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41. 发明专利

JP2006038640A Current detecting device and semiconductor module 有权
标题翻译：电流检测器件和半导体器件
公开(公告)号：JP2006038640A
公开(公告)日：2006-02-09
申请号：JP2004219068
申请日：2004-07-27
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： G01R15/20 , G01R19/00
摘要： PROBLEM TO BE SOLVED: To provide a current detecting device capable of raising an S/N ratio. SOLUTION: A positive electrode 78 and a U phase electrode 80 are made of metal material of copper or the like, and are provided in parallel up and down so as to interpose a semiconductor element section 72 and joints 74, 76 between. A current sensor 90 composed of a magnetic detection element is a coreless sensor, and is arranged in a region sandwiched between the positive electrode 78 and the electrode 80. The positive electrode 78 and the electrode 80 and a magnetic shielding material 92 shield magnetic noise from outside to the current sensor 90. The current sensor 90 detects high-density magnetic flux composed of magnetic flux from the positive electrode 78 and magnetic flux from the electrode 80 superposed on each other. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够提高S / N比的电流检测装置。解决方案：正极78和U相电极80由铜等的金属材料制成，并且上下并列设置，以将半导体元件部分72和接头74,76插入其间。由磁性检测元件构成的电流传感器90是无芯传感器，并且布置在夹在正电极78和电极80之间的区域中。正电极78和电极80以及磁屏蔽材料92屏蔽来自外部到电流传感器90.电流传感器90检测由来自正极78的磁通和由电极80叠加的磁通量组成的高密度磁通。版权所有（C）2006，JPO＆NCIPI

42. 发明专利

JP2004362851A Control of coolant pump 审中-公开
公开(公告)号：JP2004362851A
公开(公告)日：2004-12-24
申请号：JP2003157545
申请日：2003-06-03
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： H01M8/00 , H01M8/04
CPC分类号： Y02E60/50
摘要： PROBLEM TO BE SOLVED: To improve response accuracy of a coolant pump in a cooling system of a fuel cell at the time of lowered revolution.
SOLUTION: A control unit 30 starts regenerative braking against an electric motor part 232 in the case required output to the fuel cell 10 is lowered. The control unit 30 sets a target revolution of an electric motor type coolant pump 23 at the lowest revolution, and lowers the revolution of the electric motor part 232 through an inverter 24. As a result, a revolution speed of the electric motor part 232 driven by a coolant flowing in a coolant tube 21 exceeds an output frequency of the inverter 24, the electric motor part 232 functions as en electric generator, and a braking power is generated at the electric motor part 232. The control unit carries out an operation control of the electric motor part 232 at normal times, when the revolution of the electric motor part 232 reaches a predetermined revolution corresponding to the lowered required output.
COPYRIGHT: (C)2005,JPO&NCIPI

43. 发明专利

JP2013148289A Flat heat pipe 审中-公开
标题翻译：平热管
公开(公告)号：JP2013148289A
公开(公告)日：2013-08-01
申请号：JP2012009836
申请日：2012-01-20
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： F28D15/02
摘要： PROBLEM TO BE SOLVED: To suppress a flat surface to which a heat-generating body is mounted, from being expanded and curved due to an increase in internal pressure in a flat heat pipe.SOLUTION: A flat heat pipe 2 includes: a pair of flat plates (top plate 3 and bottom plate 4) in which a surface of one of the flat plates is formed into a mounting surface for a heat-generating body; a side plate 5 that surrounds peripheries of the pair of flat plates facing each other and defines a closed space therein; and an elastic body 7 for coupling the pair of flat plates to each other in the closed space 6. In the heat pipe 2, the side plate 5 is expanded and contracted so as to allow a variation in distance between the pair of flat plates. The side plate 5 typically has a bellows structure. When an internal pressure is increased in the heat pipe 2, the bellows structure of the side plate allows the distance between the pair of flat plates to be extended while the pair of flat plates are supported by the elastic body 7, thus the heat pipe 2 can suppress center parts of the plat plates from being curved.
摘要翻译：要解决的问题：为了抑制发热体的平坦表面，由于平坦的热管中的内部压力的增加而不会膨胀和弯曲。解决方案：扁平的热管2包括：一对平板（顶板3和底板4），其中一个平板的表面形成为发热体的安装表面; 侧板5，其围绕所述一对平板的彼此面对并在其中限定封闭空间的周边; 以及用于在封闭空间6中将一对平板彼此连接的弹性体7.在热管2中，侧板5膨胀收缩以允许一对平板之间的距离变化。侧板5通常具有波纹管结构。当热管2内部压力增大时，侧板的波纹管结构允许一对平板之间的距离延伸，而一对平板由弹性体7支撑，因此热管2 可以抑制平板的中心部分弯曲。

44. 发明专利

JP2013044459A Flat heat pipe 有权
标题翻译：平热管
公开(公告)号：JP2013044459A
公开(公告)日：2013-03-04
申请号：JP2011181399
申请日：2011-08-23
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： F28D15/02 , H01L23/427 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a flat heat pipe suitable for cooling a semiconductor chip.SOLUTION: The heat pipe 10 includes a strut 12 for connecting an upper plate 2 and a lower plate 6 of the heat pipe in the heat pipe. The strut 12 is provided in a position not overlapped with the attached semiconductor chip 26 in a planar view of the heat pipe 10. A plurality of the struts 12 may be provided. The strut 12 is arranged away from a position directly below the semiconductor chip 26, and thereby, a working fluid freely moves immediately below the semiconductor chip. The strut 12 does not disturb the cooling of the semiconductor chip, and cooling efficiency is not impaired.
摘要翻译：要解决的问题：提供适于冷却半导体芯片的扁平热管。解决方案：热管10包括用于连接热管中的热管的上板2和下板6的支柱12。在热管10的平面图中，支柱12设置在与附接的半导体芯片26不重叠的位置。可以设置多个支柱12。支柱12布置成远离半导体芯片26正下方的位置，从而工作流体在半导体芯片的正下方自由移动。支柱12不会干扰半导体芯片的冷却，并且不会损害冷却效率。版权所有（C）2013，JPO＆INPIT

45. 发明专利

JP2013016589A Boil cooling device, and cooling system for vehicle using boil cooling device 审中-公开
标题翻译：锅炉冷却装置和使用锅炉冷却装置的车辆的冷却系统
公开(公告)号：JP2013016589A
公开(公告)日：2013-01-24
申请号：JP2011147508
申请日：2011-07-01
申请人： Toyota Motor Corp , トヨタ自動車株式会社 , Kyushu Univ , 国立大学法人九州大学 , Tokyo Univ Of Science , 学校法人東京理科大学 , Hyogo Prefecture , 兵庫県
发明人： FURUTA NORIBUMI , HAKAMATA NORIHIDE , OTA HARUHIKO , NIIMOTO YASUHISA , ABE NOBUYUKI , SUZUKI KOICHI , YUKI KAZUHISA , KAWANAMI OSAMU
IPC分类号： H01L23/427
摘要： PROBLEM TO BE SOLVED: To provide a passage structure suitable for evaporating a refrigerant in a boil cooling device.SOLUTION: A boil cooling device 10 comprises: an evaporator part 32 for boiling a refrigerant by heat of an inverter 8 that is a heating element at a pipeline part 30 of a housing 12; and a circulation part 34 provided adjacent to the evaporator part 32 at the pipeline part 30 and circulating the refrigerant from a flow inlet 14 directly to a flow outlet 16. The evaporator part 32 is provided with a plurality of fins 40 projecting from a bottom wall 20 toward the circulation part 34, and the refrigerant is circulated in a gap between the fins 40. A flow velocity v of the refrigerant at the evaporator part 32 is lower than a flow velocity V of the refrigerant at the circulation part 34. A relationship between a height position of the flow inlet 14 and a height position of the flow outlet 16 in a Z-direction can be changed appropriately.
摘要翻译：要解决的问题：提供适于蒸发煮沸冷却装置中的制冷剂的通道结构。沸腾冷却装置10包括：蒸发器部分32，用于通过在壳体12的管道部分30处的加热元件的逆变器8的热量来使制冷剂沸腾; 以及在管道部分30处邻近蒸发器部分32设置的循环部分34，并且将制冷剂从流动入口14直接循环到流出口16.蒸发器部分32设置有从底壁突出的多个翅片40 20朝向循环部34，并且制冷剂在翅片40之间的间隙中循环。蒸发器部32处的制冷剂的流速v低于循环部34处的制冷剂的流速V.关系可以适当地改变流入口14的高度位置与流出口16在Z方向上的高度位置之间的位置。版权所有（C）2013，JPO＆INPIT

46. 发明专利

JP2006337054A Current-measuring device 审中-公开
标题翻译：电流测量装置
公开(公告)号：JP2006337054A
公开(公告)日：2006-12-14
申请号：JP2005158994
申请日：2005-05-31
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： G01R19/00 , H02M7/537
摘要： PROBLEM TO BE SOLVED: To provide a small and lightweight current measuring device that has an insulated structure and hence will not require insulation in the signal path of a measurement result output with respect to measured current. SOLUTION: The current-measuring device comprises a converting device for converting shunt current into a voltage, an electrostrictive strain element 126 where strain is generated by the voltage converted from the shunt current by the converting device, a strain-detecting device 130 for detecting strain, and a holding section 132 for holding a conversion table for converting the strain amount detected by the strain-detecting device into the measured current. The conversion device includes a resistance element 122, of which one end is connected to a flowing path of the measured current and a capacitor 124 connected between the other end of the resistance element and the electrostrictive strain element. In the electrostrictive strain element 126, when voltage is applied between electrodes, strain or displacement occurs due to the electric field from this. The strain-detecting device 130 is adhered to the electrostrictive strain element 126. The holding section 132 holds a voltage-current conversion map, showing the correlation between the voltage outputted from the strain detecting device 130 and the measured current IW flowing between an inverter and a motor. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有绝缘结构的小而轻的电流测量装置，因此在测量结果输出的信号路径中不需要相对于测量电流的绝缘。电流测量装置包括用于将分流电流转换成电压的转换装置，通过由转换装置从分流电流转换的电压产生应变的电致伸缩应变元件126，应变检测装置130 以及保持部132，用于保持用于将由应变检测装置检测出的应变量转换为测定电流的转换表。转换装置包括电阻元件122，其一端连接到测量电流的流动路径，以及连接在电阻元件的另一端和电致伸缩应变元件之间的电容器124。在电致伸缩应变元件126中，当在电极之间施加电压时，由于来自其的电场而发生应变或位移。应变检测装置130粘接到电致伸缩应变元件126上。保持部132保持电压 - 电流转换图，示出了从应变检测装置130输出的电压与在逆变器和逆变器之间流动的测量电流IW之间的相关性一个电机版权所有（C）2007，JPO＆INPIT

47. 发明专利

JP2006303455A Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：JP2006303455A
公开(公告)日：2006-11-02
申请号：JP2006069326
申请日：2006-03-14
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L25/162 , H01C3/06 , H01L23/473 , H01L24/33 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a power semiconductor module that cools a capacitor and a power transistor device satisfactorily and reduces a surge voltage. SOLUTION: The electrodes of a power semiconductor device 52 and a capacitor 46 are connected within a power semiconductor module. The power semiconductor device 52 is formed on a semiconductor substrate with primary and secondary principal surface. The power semiconductor module 11A comprises an electrode 48 where the primary principal surface is connected and the main current flows, an electrode 60 where the secondary principal surface is connected and the main current flows, a semiconductor substrate, a capacitor 46, and a resin 70 sealing the electrodes 48 and 60. The capacitor includes the electrodes 42 and 44. The electrodes 48 and 42 are connected by a solder 62 so that their surfaces exposed from the seal can be placed on the same contiguous plane where radiators can be mounted. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供令人满意地冷却电容器和功率晶体管器件并降低浪涌电压的功率半导体模块。解决方案：功率半导体器件52和电容器46的电极连接在功率半导体模块内。功率半导体器件52形成在具有初级和次级主表面的半导体衬底上。功率半导体模块11A包括主要主表面连接并且主电流流动的电极48，连接二次主表面并且主电流流动的电极60，半导体衬底，电容器46和树脂70 密封电极48和60.电容器包括电极42和44.电极48和42通过焊料62连接，使得它们从密封件露出的表面可以放置在可安装散热器的相同的邻接平面上。版权所有（C）2007，JPO＆INPIT

48. 发明专利

JP2006264473A Cooling system and hybrid vehicle 有权
标题翻译：冷却系统和混合动力车辆
公开(公告)号：JP2006264473A
公开(公告)日：2006-10-05
申请号：JP2005084332
申请日：2005-03-23
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： B60K11/04 , B60K6/22 , B60K6/445 , B60K11/02 , B60L11/14 , F01P3/12 , F01P11/10 , F25B21/02 , H01L35/30
CPC分类号： Y02T10/6239 , Y02T10/7077 , Y02T10/7241
摘要： PROBLEM TO BE SOLVED: To provide a cooling system capable of using engine cooling water for cooling a power converter. SOLUTION: An inverter device 110 is composed of: a power converter section including a boosting converter 32 and inverters 34, 36, a cooling device 210 and a radiator. The radiator 220 is disposed on the top of an inverter case and is formed integrally with the inverter case. The radiator 220 cools engine cooling water supplied from a refrigerant path 142 and supplies the cooled engine cooling water to the cooling device 210 through a refrigerant path 234. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够使用发动机冷却水来冷却功率转换器的冷却系统。解决方案：逆变器装置110包括：功率转换器部分，包括升压转换器32和反相器34,36，冷却装置210和散热器。散热器220设置在逆变器壳体的顶部并与逆变器壳体一体形成。散热器220冷却从制冷剂路径142供给的发动机冷却水，并通过制冷剂路径234将冷却后的发动机冷却水供给到冷却装置210.权利要求：（C）2007，JPO＆INPIT

49. 发明专利

JP2006229180A Semiconductor module and device 审中-公开
标题翻译：半导体模块和器件
公开(公告)号：JP2006229180A
公开(公告)日：2006-08-31
申请号：JP2005189526
申请日：2005-06-29
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： H01L23/433 , H01L23/367 , H01L25/072 , H01L2224/32245 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module whose power elements are uniformly cooled down, and also provide semiconductor device. SOLUTION: Electrode plates 52 and 54, which function as a heat sink, are arranged such that they shut in a power transistor Q1 and a diode D1 from both sides. The surface(s) of the electrode(s) 52 (and 54) facing a cooling body 62 (and 64) is formed such that in places where they face the power transistor Q1 and diode D1, the thickness of their part facing the approximately central part of the power transistor Q1 or the diode D1 is thinner than those of their parts facing the peripheral parts. In addition, the cooling bodies 62 and 64 are disposed such that they shut the electrode plates 52 and 54 in from both sides, respectively, in accordance with their profiles. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供其功率元件被均匀冷却的半导体模块，并且还提供半导体器件。解决方案：用作散热器的电极板52和54被布置成使得它们从两侧关闭功率晶体管Q1和二极管D1。形成面向冷却体62（和64）的电极52（和54）的表面，使得在它们面对功率晶体管Q1和二极管D1的地方，其部分的厚度面向大致功率晶体管Q1或二极管D1的中心部分比面向周边部分的部分薄。此外，冷却体62和64设置成使得它们分别根据它们的轮廓从两侧分别关闭电极板52和54。版权所有（C）2006，JPO＆NCIPI

50. 发明专利

JP2006128260A Semiconductor device and semiconductor device having cooler 有权
标题翻译：具有冷却器的半导体器件和半导体器件
公开(公告)号：JP2006128260A
公开(公告)日：2006-05-18
申请号：JP2004312150
申请日：2004-10-27
申请人： Toyota Motor Corp , トヨタ自動車株式会社
发明人： FURUTA NORIBUMI
IPC分类号： H01L23/48 , H01L23/29 , H01L23/31
CPC分类号： H01L24/73 , H01L2224/32245 , H01L2224/33181 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having improved heat radiation and reliability, and to provide a semiconductor device having a cooler. SOLUTION: The semiconductor device 1 includes a silicon chip 22, electrodes 24, 26 electrically connected to both main surfaces of the silicon chip 22 by solder layers 30, 32; and an electrode 28 connected to a gate electrode by a wire 42. Further, the semiconductor device 1 contains an inorganic hard film 40 that covers heat radiation surfaces of the electrodes 24, 26 and the outer surface of a resin section 36 and has electric insulating properties and moisture blocking capability. The inorganic hard film 40 ensures insulating properties between a microchannel cooler made of metal and the electrodes 24, 26, thus achieving the compact semiconductor device having excellent heat radiation efficiency. The semiconductor device 1 can be directly dipped into cooling water for cooling. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有改善的散热和可靠性的半导体器件，并提供具有冷却器的半导体器件。解决方案：半导体器件1包括硅芯片22，通过焊料层30,32与硅芯片22的两个主表面电连接的电极24,26; 以及通过线42与栅电极连接的电极28.此外，半导体器件1包含覆盖电极24,26的热辐射表面和树脂部36的外表面的无机硬质膜40，并且具有电绝缘性能和防潮能力。无机硬质膜40确保由金属制成的微通道冷却器和电极24,26之间的绝缘性，从而实现了具有优异散热效率的紧凑型半导体器件。半导体器件1可以直接浸入冷却水中进行冷却。版权所有（C）2006，JPO＆NCIPI

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