan ParkYoung KimSun Oh
    • B01D46/00
    • B01D46/10B01D46/0023B01D46/0075B01D2277/20
    • An air purifier designed to allow dust collected on a surface of a dust filter therein to be conveniently and rapidly removed from the dust filter without separating the dust filter from the air purifier unit. The air purifier includes a vibrating member equipped adjacent to the dust filter, and a vibration motor assembly equipped to the vibrating member to remove dust attached to the dust filter through vibratory motion. The dust filter is equipped at an angle within the housing for the air purifier such that an upper end of the dust filter is closer to a front side of the housing than a lower end of the dust filter. The air purifier may further include a tray equipped below the dust filter to collect the dust that drops from the dust filter when the dust filter is vibrated by vibration of the vibrating member. The tray has a rear plate extending towards the lower end of the dust filter to prevent the dust collected in the tray from being scattered and then reattached to the dust filter. One or more surfaces of the dust filter may be coated to prevent static electricity from accumulating thereon so as to easily remove the dust.
    • 一种空气净化器,其设计成可以将灰尘过滤器的表面上收集的灰尘从灰尘过滤器方便地快速地除去,而不会将灰尘过滤器与空气净化器单元分离。 空气净化器包括与防尘过滤器相邻配置的振动部件,以及振动电动机组件,其配置在振动部件上,以通过振动运动除去附着在尘埃过滤器上的灰尘。 防尘过滤器在空气净化器的壳体内成角度设置,使得防尘过滤器的上端比防尘过滤器的下端更靠近壳体的前侧。 空气净化器还可以包括设置在防尘过滤器下方的托盘,用于当通过振动构件的振动而使灰尘过滤器振动时收集从防尘过滤器滴落的灰尘。 托盘具有朝向防尘过滤器的下端延伸的后板,以防止收集在托盘中的灰尘散开,然后重新连接到除尘过滤器。 可以涂覆防尘过滤器的一个或多个表面以防止静电积聚在其上,以便容易地除去灰尘。
    • 48. 发明申请
    • Methods for forming isolation films
    • 形成隔离膜的方法
    • US20060205173A1
    • 2006-09-14
    • US11156998
    • 2005-06-20
    • Pil SongYoung KimSang Park
    • Pil SongYoung KimSang Park
    • H01L21/76
    • H01L21/76224
    • A method of forming an isolation film in a semiconductor device is disclosed. The disclosed method includes performing a patterning process on a predetermined region of a semiconductor substrate in which a patterned pad film is formed, forming a trench defining an inactive region and an active region, forming a liner film on the entire surface including the trench, forming an insulating film for trench burial only within the trench, stripping the remaining liner film formed except for the inside of the trench and the patterned pad film formed below the liner film, forming a sacrificial film on the entire surface, and performing a polishing process on the entire surface in which the sacrificial film is formed until the semiconductor substrate of the active region is exposed, thereby forming the isolation film having no topology difference with the semiconductor substrate of the active region.
    • 公开了一种在半导体器件中形成隔离膜的方法。 所公开的方法包括在其上形成图案化焊盘膜的半导体衬底的预定区域上执行图案化工艺,形成限定非活性区域和有源区域的沟槽,在包括沟槽的整个表面上形成衬垫膜,形成 用于仅在沟槽内进行沟槽埋置的绝缘膜,剥离除了沟槽内部形成的剩余衬垫膜和形成在衬垫膜下方的图案化衬垫膜,在整个表面上形成牺牲膜,并对 其中形成牺牲膜的整个表面直到有源区的半导体衬底被暴露,从而形成与有源区的半导体衬底没有拓扑结构差异的隔离膜。